Patent application number | Description | Published |
20110009559 | AROMATIC DICYANATE COMPOUNDS WITH HIGH ALIPHATIC CARBON CONTENT - Aromatic dicyanate compounds which comprise aliphatic moieties having at least about six carbon atoms and resins and thermoset products based on these compounds. | 01-13-2011 |
20110009560 | ETHYLENICALLY UNSATURATED MONOMERS COMPRISING ALIPHATIC AND AROMATIC MOIETIES - Polymerizable monomers comprising at least one 1- or 2-propylene moiety and further comprising both aromatic moieties and additional aliphatic moieties and polymerizable mixtures, resins and thermoset products based on these monomers. | 01-13-2011 |
20110009562 | AROMATIC POLYCYANATE COMPOUNDS AND PROCESS FOR THE PRODUCTION THEREOF - Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds. | 01-13-2011 |
20110122590 | EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS - Disclosed is a low viscosity, low to no chloride containing epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of capillary underfill compositions. | 05-26-2011 |
20110136993 | PHOSPHORUS-CONTAINING COMPOUNDS AND POLYMERIC COMPOSITIONS COMPRISING SAME - Phosphorus-containing compounds of formula (I): (I) wherein m, n, R, R | 06-09-2011 |
20110247756 | HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES - Homogeneous solutions including an epoxy resin, a maleimide component including at least one bismaleimide, and a cyanate ester component are disclosed. Such compositions may be useful, for example, in curable compositions, thermoset compositions, and the manufacture of electrical laminates and other end products that may be formed from or using the curable and thermoset compositions. | 10-13-2011 |
20110263754 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS - A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed. | 10-27-2011 |
20110315916 | CURABLE COMPOSITION - A conductive curable resin composition including (a) at least one vinylarene oxide, (b) at least one curing agent, and (c) at least one conductive filler; a process for making the above curable resin composition; and a cured resin composition made therefrom. The curable resin composition when cured produces a thermoset having a higher heat resistance after cure than analogous prior art compositions. The curable compositions of the present invention are advantageously useful, for example, as a die attach adhesive for semiconductor packaging material thermoset materials. | 12-29-2011 |
20120259042 | TOUGHENED EPOXY RESIN FORMULATIONS - A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers. | 10-11-2012 |
20120289663 | THERMOSETTING MONOMERS AND COMPOSITIONS CONTAINING PHOSPHORUS AND CYANATO GROUPS - A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group. | 11-15-2012 |
20120302727 | PHOSPHORUS-CONTAINING EPOXY RESIN - Embodiments of the present disclosure provide a phosphorus-containing epoxy resin. Embodiments of the present disclosure further include a curable composition formed with the phosphorous-containing epoxy resin and a cured epoxy formed with the phosphorus-containing epoxy resin. For the various embodiments, the cured epoxy formed with the phosphorus-containing epoxy resin can have a glass transition temperature within a range of at least 150 degrees Celsius to 200 degrees Celsius and a thermal decomposition temperature of at least 330 degrees Celsius. | 11-29-2012 |
20130005857 | COMPOSITIONS HAVING PHOSPHORUS-CONTAINING COMPOUNDS - Embodiments of the present disclosure provide a composition that includes a phosphorous-containing compound, a cyanate ester, an epoxy resin, and a maleimide. For the various embodiments, a viscosity of the composition increases less than 100% as measured by Gardner Bubble Viscosity a temperature of 23° C. in at least 3 days. For the various embodiments, the composition of the present disclosure can also include an aprotic solvent, such as a ketone. Embodiments of the present disclosure further include a composition that includes the phosphorous-containing compound, the cyanate ester, and the aprotic solvent. For the various embodiments, the composition can also include the epoxy resin and the maleimide. For the various embodiments, the composition does not include an aliphatic alcohol. | 01-03-2013 |
20130041116 | THERMOSETTING MONOMERS AND COMPOSITIONS CONTAINING PHOSPHORUS AND CYANATO GROUPS - A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group. | 02-14-2013 |
20130066026 | HARDENERS FOR THERMOSETTABLE RESIN COMPOSITIONS - A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior. | 03-14-2013 |
20130225728 | ADDUCT - An adduct of (a) at least one divinylarene dioxide, and (b) at least one end-functionalized polymer. For example, the adduct may be beneficially used as a toughening agent for toughening thermoset resins such as epoxy resins. | 08-29-2013 |
20130303659 | HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS - A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites. | 11-14-2013 |
20140186536 | CURABLE RESIN COMPOSITIONS - A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged. | 07-03-2014 |
20140212582 | CURABLE RESIN COMPOSITIONS - A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged. | 07-31-2014 |