Patent application number | Description | Published |
20110055966 | Environmental Stress-Inducible 996 Promoter Isolated from Rice and Uses Thereof - The present invention relates to environmental stress-inducible 996 promoter isolated from rice, a recombinant plant expression vector comprising said promoter, a method of producing a target protein by using said recombinant plant expression vector, a method of producing a transgenic plant using said recombinant plant expression vector, a transgenic plant produced by said method, a method of improving resistance of a plant to environmental stress by using said promoter, and a primer set for amplification of said promoter. | 03-03-2011 |
20110055967 | ENVIRONMENTAL STRESS-INDUCIBLE 972 PROMOTER ISOLATED FROM RICE AND USES THEREOF - The present invention relates to environmental stress-inducible 972 promoter isolated from rice, a recombinant plant expression vector comprising said promoter, a method of producing a target protein by using said recombinant plant expression vector, a method of producing a transgenic plant using said recombinant plant expression vector, a transgenic plant produced by said method, a method of improving resistance of a plant to environmental stress by using said promoter, and a primer set for amplification of said promoter. | 03-03-2011 |
20120023614 | ENVIRONMENTAL STRESS-INDUCIBLE 557 PROMOTER ISOLATED FROM RICE AND USES THEREOF - The present invention relates to environmental stress-inducible 557 promoter isolated from rice, a recombinant plant expression vector comprising said promoter, a method of producing a target protein by using said recombinant plant expression vector, a method of producing a transgenic plant using said recombinant plant expression vector, a transgenic plant produced by said method, a method of improving resistance of a plant to environmental stress by using said promoter, and a primer set for amplification of said promoter. | 01-26-2012 |
Patent application number | Description | Published |
20110285890 | CAMERA MODULE - A camera module has a lens unit including a lens, a first chip having an image region on which an image is formed from light having passed through the lens unit, a housing enclosing side surfaces of the lens unit and the first chip, a second chip and at least one printed circuit board. The chips are mounted to the at least one printed circuit board. | 11-24-2011 |
20110304763 | IMAGE SENSOR CHIP AND CAMERA MODULE HAVING THE SAME - An image sensor chip, a camera module, and devices incorporating the image sensor chip and camera module include a light receiving unit on which light is incident, a logic unit provided to surround the light receiving unit, and an electromagnetic wave shielding layer formed on the logic unit and not formed on the light receiving unit. | 12-15-2011 |
20110316144 | FLEXIBLE HEAT SINK HAVING VENTILATION PORTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A heat sink includes a first adhesive layer, and a heat dissipation layer disposed on the first adhesive layer, and has ventilation ports that extend therethrough including through the first adhesive layer and the heat dissipation layer. The heat sink forms an outermost part of a semiconductor package. Thus, when the heat sink is bonded via its adhesive layer to underlying structure during a manufacturing process, the ventilation ports allow air to pass therethrough. As a result, air is not trapped in the form of bubbles between the heat sink and the underlying structure. | 12-29-2011 |
20130057559 | DISPLAY DEVICES - A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis. | 03-07-2013 |
20130135823 | SEMICONDUCTOR PACKAGES USABLE WITH A MOBILE DEVICE - A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip positioned on a front surface of the circuit board and electrically connected to the conductive wirings, a cover including at least an opening, and to cover the integrated circuit chip such that a flow space is provided around the integrated circuit chip and the opening communicates with the flow space, and an air flow generator positioned on the cover to generate a compulsory air flow through the flow space and the opening, thereby dissipating heat out of the semiconductor package from the integrated circuit chip by the compulsory air flow. | 05-30-2013 |
20130155653 | DISPLAY DEVICES, AND DISPLAY AND ELECTRONIC SYSTEMS INCLUDING THE DISPLAY DEVICES - A display device may include a chassis, a flexible printed circuit board on the chassis, a semiconductor device on the flexible printed circuit board, and a supporting element on the flexible printed circuit board. The semiconductor device may be spaced apart from the supporting element. The supporting element may be configured to maintain contact between the chassis and the flexible printed circuit board. | 06-20-2013 |
20140184312 | SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF - An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device. | 07-03-2014 |
Patent application number | Description | Published |
20140054556 | ORGANIC LIGHT-EMITTING DIODE AND METHOD OF FABRICATING THE SAME - An organic light-emitting diode includes an anode on a substrate; a first hole transporting layer on the anode; a second hole transporting layer on the first hole transporting layer and corresponding to the red and green pixel areas; a first emitting material pattern of a first thickness on the second hole transporting layer and corresponding to the red pixel area; a second emitting material pattern of a second thickness on the second hole transporting layer and corresponding to the green pixel area; a third emitting material pattern of a third thickness on the first hole transporting layer and corresponding to the blue pixel area; an electron transporting layer on the first, second and third emitting material patterns; and a cathode on the electron transporting layer, wherein the second thickness is less than the first thickness and greater than the third thickness. | 02-27-2014 |
20140117315 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Discussed is an organic light emitting display device. The organic light emitting display device includes a substrate in which red, green, and blue pixel areas are defined, a first electrode and a first hole transporting layer that are formed on the substrate, first to third emission common layers formed in each of the pixel areas on the first hole transporting layer, and an electron transporting layer and a second electrode that are formed on the third emission common layer. Accordingly, color mixture is prevented, limitations due to a defective mask are overcome, a process is simplified, and the manufacturing cost is saved. | 05-01-2014 |
20140363913 | ORGANIC LIGHT-EMITTING DIODE AND METHOD OF FABRICATING THE SAME - An organic light-emitting diode includes an anode on a substrate; a first hole transporting layer on the anode; a second hole transporting layer on the first hole transporting layer and corresponding to the red and green pixel areas; a first emitting material pattern of a first thickness on the second hole transporting layer and corresponding to the red pixel area; a second emitting material pattern of a second thickness on the second hole transporting layer and corresponding to the green pixel area; a third emitting material pattern of a third thickness on the first hole transporting layer and corresponding to the blue pixel area; an electron transporting layer on the first, second and third emitting material patterns; and a cathode on the electron transporting layer, wherein the second thickness is less than the first thickness and greater than the third thickness. | 12-11-2014 |
20150263075 | METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DISPLAY DEVICE - A method of manufacturing an organic light emitting display device. The method according to one embodiment includes forming a first electrode over a substrate in which red, green, and blue pixel areas are defined; forming a first hole transporting layer on the first electrode; forming a second hole transporting layer in a position corresponding to the red pixel area; forming a first emission common layer; forming a third hole transporting layer on the first emission common layer in a position corresponding to the green pixel area; forming a second emission common layer; forming a fourth hole transporting layer on the second emission common layer in a position corresponding to the blue pixel area; forming a third emission common layer; forming an electron transporting layer on the third emission common layer; and forming a second electrode on the electron transporting layer. | 09-17-2015 |
20150263304 | ORGANIC LIGHT EMITTING DISPLAY DEVICE - An organic light emitting display device including, according to one embodiment, a substrate having first, second, and third pixel areas; a first hole transporting layer on the substrate; a first emission common layer on the first transport layer; a second emission common layer on the first emission common layer; a third emission common layer on the second emission common layer; a second hole transporting layer between the first hole transporting layer and the first emission common layer, the second hole transporting layer disposed on the first pixel area; a third hole transporting layer between the first and second emission common layers, the third hole transporting layer disposed on the second pixel area; and a fourth hole transporting layer between the second and third emission common layers, the fourth hole transporting layer disposed on the third pixel area. | 09-17-2015 |