Patent application number | Description | Published |
20080239820 | SELF-ADAPTIVE AND SELF-CALIBRATED MULTIPLE-LEVEL NON-VOLATILE MEMORIES - Innovative self-adaptive and self-calibrated methods and structures for Multi-Level Cell (MLC) Non-Volatile Memory (NVM) are disclosed. In the MLC NVM, NVM cells are self-adaptively programmed into a fixed response tolerance window centered at the reference current or voltage corresponding to a selected level gate voltage applied to the controlled gates of NVM cells. The fixed response tolerance window is related to the threshold voltage tolerance window through the sense circuit gain. Properly choosing the sense circuit gain and the response window can control the threshold voltage tolerance window to a desired value. An incremental gate voltage larger than the threshold voltage tolerance window of each NVM cell will guarantee that each NVM cell will produce the correct output current (voltage) in response to applying to the control gate of the NVM cell the stepped voltage corresponding to the level of information stored in the NVM cell. As the stepped voltage applied to the gate of an NVM cell transitions from a voltage just below the threshold voltage of the NVM cell to a voltage corresponding to the threshold voltage of the NVM cell, the output current (voltage) from the NVM cell will pass the current (voltage) transition in comparison with the reference current (voltage). The current (voltage) transition can be detected and converted into the bit-word information representing the voltage level stored in the NVM cell. When the response of an NVM cell falls outside the response tolerance window into the guard-band regions, the NVM cell can be re-calibrated and the bit-word information can be saved from fading away. | 10-02-2008 |
20080266947 | Bit-Symbol Recognition Method and Structure for Multiple-Bit Storage in Non-Volatile Memories - Storage of information represented by a multi-bit word in a single non-volatile memory cell is made possible by programming the threshold voltage of the non-volatile memory to a specific threshold level corresponding to the multi-bit word. Stored or generated multi-bit words are scanned and converted into a gate voltage to be applied to the non-volatile memory cell until the electrical response from the non-volatile memory cell indicates that the voltage generated from the specific multi-bit word which has been applied to the gate matches the information stored in the non-volatile memory cell. The matched multi-bit word is read out of storage and represents the stored bits in the single non-volatile memory cell. | 10-30-2008 |
20090021984 | METHODS AND STRUCTURES FOR HIGHLY EFFICIENT HOT CARRIER INJECTION PROGRAMMING FOR NON-VOLATILE MEMORIES - A metal oxide semiconductor field effect transistor (MOSFET) in a non-volatile memory cell has a source, a drain and a channel region between the source and the drain, all formed in a substrate of opposite conductivity type to the conductivity type of the source and drain. The MOSFET is programmed by connecting the drain electrode to the supply source of the main voltage, V | 01-22-2009 |
20090103361 | LEVEL VERIFICATION AND ADJUSTMENT FOR MULTI-LEVEL CELL (MLC) NON-VOLATILE MEMORY (NVM) - Non-Volatile Memory (NVM) cells are connected in inverter configurations. The NVM inverter's Voltage Transfer Characteristics (VTC) is used to verify and adjust threshold voltage levels of a Multi-Level Cell (MLC) in an NVM. In one embodiment, the NVM cell is fast programmed to a specific threshold voltage level. The cell threshold level is then verified by applying a ‘gate voltage corresponding to the selected threshold voltage to the NVM inverter. The output voltage of the NVM inverter in response to the applied level gate voltage is detected. When the output voltage of the NVM inverter is out of a predefined output voltage window for the selected threshold voltage level, a fine-tuning programming sequence is applied to the NVM cell until the threshold voltage of the NVM cell is inside the correspondent threshold voltage window. This verification and adjustment scheme for a MLC NVM allows the threshold voltage of the multi-level NVM cells for any specific level to be controlled to a desired accuracy. | 04-23-2009 |
20090175079 | STRUCTURES AND METHODS TO STORE INFORMATION REPRESENTABLE BY A MULTIPLE-BIT BINARY WORD IN ELECTRICALLY ERASABLE, PROGRAMMABLE READ-ONLY MEMORY (EEPROM) - Innovative structures and methods to store information capable of being represented by an n-bit binary word in electrically erasable Programmable Read-Only memories (EEPROM) are disclosed. To program a state below the highest threshold voltage for an N-type Field Effect Transistor (NFET) based EEPROM, the stored charge in the floating gate for the highest threshold voltage is erased down to the desired threshold voltage level of the EEPROM by applying an appropriate voltage to the control gate and drain of the NFET. The erase-down uses drain-avalanche-hot hole injection (DAHHI) for the NFET memory device to achieve the precise threshold voltage desired for the NFET EEPROM device. The method takes advantage of the self-convergent mechanism from the DAHHI current in the device, when the device reaches a steady state. For a “READ” operation, a read voltage is applied to the control gate and the drain is connected by a current load to the positive voltage supply. Using the distinctive threshold voltage associated with the different stored charges, the output voltage from the drain is distinctively recognized and converted back to the original n-bit word. A similar method for a PFET EEPROM is also disclosed. | 07-09-2009 |
20110063912 | METHODS AND STRUCTURES FOR READING OUT NON-VOLATILE MEMORY USING NVM CELLS AS A LOAD ELEMENT - A Non-Volatile Memory (NVM) cell in an NVM array is read out using other NVM cells in the array as a load element. Conventional load elements such as MOS transistors or resistors used to vary the bitline potential for the NVM cell readout in conventional NVM arrays are replaced with NVM cell(s) in the array. The omission of the extra MOS transistors or resistors for the load elements not only saves silicon area but also simplifies the bitline sensing circuitry design in the NVM array. | 03-17-2011 |
20110108904 | DUAL CONDUCTING FLOATING SPACER METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR (DCFS MOSFET) AND METHOD TO FABRICATE THE SAME - Dual Conducting Floating Spacer Metal Oxide Semiconductor Field Effect Transistors (DCFS MOSFETs) and methods for fabricate them using a process that is compatible with forming conventional MOSFETs are disclosed. A DCFS MOSFET can provide multi-bit storage in a single Non-Volatile Memory (NVM) memory cell. Like a typical MOSFET, a DCFS MOSFET includes a control gate electrode on top of a gate dielectric-silicon substrate, thereby forming a main channel of the device. Two electrically isolated conductor spacers are provided on both sides of the control gate and partially overlap two source/drain diffusion areas, which are doped to an opposite type to the conductivity type of the substrate semiconductor. The DCFS MOSFET becomes conducting when a voltage that exceeds a threshold is applied at the control gate and is coupled through the corresponding conducting floating spacer to generate an electrical field strong enough to invert the carriers near the source junction. By storing charge in the two independent conducting floating spacers, DCFS MOSFET can have two independent sets of threshold voltages associated with the source junctions. | 05-12-2011 |
20110110162 | STRUCTURES AND METHODS FOR READING OUT NON-VOLATILE MEMORIES - Non-differential sense amplifier circuitry for reading out Non-Volatile Memories (NVMs) and its operating methods are disclosed. Such non-differential amplifier circuitry requires exceptionally low power and achieves moderate sensing speed, as compared to a conventional sensing scheme. | 05-12-2011 |
20120299079 | FIELD SIDE SUB-BITLINE NOR FLASH ARRAY AND METHOD OF FABRICATING THE SAME - Field Side Sub-bitline NOR-type (FSNOR) flash array and the methods of fabrication are disclosed. The field side sub-bitlines of the invention formed with the same impurity type as the memory cells' source/drain electrodes along the two sides of field trench oxide link all the source electrodes together and all the drain electrodes together, respectively, for a string of semiconductor Non-Volatile Memory (NVM) cells in a NOR-type flash array of the invention. Each field side sub-bitline is connected to a main metal bitline through a contact at its twisted point in the middle. Because there are no contacts in between the linked NVM cells' electrodes in the NOR-type flash array of the invention, the wordline pitch and the bitline pitch can be applied to the minimum geometrical feature of a specific technology node. The NOR-type flash array of the invention provides at least as high as those in the conventional NAND flash array in cell area density. | 11-29-2012 |
20130039127 | NON-VOLATILE STATIC RANDOM ACCESS MEMORY DEVICES AND METHODS OF OPERATIONS - Non-Volatile Static Random Access Memory (NVSRAM) cell devices applying only one single non-volatile element embedded in a conventional Static Random Access Memory (SRAM) cell are disclosed. The NVSRAM cell devices can be integrated into a compact cell array. The NVSRAM devices of the invention have a read/write speed of a conventional SRAM and non-volatile property of a non-volatile memory cell. The methods of operations for the NVSRAM devices of the invention are also disclosed. | 02-14-2013 |
20130178026 | METHOD FOR FABRICATING A FIELD SIDE SUB-BITLINE NOR FLASH ARRAY - Field Side Sub-bitline NOR-type (FSNOR) flash array and the methods of fabrication are disclosed. The field side sub-bitlines of the invention formed with the same impurity type as the memory cells' source/drain electrodes along the two sides of field trench oxide link all the source electrodes together and all the drain electrodes together, respectively, for a string of semiconductor Non-Volatile Memory (NVM) cells in a NOR-type flash array of the invention. Each field side sub-bitline is connected to a main metal bitline through a contact at its twisted point in the middle. Because there are no contacts in between the linked NVM cells' electrodes in the NOR-type flash array of the invention, the wordline pitch and the bitline pitch can be applied to the minimum geometrical feature of a specific technology node. The NOR-type flash array of the invention provides at least as high as those in the conventional NAND flash array in cell area density. | 07-11-2013 |
20130214341 | SCALABLE GATE LOGIC NON-VOLATILE MEMORY CELLS AND ARRAYS - Scalable Gate Logic Non-Volatile Memory (SGLNVM) devices fabricated with the conventional CMOS process is disclosed. Floating gates of SGLNVM with the minimal length and width of the logic gate devices form floating gate Metal-Oxide-Semiconductor Field Effect Transistor. The floating gates with the minimal gate length extend over silicon active areas to capacitively couple control gates embedded in silicon substrate (well) through an insulation dielectric. The embedded control gate is formed by a shallow semiconductor type opposite to the type of the silicon substrate or well. Plurality of SGLNVM devices are configured into a NOR-type flash array where a pair of SGLNVM devices share a common source electrode connected to a common ground line with two drain electrodes connected to two separate bitlines. The pairs of the NOR-type SGLNVM cells are physically separated and electrically isolated by dummy floating gates to minimize cell sizes. | 08-22-2013 |
20130224917 | Dual Conducting Floating Spacer Metal Oxide Semiconductor Field Effect Transistor (DCFS MOSFET) and Method to Fabricate the Same - Dual Conducting Floating Spacer Metal Oxide Semiconductor Field Effect Transistors (DCFS MOSFETs) and methods for fabricate them using a process that is compatible with forming conventional MOSFETs are disclosed. A DCFS MOSFET can provide multi-bit storage in a single Non-Volatile Memory (NVM) memory cell. Like a typical MOSFET, a DCFS MOSFET includes a control gate electrode on top of a gate dielectric-silicon substrate, thereby forming a main channel of the device. Two electrically isolated conductor spacers are provided on both sides of the control gate and partially overlap two source/drain diffusion areas, which are doped to an opposite type to the conductivity type of the substrate semiconductor. The DCFS MOSFET becomes conducting when a voltage that exceeds a threshold is applied at the control gate and is coupled through the corresponding conducting floating spacer to generate an electrical field strong enough to invert the carriers near the source junction. By storing charge in the two independent conducting floating spacers, DCFS MOSFET can have two independent sets of threshold voltages associated with the source junctions. | 08-29-2013 |
20130235661 | STRUCTURES AND METHODS OF HIGH EFFICIENT BIT CONVERSION FOR MULTI-LEVEL CELL NON-VOLATILE MEMORIES - Structures and methods of converting Multi-Level Cell (MLC) Non-Volatile Memory (NVM) into multi-bit information are disclosed. In MLC NVM system, multi-bit information stored in NVM cell is represented by the states of NVM cell threshold voltage levels. In this disclosure, “P” states of NVM cell threshold voltage levels are divided into “N” groups of threshold voltage levels. Each group contains “M” states of multiple threshold voltage levels of NVM cells, where P=N×M. The “M” states of NVM cell threshold voltage levels in each group are sensed and resolved by applying one correspondent gate voltage to the group. By applying “N” multiple gate voltages, the whole “P” states of NVM cell threshold voltage levels can be sensed and efficiently converted into storing bits in the MLC NVM cells. | 09-12-2013 |
20130279266 | COMPLEMENTARY ELECTRICAL ERASABLE PROGRAMMABLE READ ONLY MEMORY - Complementary Electrical Erasable Programmable Read Only Memory (CEEPROM) is disclosed. CEEPROM cell comprises a pair of non-volatile memory elements and one access transistor. The two elements of the non-volatile memory pair are configured to be one with high electrical conductance and the other with low electrical conductance. The positive voltage V | 10-24-2013 |
20140029340 | STRUCTURES AND OPERATIONAL METHODS OF NON-VOLATILE DYNAMIC RANDOM ACCESS MEMORY DEVICES - A Dynamic Random Access Memory (DRAM) cell and a semiconductor Non-Volatile Memory (NVM) cell are incorporated into a single Non-Volatile Dynamic Random Access Memory (NVDRAM) cell. The NVDRAM cell is operated as the conventional DRAM cell for read, write, and refreshment on dynamic memory applications. Meanwhile the datum in the NVM cells can be directly loaded into the correspondent DRAM cells in the NVDRAM cell array without applying intermediate data amplification and buffering leading to high speed non-volatile data access. The datum in DRAM cells can be also stored back to the correspondent semiconductor NVM cells in the NVDRAM cells for the datum required for non-volatile data storage. The NVDRAM of the invention can provide both fast read/write function for dynamic memory and non-volatile memory storage in one unit memory cell. | 01-30-2014 |
20140097483 | 3-D SINGLE FLOATING GATE NON-VOLATILE MEMORY DEVICE - A 3-D Single Floating Gate Non-Volatile Memory (SFGNVM) device based on the 3-D fin Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) is disclosed. The disclosed Non-Volatile Memory (NVM) device consists of a pair of semiconductor fins and one floating metal gate. The floating metal gate for storing electrical charges to alter the threshold voltage of the fin MOSFET crosses over the pair of semiconductor fins on top of coupling and tunneling dielectrics above the surfaces of the two semiconductor fins. One semiconductor fin with the same type impurity forms the control gate of the non-volatile memory device. The other semiconductor fin is doped with opposite type of impurity in the channel regions under the metal floating gate and with the same type of impurity in the source and drain regions on the sides of the crossed metal floating gate. | 04-10-2014 |
20140140139 | INTERCONNECTION MATRIX USING SEMICONDUCTOR NON-VOLATILE MEMORY - An interconnection matrix consists of a plurality of semiconductor Non-Volatile Memory (NVM) forming an M×N array. Semiconductor NVM devices in the array are either programmed to a high threshold voltage state or erased to a low threshold voltage state according to a specific interconnection configuration. Applied with a gate voltage bias higher than the low threshold voltage and lower than the high threshold voltage to the control gates of the entire semiconductor NVM devices in the array, the configured interconnection network is formed. The disclosed interconnection matrix can be applied to configuring circuit routing in Integrated Circuit (IC). | 05-22-2014 |
20140177348 | NON-VOLATILE REGISTER AND NON-VOLATILE SHIFT REGISTER - Non-Volatile Register (NVR) and Non-Volatile Shift Register (NVSR) devices are disclosed. The innovative NVR and NVSR devices of the invention can rapidly load the stored non-volatile data in non-volatile memory elements into their correspondent static memory elements for fast and constant referencing in digital circuitry. According to the invention, the loading process from non-volatile memory to static memory is a direct process without going through the conventional procedures of accessing the non-volatile memory, sensing from the non-volatile memory, and loading into the digital registers and shift registers. | 06-26-2014 |
20140239999 | MULTIPLE-TIME CONFIGURABLE NON-VOLATILE LOOK-UP-TABLE - Innovative Non-Volatile Look-Up-Table (NV-LUT) has been constructed by Single Gate Logic Non-Volatile Memory (SGLNVM) devices processed with the standard CMOS logic process. One of a pair of complementary SGLNVM devices is always programmed to the high threshold voltage state and the other remains in the low threshold voltage state. By applying digital voltage rail (V | 08-28-2014 |
20140369135 | Ultra-Low Power Programming Method for N-Channel Semiconductor Non-Volatile Memory - An Ultra-low power programming method for N-channel semiconductor Non-Volatile Memory (NVM) is disclosed. In contrast to the grounded voltage at the source electrode of an N-channel semiconductor NVM for the conventional Channel Hot Electron Injection (CHEI) programming, the source electrode in the programming method of the invention is necessarily floating with no voltage bias to prevent applied electrical fields toward the source electrode. The drain electrode of the N-channel semiconductor NVM is reversely biased with a positive voltage V | 12-18-2014 |