Patent application number | Description | Published |
20130109566 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO | 05-02-2013 |
20130288893 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): | 10-31-2013 |
20130291227 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): | 10-31-2013 |
20140213448 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): and processes related thereto. | 07-31-2014 |
20150072859 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): | 03-12-2015 |
20150111731 | PESTICIDAL COMPOSITIONS AND RELATED METHODS - A pesticidal composition comprises one or more of the following compounds: 3-(thiazol-2-yl)pyridine 1-oxide compound of formula I or II, or N-(4-chloro-2-(pyridin-3-yl)thiazol-5-yl)-3-(methylthio)propanamide compound (C3), or any agriculturally acceptable salt thereof, wherein R | 04-23-2015 |
20150111732 | PESTICIDAL COMPOSITIONS AND RELATED METHODS - A pesticidal composition comprises a 3-(1H-pyrazol)pyridine compound of formula I or any agriculturally acceptable salt thereof, wherein R | 04-23-2015 |
20150111733 | PESTICIDAL COMPOSITIONS AND RELATED METHODS - A pesticidal composition comprises at least one compound selected from a 1-(3-pyridyl-N-oxide)pyrazole compound of formula I, II, or III, or any agriculturally acceptable salt thereof, wherein R | 04-23-2015 |
20150111734 | PESTICIDAL COMPOSITIONS AND RELATED METHODS - A pesticidal composition comprises at least one compounds selected from a compound of formula, or any agriculturally acceptable salt thereof, wherein R | 04-23-2015 |
20160060245 | PESTICIDAL COMPOSITIONS AND PROCESSES RELATED THERETO - This document discloses molecules having the following formula (“Formula One”): | 03-03-2016 |
Patent application number | Description | Published |
20090133254 | Components with posts and pads - A packaged microelectronic element includes connection component incorporating a dielectric layer ( | 05-28-2009 |
20100009554 | Microelectronic interconnect element with decreased conductor spacing - A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines. | 01-14-2010 |
20100258956 | MICROELECTRONIC PACKAGES AND METHODS THEREFOR - A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package. | 10-14-2010 |
20110260320 | METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS - A packaged microelectronic element includes connection component incorporating a dielectric layer ( | 10-27-2011 |
20110269272 | MICROELECTRONIC PACKAGES AND METHODS THEREFOR - A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package. | 11-03-2011 |
20130341299 | Method of Making a Microelectronic Interconnect Element With Decreased Conductor Spacing - A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines. | 12-26-2013 |
20140145329 | FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF - A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region. | 05-29-2014 |
20140262460 | Connection Component with Posts and Pads - A packaged microelectronic element includes connection component incorporating a dielectric layer ( | 09-18-2014 |
20150087146 | MICROELECTRONIC INTERCONNECT ELEMENT WITH DECREASED CONDUCTOR SPACING - A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines. | 03-26-2015 |
Patent application number | Description | Published |
20100201646 | E-INK TOUCHSCREEN VISUALIZER FOR HOME AV SYSTEM - An interface apparatus includes a main unit, an array of interface modules, driver circuitry, and a remote unit. The main unit outputs files to an output unit, is detachably couplable to interface modules and assigns content identifiers to interface modules. The array presents an image to the user and each interface module can be engaged by a user. The driver circuitry is adapted to drive the array to present an image to the user based upon the user's engagement with an interface module. The remote unit is coupled to the output unit and can be detachably coupled to the interface module. When coupled to the interface module, the remote unit can access the assigned identifier and transmit a request signal to the main unit based on the identifier. The request signal is adapted to cause the main unit to output a file identified by the identifier to the output unit. | 08-12-2010 |
20120044061 | REMOTE CONTROL SYSTEM - The present embodiments provide systems and methods for use in remote controlling devices including consumer electronic devices. Some embodiments provide a remote control system that comprises a processor, a touch screen display coupled with and receiving display control signals from the display driver such that the touch screen display displays one of a plurality of control views with a fixed number of function buttons displayed in each of the plurality of control views, and a wireless transmitter coupled with the processor that wirelessly transmits function signals in response to a detection of a selection of one of the function buttons. | 02-23-2012 |
20130076711 | E-INK TOUCHSCREEN VISUALIZER FOR HOME AV SYSTEM - An interface apparatus includes a main unit, an array of interface modules, driver circuitry, and a remote unit. The main unit outputs files to an output unit, is detachably couplable to interface modules and assigns content identifiers to interface modules. The array presents an image to the user and each interface module can be engaged by a user. The driver circuitry is adapted to drive the array to present an image to the user based upon the user's engagement with an interface module. The remote unit is coupled to the output unit and can be detachably coupled to the interface module. Each interface module in the array of interfaces is adapted to be detached from the main unit and retain the image it was previously driven by the driver circuitry to present. | 03-28-2013 |
Patent application number | Description | Published |
20120194942 | THIN FILM STRUCTURE WITH CONTROLLED LATERAL THERMAL SPREADING IN THE THIN FILM - An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer. | 08-02-2012 |
20130266740 | Thermal Retention Structure for a Data Device - A data device may have at least a magnetic lamination with a thermal retention structure deposited on a substrate and configured to maintain a predetermined temperature for a predetermined amount of time. Such predetermined temperature and amount of time may allow for the growth of a magnetic layer with a predetermined magnetic anisotropy. | 10-10-2013 |
20130288079 | Data Media With Tuned Thermal Conductivity and Magnetic Permeability - Various magnetic slack embodiments may be constructed with a soft magnetic underlayer (SUL) having a first thickness disposed between a substrate and a magnetic recording layer. A heatsink may have a second thickness and be disposed between the SUL and the magnetic recording layer. The first and second thicknesses may each be tuned to provide predetermined thermal conductivity and magnetic permeability throughout the data media. | 10-31-2013 |
20140043947 | Thin Film Structure with Controlled Lateral Thermal Spreading in the Thin Film - An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer. | 02-13-2014 |
20150093598 | MAGNETIC STACK INCLUDING MgO-Ti(ON) INTERLAYER - A stack includes a substrate and a magnetic recording layer. Disposed between the substrate and magnetic recording layer is an MgO—Ti(ON) layer. | 04-02-2015 |
20150154995 | METHOD FOR FABRICATING A PATTERNED COMPOSITE STRUCTURE - Provided herein is an apparatus comprising a substrate; a continuous layer over the substrate comprising a first heat sink layer; and a plurality of features over the continuous layer comprising a second heat sink layer, a first magnetic layer over the second heat sink layer, and a second magnetic layer, wherein the first and second magnetic layers are configured to provide a temperature-dependent, exchange spring mechanism. | 06-04-2015 |
20160064022 | Low Power Thermally Assisted Data Recording Media - In some embodiments, a thermally assisted data recording medium has a recording layer formed of iron (Fe), platinum (Pt) and a transition metal T selected from a group consisting of Rhodium (Rh), Ruthenium (Ru), Osmium (Os) and Iridium (Ir) to substitute for a portion of the Pt content as Fe | 03-03-2016 |
20160099016 | MAGNETIC STACK INCLUDING MgO-Ti(ON) INTERLAYER - A stack includes a substrate and a magnetic recording layer. Disposed between the substrate and magnetic recording layer is an MgO—Ti(ON) layer. | 04-07-2016 |
Patent application number | Description | Published |
20150013946 | METHOD FOR FABRICATING PATTERNED GRADIENT HEAT SINKS - The embodiments disclose at least one predetermined patterned layer configured to eliminate a physical path of lateral thermal bloom in a recording device, at least one gradient layer coupled to the patterned layer and configured to use materials with predetermined thermal conductivity for controlling a rate of dissipation and a path coupled to the gradient layer and configured to create a path of least thermal conduction resistance for directing dissipation along the path, wherein the path substantially regulates and prevents lateral thermal bloom. | 01-15-2015 |
20150016237 | METHOD FOR FABRICATING A PATTERNED COMPOSITE STRUCTURE - The embodiments disclose a patterned composite magnetic layer structure configured to use magnetic materials having differing temperature and magnetization characteristics in a recording device, wherein the patterned composite magnetic layer structure includes magnetic layers, at least one first magnetic material configured to be used in a particular order to reduce a recording temperature and configured to control and regulate coupling and decoupling of the magnetic layers and at least one second magnetic material with differing temperature characteristics is configured to control recording and erasing of data. | 01-15-2015 |
20150016774 | METHOD FOR REGULATING PATTERNED PLASMONIC UNDERLAYER - The embodiments disclose a stack feature of a stack configured to confine optical fields within and to a patterned plasmonic underlayer in the stack configured to guide light from a light source to regulate optical coupling. | 01-15-2015 |
20150017482 | METHOD FOR FABRICATING PLASMONIC CLADDING - The embodiments disclose a plasmonic cladding structure including at least one conformal plasmonic cladding structure wrapped around plural stack features of a recording device, wherein the conformal plasmonic cladding structure is configured to create a near-field transducer in close proximity to a recording head of the recording device, at least one conformal plasmonic cladding structure with substantially removed top surfaces of the stack features with exposed magnetic layer materials and a thermally insulating filler configured to be located between the stack features. | 01-15-2015 |