Patent application number | Description | Published |
20150061949 | BROADBAND ANTENNA WITH ADJUSTABLE RESONANT FREQUENCY BAND - A broadband antenna with adjustable resonant frequency band includes a grounding element, first and second radiating conductors, and a variable capacitor. The first radiating conductor includes a feed-in portion and a radiating portion. The feed-in portion includes a feed-in end spaced apart from and adjacent to the grounding element. The second radiating conductor includes a coupling portion, and a short-circuit portion connected electrically between the coupling portion and the grounding element. The coupling portion is parallel to and couples with the radiating portion. The variable capacitor is connected electrically between the radiating portion and the coupling portion. | 03-05-2015 |
20150061962 | ANTENNA MODULE - An antenna module includes a grounding element, first and second radiating conductors, and a decoupling unit. The grounding element has first and second grounding ends. The first radiating conductor includes a first feed-in end that is adjacent spacedly to the first grounding end and that is configured to be fed with a first RF signal. The second radiating conductor includes a second feed-in end that is adjacent spacedly to the second grounding end and that is configured to be fed with a second RF signal. The decoupling unit is connected electrically between a portion of the first radiating conductor and a portion of the second radiating conductor that are proximate to each other, and is one of a decoupling capacitor and a decoupling inductor. | 03-05-2015 |
20150295312 | WIDEBAND ANTENNA MODULE - A wideband antenna module includes a ground conductor, two radiating conductors and a decoupling inductor. Each of the radiating conductors includes a feed-in portion, a ground portion and three radiating portions. The feed-in portion is spaced apart from the ground conductor and has a feed-in end part. The ground portion is connected to the feed-in portion and the ground conductor. For each of the radiating conductors, the radiating portions are arranged in sequence from the feed-in portion to a free end part. The decoupling inductor is connected between the free end parts of the two radiating conductors. | 10-15-2015 |
20150303969 | MOBILE COMMUNICATION DEVICE - A mobile communication device includes a case member, a circuit module and a radiating arm. The case member includes first and second case portions, each made of a metallic material. One of the first and second case portions has a feed-in portion configured to be fed with a radio frequency signal. One of the first and second case portions has a ground portion. The circuit module includes a radio frequency circuit and a ground conductor. The radio frequency circuit is coupled with the feed-in portion and is con figured to generate the radio frequency signal. The ground conductor is coupled to the ground portion and the first case portion. The radiating arm is coupled to the second case portion. | 10-22-2015 |
Patent application number | Description | Published |
20090033551 | RECEIVING DEVICE FOR GLOBAL POSITIONING SYSTEM AND ANTENNA STRUCTURE THEREOF - A receiving device for a global positioning system and an antenna structure thereof. The receiving device includes a housing, a circuit board and the antenna structure. The circuit board is disposed inside the housing and has a ground portion and a signal feeding portion. The antenna structure is disposed inside the housing and includes a metal plate, a first electric conducting element and a second electric conducting element. The metal plate is used for receiving a GPS signal. The first electric conducting element has one end coupled to the metal plate, and the other end coupled to the ground portion of the circuit board. The second electric conducting element for feeding the GPS signal to the circuit board has one end coupled to the metal plate, and the other end coupled to the signal feeding portion of the circuit board. | 02-05-2009 |
20090167615 | ELECTRONIC APPARATUS WITH HIDDEN ANTENNA - An electronic apparatus with a hidden antenna comprises a metal frame and a substrate. The metal frame comprises a plurality of side walls and a notch is passed through at least one side wall. A feeding terminal is configured at a bottom side of the notch. A first shorting terminal and a second shorting terminal are configured at two lateral sides of the notch. A metal surface of the substrate is electrically connected to the first shorting terminal, the second shorting terminal and the side walls, and the notch is faced to the substrate. The metal frame receives or transmits an electromagnetic signal, and delivers the electromagnetic signal over the feeding terminal, and a length of the bottom side of the notch is one half of a wavelength of the electromagnetic signal. | 07-02-2009 |
20100141535 | MOBILE ELECTRONIC DEVICE - A mobile electronic device including an appearance, a first antenna and a metal part is provided. The appearance is used to accommodate a substrate. The first antenna is disposed on the substrate, and the metal part is disposed on an external surface of the appearance. During overall operation, the mobile electronic device receives or transmits signals through a first bandwidth radio frequency band by the first antenna and the metal part. | 06-10-2010 |
20100302108 | MOBILE COMMUNICATION DEVICE - A mobile communication device including a first appearance and an antenna is provided. An upper surface of the first appearance is bent a first angle from a border between a display area and a non-display area toward a display direction, and a lower surface of the first appearance is bent a second angle from a bending point toward the display direction, wherein the bending point of the lower surface is corresponding to the display area of the upper surface. The antenna is disposed in the mobile communication device and corresponding to the non-display area of the first appearance. The antenna transmits and receives signals processed by the mobile communication device. | 12-02-2010 |
20110037662 | HANDHELD DEVICE - A handheld device includes an antenna area and an outer frame, wherein the outer frame includes a frame body and a carrier. The antenna area is for transmitting a radio frequency signal with a first wavelength and has a ground part and a feeding part. In addition, the ground part within the antenna area is electrically connected to a ground plane. The frame body of the outer frame has an extended area corresponding to the antenna area to form a projected feeding point. The carrier of the outer frame is disposed at the peripheral area of the opening of the frame body, wherein the peripheral area of the frame body has a first ground point electrically connected to the ground plane, and the spacing between the first ground point and the projected feeding point is correlated to the first wavelength. | 02-17-2011 |
Patent application number | Description | Published |
20130230941 | Implanting Method for Forming Photodiode - An implanting method for forming a photodiode comprises providing a substrate with a first conductivity, growing an epitaxial layer on the substrate, implanting ions with a second conductivity in the epitaxial layer from a front side of the substrate and implanting ions with the first conductivity in the epitaxial layer from the front side of the substrate to form a photo active region adjacent to the front side and a photo inactive region underneath the photo active region. By employing the implanting method, an average doping density of the photo active region is approximately ten times more than an average doping density of the photo inactive region. | 09-05-2013 |
20130249040 | Structures for Grounding Metal Shields in Backside Illumination Image Sensor Chips - A device includes a semiconductor substrate having a front side and a backside. A photo-sensitive device is disposed on the front side of the semiconductor substrate. A dielectric layer is disposed on the backside of the semiconductor substrate, wherein the dielectric layer is over a back surface of the semiconductor substrate. A metal shield is over the dielectric layer and overlapping the photo-sensitive device. A metal plug penetrates through the dielectric layer, wherein the metal plug electrically couples the metal shield to the semiconductor substrate. | 09-26-2013 |
20140070352 | Stress Release Layout and Associated Methods and Devices - An embodiment semiconductor device includes a substrate such as a silicon or silicon-containing film, a pixel array supported by the substrate, and a metal stress release feature arranged around a periphery of the pixel array. The metal stress release feature may be formed from metal strips or discrete metal elements. The metal stress release feature may be arranged in a stress release pattern that uses a single line or a plurality of lines. The metal stress release pattern may also use metal corner elements at ends of the lines. | 03-13-2014 |
20140263944 | Light Sensing Device with Outgassing Hole - A light sensing device includes a substrate, a light sensing area on the substrate, and a light shielding layer over the substrate. The light shielding layer does not cover the light sensing area. At least one outgassing hole is formed through the light shielding layer. | 09-18-2014 |
20150021728 | Dielectric Structure for Color Filter Array - An integrated circuit device in which an array of photodiodes are formed at the surface of a semiconductor substrate. A dielectric structure comprising multiple layers of dielectric is formed over the photodiodes. An array of color filters is formed over the photodiodes and within the dielectric structure. An interface between two layers of the dielectric structure is aligned with the bases of the color filters. The interface provides an etch stops that allows the depths of the trenches in which the color filters are formed to be well controlled. | 01-22-2015 |
20150048467 | Structure of Dielectric Grid with a Metal Pillar for Semiconductor Device - An image sensor device and a method for manufacturing the image sensor device are provided. An image sensor device includes a substrate, sensor elements disposed at a front surface of the substrate, and a dielectric grid disposed over a back surface of the substrate. The dielectric grid includes a first dielectric layer as a bottom portion, a metal pillar, as a core portion of a upper portion, disposed over the first dielectric layer and a second dielectric layer wrapping around the metal pillar. The image sensor device also includes a stack of layers disposed over the back surface of the substrate. Refractive index of each layers increases from top layer to bottom layer. The image sensor device also includes a color filter and a microlens disposed over the back surface of the substrate. | 02-19-2015 |
20150130001 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THEREOF - An image sensor is provided including a substrate, an array of photosensitive units, a grid and a plurality of color filters. In the image sensor, the grid has a first portion and a second portion disposed on the first portion. The second portion of the grid can cause reflection or refraction of incident lights targeted for one image sensor element back into the same image sensor element, so as to avoid crosstalk occurred. Further, a method for manufacturing the image sensor also provides herein. | 05-14-2015 |
20150130002 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THEREOF - An image sensor is provided including a substrate, an array of photosensitive units, a grid, a light-tight layer and a plurality of color filters. In the image sensor, the grid has a top surface, and the light-tight layer is disposed on the top surface of the grid. Due to the light-tight layer on the grid, an incident light entering into the grid can be blocked by the light-tight layer, so that the crosstalk effect is reduced significantly. Further, a method for manufacturing the image sensor also provides herein. | 05-14-2015 |
20150145083 | Structure Of Dielectric Grid For A Semiconductor Device - An image sensor device and a method for manufacturing the image sensor device are provided. An image sensor device includes a pixel region and a non-pixel region in a substrate. In the pixel region there is a plurality of sensor elements. The non-pixel region is adjacent to the pixel region and has no sensor element. Dielectric grids are disposed in the pixel region with a first dielectric trench between two adjacent dielectric grids. The first dielectric trench aligns to a respective sensor element. Second dielectric trenches are disposed in the non-pixel region. | 05-28-2015 |
20150155320 | MECHANISMS FOR FORMING IMAGE SENSOR DEVICE - Embodiments of mechanisms for forming an image sensor device are provided. The image sensor device includes a semiconductor substrate and a photodetector in the semiconductor substrate. The image sensor device also includes a dielectric layer over the semiconductor substrate, and the dielectric layer has a recess aligned with the photodetector. The image sensor device further includes a filter in the recess of the dielectric layer. In addition, the image sensor device includes a shielding layer between the dielectric layer and the semiconductor substrate and surrounding the filter. | 06-04-2015 |
20150243805 | IMAGE SENSOR DEVICE AND METHOD FOR FORMING THE SAME - Embodiments of the disclosure provide an image sensor device. The image sensor device includes a semiconductor substrate including a front surface, a back surface opposite to the front surface, a light-sensing region close to the front surface, and a trench adjacent to the light-sensing region. The image sensor device includes a light-blocking structure positioned in the trench to absorb or reflect incident light. | 08-27-2015 |
20150311247 | METHOD AND APPARATUS FOR FORMING BACK SIDE ILLUMINATED IMAGE SENSORS WITH EMBEDDED COLOR FILTERS - A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate. A plurality of radiation-sensing regions is located in the substrate. The radiation-sensing regions are configured to sense radiation that enters the substrate from the second side. The radiation-sensing regions are separated by a plurality of gaps. A plurality of radiation-blocking structures is disposed over the second side of the substrate. Each of the radiation-blocking structures is aligned with a respective one of the gaps. A plurality of color filters are disposed in between the radiation-blocking structures. | 10-29-2015 |
20150311248 | BACK SIDE ILLUMINATED IMAGE SENSOR WITH DEEP TRENCH ISOLATION STRUCTURES AND SELF-ALIGNED COLOR FILTERS - A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate. A plurality of radiation-sensing regions is located in the substrate. The radiation-sensing regions are configured to sense radiation that enters the substrate from the second side. A plurality of isolation structures are each disposed between two respective radiation-sensing regions. The isolation structures protrude out of the second side of the substrate. | 10-29-2015 |
20150372030 | FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE SENSOR WITH AN ONO-LIKE STRUCTURE - A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate. A plurality of radiation-sensing regions is located in the substrate. The radiation-sensing regions are configured to sense radiation that enters the substrate from the second side. A plurality of light-blocking structures is disposed over the second side of the substrate. A passivation layer is coated on top surfaces and sidewalls of each of the light-blocking structures. A plurality of spacers is disposed on portions of the passivation layer coated on the sidewalls of the light-blocking structures. | 12-24-2015 |
20150372033 | FORMATION OF BURIED COLOR FILTERS IN A BACK SIDE ILLUMINATED IMAGE SENSOR USING AN ETCHING-STOP LAYER - A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate. A plurality of radiation-sensing regions is located in the substrate. The radiation-sensing regions are configured to sense radiation that enters the substrate from the second side. A buffer layer is disposed over the second side of the substrate. A plurality of elements is disposed over the buffer layer. The elements and the buffer layer have different material compositions. A plurality of light-blocking structures is disposed over the plurality of elements, respectively. The radiation-sensing regions are respectively aligned with a plurality of openings defined by the light-blocking structures, the elements, and the buffer layer. | 12-24-2015 |
Patent application number | Description | Published |
20150235858 | WAFER BACK-SIDE POLISHING SYSTEM AND METHOD FOR INTEGRATED CIRCUIT DEVICE MANUFACTURING PROCESSES - A wafer polishing process includes polishing a central area on the back side of a wafer, polishing a peripheral area on the back side of the wafer, buffing the central area, and buffing the peripheral area. The process can significantly reduce scratch-related wafer breakage, can correct focus spots on wafers, and can replace cleaning processes that use chemical etchants. Polishing and buffing can include polishing and buffing the bevel region. Further improvements include polishing with abrasive pads having a soft backing, polishing or buffing with pads having relatively soft abrasive particles, polishing or buffing with abrasive pads made from abrasive particles that have been sorted and selected for regularity of shape, irrigating the surface being polished or buffed with an aqueous solution that includes a friction-reducing agent, and buffing with abrasive pads having 20k or finer grit or non-abrasive pads. | 08-20-2015 |
20150263132 | BARC-ASSISTED PROCESS FOR PLANAR RECESSING OR REMOVING OF VARIABLE-HEIGHT LAYERS - An IC device manufacturing process effectuates a planar recessing of material that initially varies in height across a substrate. The method includes forming a bottom anti-reflective coating (BARC), baking to induce cross-linking in the BARC, CMP to remove a first portion of the BARC and form a planar surface, then plasma etching to effectuate a planar recessing of the BARC. The plasma etching can have a low selectivity between the BARC and the material being recessed, whereby the BARC and the material are recessed simultaneously. Any of the material above a certain height is removed. Structures that are substantially below that certain height can be protected from contamination and left intact. The method can be particularly effective when an abrasive used during CMP forms ester linkages with the BARC. | 09-17-2015 |
20150307747 | CMP SLURRY SOLUTION FOR HARDENED FLUID MATERIAL - A method for performing a Chemical Mechanical Polishing (CMP) process includes applying a CMP slurry solution to a surface of a hardened fluid material on a substrate, the solution comprising an additive to change a bonding structure on the surface of the hardened fluid material. The method further includes polishing the surface of the hardened fluid material with a polishing head. | 10-29-2015 |
Patent application number | Description | Published |
20100081338 | CONTACT FOR POWER CONNECTOR, POWER CONNECTOR AND POWER CONNECTOR ASSEMBLY - The present invention relates to a power connector. The power connector comprises a housing, and a plurality of contacts received in the housing, at least one of the contacts comprising a pair of opposite walls spaced apart at a predetermined distance, the walls having a front end respectively. According to the present invention, the contact further comprises a contact protection mechanism for protecting the contacts, wherein the contact protection mechanism bridges the front ends of the walls. The present invention also relates to a power connector assembly. | 04-01-2010 |
20110076871 | POWER CONNECTOR ASSEMBLY - A power connector assembly includes a first connector ( | 03-31-2011 |
20120064777 | POWER RECEPTACLE WITH ENLARGED HEAT DISSIPATION PATH FORMED ON MATING FACE AND POWER CONNECTOR ASSEMBLY THEREOF - A power receptacle includes an insulative housing and a number of power contacts received in the insulative housing. The insulative housing has a base extending along a first direction and a mating portion protruding from the base. The mating portion has a first mating surface, a pair of side surfaces extending perpendicularly to the first mating surface, and a first slot recessed into the mating portion from the first mating surface. The first slot extends through the pair of side surfaces of the mating portion along the first direction. The insulative housing includes a first mounting surface opposite to the first mating surface and defines a first through hole extending therethrough which is exposed to the outside from the first mating surface. | 03-15-2012 |
20130095684 | ELECTRICAL CONNECTOR - A power connector mounting on a printed circuit board (PCB), includes an insulating housing, a number of power contacts received in the housing and a pair of spacers attached to the insulating housing. The insulating housing extends along a transversal direction and defines a number of passageways extending therethrough along a front-to-back direction. The insulating housing has a front wall, an opposite rear wall, a pair of side walls and a bottom wall with the passageway extending through the front wall and the rear wall. The spacer is assembled to the pairs of power contacts with locking members thereon for holding the power contacts in positions with respect to the insulating housing. | 04-18-2013 |
20130095693 | ELECTRICAL CONNECTOR - A power connector mounting on a printed circuit board (PCB), includes an insulating housing, and a number of power contacts received in the housing. The insulating housing extends along a transversal direction and defines a number of passageways extending therethrough along a front-to-back direction. The insulating housing has a top wall, an opposite bottom wall, and a pair of side walls. A beam is provided inside of the passageway. Each power contact has a main portion, a pair of contacting fingers extending from a forward edge of the main portion and distal tails extending downwards from the main portion. The pair of contacting fingers defining a groove therebetween for engaging with the beam so as to facilitate the contact being secured in the passageway with respect to said insulating housing. | 04-18-2013 |
20130102196 | ELECTRICAL CONNECTOR - An electrical connector for connecting a cable includes an insulating housing with power contacts and signal contacts received therein, a power bus bar connecting with one power contact, and a spacer receiving the power bus bar. The insulating housing includes a mating face, a mounting face opposite to the mating face and defines first and second passageways extending therethrough. Each power contact forms a first engaging portion and a first contacting portion. Each signal contact forms a second engaging portion and a second contacting portion. The power bus bar has a main section extending along a first plane, a middle section extending from the main section, and a connecting section extending along a second plane perpendicular to the first plane. | 04-25-2013 |
20130102197 | ELECTRICAL CONNECTOR - An electrical connector includes an insulating housing, a number of power contacts and a number of signal contacts received in the insulating housing, and a power bus bar electrically and mechanically connecting with one power contact. The insulating housing defines an opening at a rear side thereof, and defines a number of first and second passageways extending therethrough and communicating with the opening The power contacts are received in corresponding first passageways and the signal contacts are received in corresponding second passageways. Each power contact is composed by a pair of opposite power contact halves. Each power contact half defines a contacting end and an engaging end opposite to the contacting end. A fish-shape slot is defined between the two engaging ends. | 04-25-2013 |
20130102198 | ELECTRICAL CONNECTOR - An electrical connector for connecting a cable includes an insulating housing with power contacts and signal contacts received therein, and a power bus bar connecting with one power contact. The insulating housing includes a mating face, a mounting face opposite to the mating face and defines first and second passageways extending therethrough. Each power contact forms a first engaging portion and a first contacting portion. Each signal contact forms a second engaging portion and a second contacting portion. The power bus bar has a main section extending along a first plane, a middle section extending from the main section, and a connecting section extending along a second plane perpendicular to the first plane. | 04-25-2013 |
20130164998 | ELECTRICAL CONNECTOR - An electrical connector includes an insulating housing having a number of passageways and a number of dividing walls extending from a rear side of the passageways; and a number of contact modules received in the insulating housing and arranged along a first direction. Each contact module includes an insulator and a number of conductive contacts received in the insulator. Each insulator includes a first section and a second section. The dimension of the first section along the first direction is larger than the dimension of the second section. When the contact modules are assembled to the insulating housing, the second sections are received in corresponding dividing walls, respectively. | 06-27-2013 |
20130344747 | RECHARGEABLE BATTERY SOCKET AND MANUFACTURING METHOD THEREOF - A rechargeable battery socket and the manufacturing method of making the same is disclosed. The rechargeable battery socket includes an insulating housing defining a number of terminal channels, a number of terminals received in the insulating housing, and a shell assembled to one side of the insulating housing. Each terminal includes a contacting portion received in corresponding terminal channel and a tail extending out of the insulating housing. Each terminal channel provides a pair of ribs on two opposite inside faces thereof. The contacting portion of the terminal cooperates with the rib to thereby secure the terminal in the insulating housing. | 12-26-2013 |
20150017830 | CONNECTOR ASSEMBLY WITH PLATE FOR CONTACT NESTING AND EFFECTIVE HEAT DISSIPATION PATH - A connector assembly includes a plug connector and a receptacle connector mateable with each other. The plug connector includes a plug insulative housing and a pair of plug power contacts. The plug insulative housing includes a first plug cavity, a first plate cantileveredly extending into the first plug cavity, and upper and lower plug contact slots in communication with the first plug cavity. The pair of plug power contacts are respectively received in the upper and lower plug contact slots. Each plug power contact includes a flat contacting section exposed to the first plug cavity and a first soldering section. The flat contacting sections are positioned on upper and lower surfaces of the first plate, respectively. The plug connector and the receptacle connector define heat dissipation channels in communication with each other in order that generating heat can be effectively dissipated to the air. | 01-15-2015 |
Patent application number | Description | Published |
20140055893 | Display and Electrostatic Discharge Protection Apparatus - A display and an electrostatic discharge protection apparatus are disclosed, wherein the display includes a display module, a flex flat cable, a motherboard, and an electrostatic discharge protection apparatus. The flex flat cable is electrically connected with the display module and the motherboard; the electrostatic discharge protection apparatus is disposed between the flex flat cable and the display module. The electrostatic discharge protection apparatus has an isolation board and at least one isolation pad, the isolation board includes a first surface and a second surface, and at least one part of the first surface is attached to the flex flat cable; the isolation pad comprises a first isolation surface, and the first isolation surface is combined with the second surface. | 02-27-2014 |
20150139755 | FLEXIBLE POSITIONING POST - A flexible positioning post includes a base, a metal post and a plurality of metal elastic pieces. The base has an upper surface. The metal post has a first end and a second end opposite to each other, and the first end is connected to the upper surface of the base. Each of the metal elastic pieces has a fixed end and a free end opposite to each other. The fixed end is securely assembled at the second end of the metal post, and the free end is adjacent to the upper surface of the base and bent toward the metal post to form a bending portion. Consequently, upon receiving a foreign force, the free end of each of the metal elastic pieces is moved toward the metal post; conversely, once the foreign force is removed, the free end of each of the metal elastic pieces is moved resiliently. | 05-21-2015 |
Patent application number | Description | Published |
20140157921 | LINEAR ACTUATOR - A linear actuator includes a motor, a transmission mechanism including a housing defining an accommodation chamber, a screw rod inserted with its one end into the accommodation chamber, a worm gear threaded onto the screw rod and coupled to the motor, two axle bearings mounted at the worm gear at two opposite sides and a top cover covering the housing, and a linking mechanism fixedly mounted in the housing and including a tubular member defining a longitudinal straight passage for receiving the other end of the screw rod and two sliding slots at two opposite sides and a screw nut formed of a linking member that is threaded onto the screw rod and two mating connection members respectively slidably mounted in the sliding slots and connected to the linking member. Thus, the supported worktable can be moved along the full length of the screw rod. | 06-12-2014 |
20150061435 | BRAKING DEVICE - A braking device includes a flywheel rotatably mounted on a brace, a circular rotor deposited on the flywheel, and a stator fixed to the brace for combining with the rotor. The stator includes first and second magnetic poles. The first magnetic pole is larger than the second magnetic pole. The first and second magnetic poles are arranged into a ring in an interlaced manner. Each of the first and second magnetic poles has a coil. The braking device has a magnetic control unit mounted on a lateral of the brace near a rim of the flywheel and configured to generate magnetism in response to electric currents generated by the coils, so as to change a rotatory load of the flywheel. With the interlaced arrangement of the large and small magnetic poles, the braking device can have the rotor rotating with less cogging torque, and in turn reduced noise. | 03-05-2015 |