Patent application number | Description | Published |
20120003448 | BARRIER ASSEMBLY WITH ENCAPSULANT AND PHOTOVOLTAIC CELL - An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light. | 01-05-2012 |
20120003451 | BARRIER ASSEMBLY - An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light. | 01-05-2012 |
20120003484 | MOISTURE RESISTANT COATING FOR BARRIER FILMS - A barrier film having a substrate, a base polymer layer applied to the substrate, an oxide layer applied to the base polymer layer, and a top coat polymer layer applied to the oxide layer. An optional inorganic layer can be applied over the top coat polymer layer. The top coat polymer includes a silane and an acrylate co-deposited to form the top coat layer. The use of a silane co-deposited with an acrylate to form the top coat layer of the barrier films provide for enhanced resistance to moisture and improved peel strength adhesion of the top coat layer to the underlying barrier stack layers. | 01-05-2012 |
20120208033 | BARRIER FILM - A barrier film is disclosed that includes a polymeric film substrate and at least first and second polymer layers separated by an inorganic barrier layer. The first polymer layer is disposed on the polymeric film substrate. At least one of the first or second polymer layers is prepared from co-deposited amino silane and acrylate or methacrylate monomer. A method of making the barrier film is also disclosed. | 08-16-2012 |
20120227809 | FLEXIBLE ASSEMBLY AND METHOD OF MAKING AND USING THE SAME - An assembly including a pressure sensitive adhesive layer at least 0.25 mm in thickness disposed on a barrier assembly, wherein the barrier assembly comprises a polymeric film substrate and a barrier film. The assembly is flexible and transmissive to visible and infrared light. A pressure sensitive adhesive in the form of a film at least 0.25 mm thick is also provided, the pressure sensitive adhesive including a polyisobutylene having a weight average molecular weight less than 300,000 grams per mole; and a hydrogenated hydrocarbon tackifier. Methods of making and using the assembly and the pressure sensitive adhesive are also included. | 09-13-2012 |
20120229893 | MULTI-LAYER OPTICAL FILMS - Multi-layer optical film ( | 09-13-2012 |
20140230892 | EDGE PROTECTED BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused. | 08-21-2014 |
20140246090 | METHOD OF MAKING DELAMINATED RESISTANT ASSEMBLIES - The present application is directed to a method of reducing delamination in an assembly. The method comprises providing an assembly and limiting visible light exposure to parts of the assembly to maintain a peel force of 20 grams/inch or greater where the light is limited. The assembly comprises an electronic device, a substrate having a first surface and a second surface opposite the first surface, wherein the second surface of the substrate is disposed on the electronic device, a barrier stack disposed on the first surface of the substrate, and a weatherable sheet adjacent the barrier film opposite the substrate. The assembly is transmissive to visible and infrared light. | 09-04-2014 |
20140283910 | EDGE PROTECTED BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment. | 09-25-2014 |
20140290736 | BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The weatherable sheet is bonded to the electronic device. | 10-02-2014 |
20150027533 | EDGE PROTECTED BARRIER ASSEMBLIES - The present application is directed to an assembly comprising an electronic device; and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device, and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises an opaque protective layer adjacent the barrier stack opposite the electronic device. | 01-29-2015 |