Patent application number | Description | Published |
20140103488 | POP Structures and Methods of Forming the Same - A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line. | 04-17-2014 |
20140128009 | INTEGRATED TRANSMITTER AND RECEIVER FRONT END MODULE, TRANSCEIVER, AND RELATED METHOD - A front end module includes a transmitter path network coupled to an antenna and a transmitter, and includes a first selectable matching network. The front end module further includes a receiver path network coupled to the antenna and a receiver. The receiver path network is a second selectable matching network. | 05-08-2014 |
20140152509 | Embedding Low-K Materials in Antennas - A device includes a patch antenna, which includes a feeding line, and a ground panel over the feeding line. The ground panel has an aperture therein. A low-k dielectric module is over and aligned to the aperture. A patch is over the low-k dielectric module. | 06-05-2014 |
20140168014 | Antenna Apparatus and Method - An antenna apparatus comprises a semiconductor die comprising a plurality of active circuits, a molding layer formed over the semiconductor die, wherein the semiconductor die and the molding layer form a fan-out package, a first dielectric layer formed on a first side of the semiconductor die over the molding compound layer, a first redistribution layer formed in the first dielectric layer and an antenna structure formed above the semiconductor die and coupled to the plurality of active circuits through the first redistribution layer. | 06-19-2014 |
20140185264 | METHODS AND APPARATUS FOR FORMING PACKAGE-ON-PACKAGES - Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors. | 07-03-2014 |
20140253262 | RF CHOKE DEVICE FOR INTEGRATED CIRCUITS - Among other things, one or more techniques and systems for selectively filtering RF signals within one or more RF frequency band are provided. In particular, an RF choke, such as a 3D RF choke or a semi-lumped RF choke, configured to selectively filter such RF signals is provided. The RF choke comprises a metal connection line configured as an inductive element for the RF choke. In an example, one or more metal lines, such as a metal open stub, are formed as capacitive elements for the RF choke. In another example, one or more through vias are formed as capacitive elements for the RF choke. In this way, the RF choke allows DC power signals to pass through the metal connection line, while impeding RF signals within the one or more RF frequency bands from passing through the metal connection line. | 09-11-2014 |
20140262475 | 3D Shielding Case and Methods for Forming the Same - A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh. | 09-18-2014 |
20150042438 | TUNABLE THREE DIMENSIONAL INDUCTOR - A tunable three-dimensional (3D) inductor comprises a plurality of vias arranged with spacing among them, a plurality of interconnects in a metal layer, wherein the plurality of interconnects connect the plurality of vias on one end, and a plurality of tunable wires that connects to the plurality of vias on the other end to form the 3D inductor. The physical configuration and inductance value of the 3D inductor are adjustable by tuning the plurality of tunable wires during manufacturing process. | 02-12-2015 |
20150155203 | POP Structures and Methods of Forming the Same - A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line. | 06-04-2015 |
20150200182 | Packaging Methods for Semiconductor Devices, Packaged Semiconductor Devices, and Design Methods Thereof - Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices includes providing a first die, and coupling second dies to the first die. An electrical connection is formed between the first die and each of the second dies. A portion of each of the electrical connections is disposed between the second dies. | 07-16-2015 |
Patent application number | Description | Published |
20120133625 | METHOD FOR DRIVING CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE - A method for driving a cholesteric liquid crystal display device is disclosed. The cholesteric liquid crystal display device includes a plurality of pixels. The method includes steps below. In a first duration, a first square wave is provided for the pixels. The first square wave has an amplitude of a first value. In a second duration, a second square wave is provided for each one of the pixels according to a required gray level of each one of the pixels. The second square wave has an amplitude of a second value. The second value is different from the first value. The first square wave and the second square wave are continuously provided. The method for driving the cholesteric liquid crystal display device according to the present invention is capable of displaying a motion picture and decreasing driving voltages. | 05-31-2012 |
20120188495 | CHOLESTERIC LIQUID CRYSTAL DISPLAY DEVICE - A cholesteric liquid crystal display device is disclosed. The cholesteric liquid crystal display device includes a substrate, a light absorbing layer, and a cholesteric liquid crystal layer. The cholesteric liquid crystal layer includes plural rows of left-handed cholesteric liquid crystals and plural rows of right-handed cholesteric liquid crystals which are arranged alternately. The left-handed cholesteric liquid crystals and the right-handed cholesteric liquid crystals respectively reflect left-handed light and right-handed light in the cholesteric liquid crystal display device of the present invention, whereby both eyes of an observer can see different images and thus a 3D effect is formed. | 07-26-2012 |
20120223985 | INK-JET DEVICE - Disclosed is an ink-jet device applicable to various ink-jet equipments. The device includes an ink reservoir, an ink chamber, pressure generating units and an ink-jet head. The ink-jet head has dielectric layers coated on an inner surface and an outer surface thereof. By applying a voltage to the dielectric layers, the dielectric layers are changed to be hydrophobic or hydrophilic, so as to reduce residual ink accumulated in the ink-jet head during the ink-jetting process, hence improving ink-jetting accuracy. | 09-06-2012 |
20120289731 | PHOTO-CROSSLINKABLE LIQUID CRYSTAL MONOMERS WITH OPTICAL ACTIVITY - The present invention relates to photo-crosslinkable liquid crystal monomers with optical activity. The liquid crystal monomers contains one chiral center with an acrylate group or terminal diacrylate groups, and terminal dibenzene rings are introduced in order to extend its hard segment for the purpose of getting a wider liquid crystalline phase. By introducing the liquid crystal monomers, the room temperature nematic liquid crystal or the cholesteric liquid crystal may have a better mutual solubility and a wider, steadier structure of liquid crystal. The liquid crystal monomers have the following formula structure: | 11-15-2012 |