Patent application number | Description | Published |
20120008304 | LIGHT EMITTING APPARATUS - A light emitting apparatus including a circuit board ( | 01-12-2012 |
20120037927 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate ( | 02-16-2012 |
20120112221 | LED PACKAGE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - The LED package structure of the invention includes a substrate ( | 05-10-2012 |
20130044484 | ILLUMINATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements. | 02-21-2013 |
20130119411 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes a substrate, LED bare chips and a lens. The substrate has an upper surface, a lower surface and a side surface between the upper surface and the lower surface. The upper surface is provided with a circuit pattern. The side surface is provided with a groove. The LED bare chips are fixed on the upper surface and electrically connected with the circuit pattern. The lens covers the LED bare chips, the upper surface and the circuit pattern by an injection molding process so as to be inserted into the groove. With this arrangement, the connecting strength between the substrate and the lens can be enhanced, thereby achieving waterproof and anti-electrostatic effects. Further, material cost of the present invention is reduced greatly. | 05-16-2013 |
20130264735 | MOLD-MAKING METHOD CAPABLE OF SHORTENING A PROCEDURE OF MANUFACTURING A PRODUCT MOLD - The present invention provides a mold-making method capable of shortening a procedure of manufacturing a product mold, including steps of: preparing a plastic original mold; processing the original mold to form a preliminary product; assembling the preliminary product and testing the functions of the preliminary product having the original mold; producing a standard mold after testing the functions of the preliminary product; and producing a final mold having a profile and a dimension corresponding to those of the standard mold. By this method, the procedure of developing a mold is shortened, so that the production cost of a mold can be reduced. | 10-10-2013 |
20140098537 | ILLUMINATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an illuminating device includes steps of: forming an electrical conductive circuit on a metallic substrate, arranging light-emitting elements on the metallic substrate to be electrically connected with the electrical conductive circuit, covering a transparent cap on each of the light-emitting elements, fixing an electrical connector to the metallic substrate to be electrically connected to the electrical conductive circuit, forming a transparent body outside the transparent caps, the metallic substrate and the electrical conductive circuit by means of an over-molding process; forming a lamp cover outside the transparent body, the metallic substrate and the electrical connector by means of an over-molding process. An illuminating device is further provided, thereby prevents the light-emitting elements from suffering damage due to the temperature and pressure of the over-molding process, and increasing the brightness of the light emitted by the light-emitting elements. | 04-10-2014 |
20140153277 | ASSEMBLING STRUCTURE FOR LED LAMP MODULE - An assembling structure of an LED lamp module includes an LED lamp base ( | 06-05-2014 |