Patent application number | Description | Published |
20100201812 | ACTIVE DISPLAY FEEDBACK IN INTERACTIVE INPUT SYSTEMS - A method for distinguishing between a plurality of pointers in an interactive input system comprises calculating a plurality of potential coordinates for a plurality of pointers in proximity of an input surface of the interactive input system, displaying visual indicators associated with each potential coordinate on the input surface, and determining real pointer locations and imaginary pointer locations associated with each potential coordinate from the visual indicators. | 08-12-2010 |
20110006981 | INTERACTIVE INPUT SYSTEM - A method for resolving ambiguities between at least two pointers in a plurality of input regions defining an input area of an interactive input system. The method includes capturing images of the plurality of input regions, the images captured by a plurality of imaging devices having a field of view of at least a portion of the input area, processing image data from the images to identify a plurality of targets for the at least two pointers within the input area, and analyzing the plurality of targets to resolve a real location associated with each pointer. | 01-13-2011 |
20130257822 | METHOD FOR GENERALLY CONTINUOUSLY CALIBRATING AN INTERACTIVE INPUT SYSTEM - A method for generally continuously calibrating an interactive input system, the interactive input system comprising at least two imaging devices having fields of view encompassing a region of interest, at least one of the imaging devices calibrated using a projection matrix having an associated quality metric, the method comprises estimating new values for parameters of the projection matrix based on a plurality of computed locations of at least one pointer brought into proximity with the region of interest; calculating a new quality metric using the new parameter values; and if the new quality metric is more accurate than the existing quality metric, updating the projection matrix using the new parameter values. | 10-03-2013 |
Patent application number | Description | Published |
20090078674 | Reactive Ion Etching Process for Etching Metals - A method of etching a metal by a reactive ion etching process is provided. The etchant gas chemistry for the reactive ion etching process consists essentially of NH | 03-26-2009 |
20090078675 | METHOD OF REMOVING PHOTORESIST - A method of photoresist removal is provided. The method employs a plasma formed from a gas chemistry comprising NH | 03-26-2009 |
20090095709 | METHOD OF ETCHING INK SUPPLY CHANNEL WITH HYDROPHILIC SIDEWALLS - A method of etching an ink supply channel for an inkjet printhead. The method comprises simultaneous etching and passivation processes. A single etching and passivating gas plasma comprises: (a) a passivating gas comprising oxygen; (b) an inert sputtering gas; (c) a fluorinated etching gas; and (d) a hydrophilizing dopant. The resultant ink supply channel has relatively hydrophilic sidewalls. | 04-16-2009 |
20090301999 | Method Of Forming An Ink Supply Channel - A method of forming an ink supply channel for an inkjet printhead comprises the steps of: (i) providing a wafer having a frontside and a backside; (ii) etching a plurality of frontside trenches into the frontside; (iii) filling each of the trenches with a photoresist plug; (iv) forming nozzle structures on the frontside using MEMS fabrication processes; (v) etching a backside trench from the backside, the backside trench meeting with one or more of the plugs; (vi) removing a portion of each photoresist plug via the backside trench by subjecting the backside to a biased oxygen plasma etch, thereby exposing sidewall features in the backside trench; (vii) modifying the exposed sidewall features; and (viii) removing the photoresist plugs to form the ink supply channel. The ink supply channel connects the backside to the frontside. | 12-10-2009 |
20110024389 | METHOD OF ETCHING BACKSIDE INK SUPPLY CHANNELS FOR AN INKJET PRINTHEAD - A method of etching backside ink supply channels for an inkjet printhead. The method includes the steps of: (a) attaching a frontside of the printhead to a handle wafer; (b) etching the backside of the printhead using an anisotropic DRIE process to form a plurality of ink supply channels, the DRIE process including alternating etching and passivation steps, the passivation steps depositing a polymeric coating on sidewalls of the ink supply channels; and (c) removing the polymeric coating by etching the backside of the printhead in a biased plasma etching chamber using an O | 02-03-2011 |
20110049091 | METHOD OF REMOVING PHOTORESIST AND ETCH-RESIDUES FROM VIAS - A method of photoresist removal with concomitant de-veiling is provided. The method employs a plasma formed from a gas chemistry comprising O | 03-03-2011 |