Patent application number | Description | Published |
20090298237 | SEMICONDUCTOR MODULE - A semiconductor module includes a semiconductor chip sealed with an encapsulation resin prevented from overflowing from an inside of the outer edge by a wiring pattern extended portion extending from the wiring pattern along an outer edge of a solder resist pattern at an outside of the outer edge of the solder resist pattern. | 12-03-2009 |
20100155869 | METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE AND SOLID-STATE IMAGE PICKUP DEVICE - A method includes preparing a cover member; preparing an image pickup element including a substrate including a pixel region including a plurality of photo detectors on a principal surface, a first concavo-convex portion including a plurality of first convex portions configured to concentrate light on the plurality of photo detectors, the first convex portions each having a lens shape, and a second concavo-convex portion surrounding the first concavo-convex portion, the second concavo-convex portion including a plurality of second convex portions; and fixing the cover member to a region of the image pickup element using a fixing member, the region being between the first concavo-convex portion and the second concavo-convex portion. | 06-24-2010 |
20100309354 | SOLID-STATE IMAGE PICKUP DEVICE - A cover member fixed to a pickup element has a non-vertical surface and an upright surface and satisfies H | 12-09-2010 |
20120044415 | IMAGE PICKUP MODULE AND CAMERA - An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area. | 02-23-2012 |
20120212637 | SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING SAME, AND CAMERA - A solid-state imaging apparatus, comprising: a semiconductor chip having a principal face including a pixel region; a protruding portion disposed on the principal face to surround the pixel region; a cover member disposed over the pixel region; and an adhesive material surrounding the pixel region and bonding the cover member and the protruding portion, is provided. The protruding portion has top and first side faces facing the space, a first edge line being formed by this two faces. The adhesive material bonds the top face of the protruding portion and the cover member. The adhesive material has a first face facing the interior space, and the first face extends from the first edge line toward the cover member. Perimeters of the interior space, in planes parallel to the principal face become shorter in a direction from the top face of the protruding portion toward the cover member. | 08-23-2012 |
20130083493 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING THE SAME - An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50% is 0.5 μm or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 μm or less. | 04-04-2013 |
20130286565 | ELECTRONIC COMPONENT, ELECTRONIC MODULE, THEIR MANUFACTURING METHODS, MOUNTING MEMBER, AND ELECTRONIC APPARATUS - A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition α | 10-31-2013 |
20130286566 | ELECTRONIC COMPONENT, MOUNTING MEMBER, ELECTRONIC APPARATUS, AND THEIR MANUFACTURING METHODS - A base body includes a fiducial stage part provided with an inner terminal group, and an upper stage part located at a side of an outer edge of a package with respect to the fiducial stage part and protruding with respect to the fiducial stage part through a step part. A frame body is bonded to the upper stage part, and an inner edge of the frame body is located at the side of the outer edge of the package with respect to the step part. | 10-31-2013 |
20130286592 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body. | 10-31-2013 |
20140240588 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A ferromagnetic body is provided at a front-surface side of a reference plane and located outside a region that overlaps an electronic device in a direction perpendicular to the reference plane, and a conductor is provided at a back-surface side of the reference plane and that overlaps the electronic device in the direction perpendicular to the reference plane. | 08-28-2014 |