Patent application number | Description | Published |
20100313590 | LIQUID-COOLED COOLING APPARATUS, ELECTRONICS RACK AND METHODS OF FABRICATION THEREOF - Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure. | 12-16-2010 |
20100326628 | CONDENSER FIN STRUCTURES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided herein which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel when the thermally conductive base structure is in the operational orientation and the vapor condenser is facilitating vapor condensate formation. | 12-30-2010 |
20100328882 | DIRECT JET IMPINGEMENT-ASSISTED THERMOSYPHON COOLING APPARATUS AND METHOD - Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device. | 12-30-2010 |
20100328888 | COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN - A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material. | 12-30-2010 |
20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING - Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins. | 12-30-2010 |
20100328890 | CONDENSER STRUCTURES WITH FIN CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant. | 12-30-2010 |
20100328891 | CONDENSER BLOCK STRUCTURES WITH CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block. | 12-30-2010 |
20110056225 | CONTROL OF SYSTEM COOLANT TO FACILITATE TWO-PHASE HEAT TRANSFER IN A MULTI-EVAPORATOR COOLING SYSTEM - A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature. | 03-10-2011 |
20110056674 | SYSTEM AND METHOD FOR FACILITATING PARALLEL COOLING OF LIQUID-COOLED ELECTRONICS RACKS - A cooling system and method are provided for facilitating cooling of multiple liquid-cooled electronics racks. The cooling system includes a main system coolant supply loop with a plurality of system coolant supply branch lines for facilitating supply of cooled system coolant to the electronics racks, and a main system coolant return loop with a plurality of system coolant return branch lines for facilitating return of exhausted system coolant from the electronics racks. When operational, cooled system coolant circulates through the coolant supply loop and exhausted system coolant circulates through the coolant return loop. A plurality of modular cooling units are coupled to the coolant supply loop and coolant return loop. Each modular cooling unit includes a heat exchanger to facilitate cooling of a portion of the exhausted coolant circulating through the main system coolant return loop for return as cooled system coolant to the main system coolant supply loop. | 03-10-2011 |
20110058637 | PRESSURE CONTROL UNIT AND METHOD FACILITATING SINGLE-PHASE HEAT TRANSFER IN A COOLING SYSTEM - A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature. | 03-10-2011 |
20110060470 | COOLING SYSTEM AND METHOD MINIMIZING POWER CONSUMPTION IN COOLING LIQUID-COOLED ELECTRONICS RACKS - A cooling system and method are provided for facilitating cooling of a liquid-cooled electronics rack. The cooling system includes a coolant flow controller, a modular cooling unit and a pressure controller. The flow controller is associated with a respective electronics rack and controls flow of coolant through that electronics rack based on its changing cooling requirements. The cooling unit includes an adjustable coolant pump for facilitating supply of coolant to the rack. The pressure controller is associated with the cooling unit for controlling pressure of coolant at an output of the cooling unit via control of pump speed of the pump. Responsive to adjusting coolant flow through the electronics rack, the pressure controller automatically adjusts pump speed of the adjustable pump to maintain pressure about a constant coolant pressure set point at an output of the cooling unit, thereby conserving power while still cooling the liquid-cooled electronics rack. | 03-10-2011 |
20140047702 | THERMAL EXPANSION-ENHANCED HEAT SINK FOR AN ELECTRONIC ASSEMBLY - A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component. | 02-20-2014 |
20140048233 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 02-20-2014 |
20140048242 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 02-20-2014 |
20140049919 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 02-20-2014 |
20140053575 | CONTAMINANT SEPARATOR FOR A VAPOR-COMPRESSION REFRIGERATION APPARATUS - Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant. | 02-27-2014 |
20140068942 | VAPOR CONDENSER WITH THREE-DIMENSIONAL FOLDED STRUCTURE - A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels. | 03-13-2014 |
20140068943 | THERMOELECTRIC-ENHANCED AIR AND LIQUID COOLING OF AN ELECTRONIC SYSTEM - Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink. | 03-13-2014 |
20140078672 | ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE - Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module. | 03-20-2014 |
20140082942 | WICKING AND COUPLING ELEMENT(S) FACILITATING EVAPORATIVE COOLING OF COMPONENT(S) - A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component. | 03-27-2014 |
20140085817 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140096386 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 04-10-2014 |
20140096387 | HEAT SINK STRUCTURE WITH A VAPOR-PERMEABLE MEMBRANE FOR TWO-PHASE COOLING - A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s). | 04-10-2014 |
20140102668 | VAPOR-COMPRESSION REFRIGERATION APPARATUS WITH BACKUP AIR-COOLED HEAT SINK AND AUXILIARY REFRIGERANT HEATER - Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state. | 04-17-2014 |
20140198452 | DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES - Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces. | 07-17-2014 |
20140238640 | THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FACILITATING COOLING OF ELECTRONICS CARD(S) - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure. | 08-28-2014 |
20140240930 | THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FACILITATING COOLING OF ELECTRONICS CARD(S) - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s). | 08-28-2014 |
20140246174 | THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S) - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths. | 09-04-2014 |
20140247555 | SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE - Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to an electronics card which operatively inserts into an electronic system. The thermal transfer structure includes a clamping structure movable between opened and clamped positions. A coolant-cooled structure, which is associated with the electronic system within which the electronics card is operatively inserted, resides between the electronics card and, at least partially, the clamping structure with insertion of the electronics card into the electronic system. The opened position of the clamping structure facilitates docking of the electronics card within the electronic system with the coolant-cooled structure between the card and, at least partially, the clamping structure, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the card to the coolant-cooled structure. | 09-04-2014 |
20140254098 | MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - A coolant-cooled electronic module is provided which includes a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 09-11-2014 |
20140307389 | SEPARABLE AND INTEGRATED HEAT SINKS FACILITATING COOLING MULTI-COMPNENT ELECTRONIC ASSEMBLY - Cooling apparatuses and methods of fabrication thereof are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink. | 10-16-2014 |
20150036288 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust. | 02-05-2015 |
20150047809 | FABRICATING THERMAL TRANSFER STRUCTURE(S) AND ATTACHMENT MECHANISM(S) FOR COOLING ELECTRONICS CARD(S) - Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided, which include providing a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The method further includes providing a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and providing a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure. | 02-19-2015 |
20150052753 | SELECTIVE CLAMPING OF ELECTRONICS CARD TO COOLANT-COOLED STRUCTURE - Methods of fabricating cooling apparatuses are provided which include: providing a thermal transfer structure configured to couple to an electronics card, the thermal transfer structure including a clamping structure movable between opened and clamped positions; and providing a coolant-cooled structure configured to reside within, and be associated with a receiving slot of, an electronic system within which the electronics card operatively inserts, the coolant-cooled structure residing between the electronics card and, at least partially, the clamping structure when the transfer structure is coupled to the electronics card and the card is operatively inserted into the receiving slot, wherein the opened position facilitates insertion of the electronics card into the electronic system, and movement of the clamping structure to the clamped position facilitates clamping of the thermal transfer structure to the coolant-cooled structure, and thermal conduction of heat from the electronics card to the coolant-cooled structure. | 02-26-2015 |
20150052754 | FABRICATING THERMAL TRANSFER AND COOLANT-COOLED STRUCTURES FOR COOLING ELECTRONICS CARD(S) - Methods of fabricating cooling apparatuses and coolant-cooled electronic assemblies are provided which include: coupling a thermal transfer structure configured to one or more sides of an electronics card having one or more electronic components to be cooled, the thermal transfer structure including a thermal spreader coupled to the one side of the electronics card; and disposing a coolant-cooled structure adjacent to the socket of the electronic system, the coolant-cooled structure including one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket, and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s). | 02-26-2015 |
20150053388 | FABRICATING THERMAL TRANSFER STRUCTURE WITH IN-PLANE TUBE LENGTHS AND OUT-OF-PLANE TUBE BEND(S) - Methods of fabricating cooling apparatuses are provided, which include providing a thermal transfer structure configured to couple to and cool one or more electronic components. The thermal transfer structure includes a thermal spreader, and at least one coolant-carrying tube coupled to the thermal spreader. The coolant-carrying tube(s) includes multiple tube lengths disposed substantially in a common plane, and an out-of-plane tube bend. The out-of-plane tube bend is couples in fluid communication first and second tube lengths of the multiple tube lengths, and extends out-of-plane from the multiple tube lengths disposed in the common plane. The first and second tube lengths may be spaced apart, with a third tube length disposed between them, and the coolant-carrying tube(s) further includes an in-plane tube bend which couples in fluid communication the third tube length and a fourth tube length of the multiple tube lengths. | 02-26-2015 |
20150055299 | FABRICATING MULTI-COMPONENT ELECTRONIC MODULE WITH INTEGRAL COOLANT-COOLING - Methods for fabricating a coolant-cooled component assembly are provided, which include providing a multi-component assembly and a module lid with openings aligned over respective electronic components. Thermally conductive elements are disposed within the openings, each including opposite coolant-cooled and conduction surfaces, with the conduction surface being thermally coupled to the respective electronic component. A manifold assembly disposed over the module lid includes inner and outer manifold elements, with the inner element configured to facilitate flow of coolant onto the coolant-cooled surfaces. The outer manifold element is disposed over the inner manifold element and coupled to the module lid, with the inner and outer manifold elements defining a coolant supply manifold, and the outer manifold element and module lid defining a coolant return manifold. The coolant supply openings are in fluid communication with the coolant supply manifold, and the coolant exhaust channels are in fluid communication with the coolant return manifold. | 02-26-2015 |
20150062804 | VALVE CONTROLLED, NODE-LEVEL VAPOR CONDENSATION FOR TWO-PHASE HEAT SINK(S) - Apparatuses are provided for cooling an electronic component(s), which include a heat sink coupled to the electronic component(s), and having a coolant-carrying channel for a first coolant. The first coolant provides two-phase cooling to the electronic component(s), and is discharged from the heat sink as coolant exhaust, which includes coolant vapor. The apparatus further includes a node-level condensation module coupled to the heat sink to receive the coolant exhaust. The condensation module is cooled via a second coolant, and facilitates condensing the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module. A control valve adjusts a flow rate of the second coolant of the node-level condensation module, with the valve being automatically controlled by the controller based on a characterization of the coolant vapor in the coolant exhaust. | 03-05-2015 |
20150075755 | FABRICATING SEPARABLE AND INTEGRATED HEAT SINKS FACILITATING COOLING MULTI-COMPONENT ELECTRONIC ASSEMBLY - Methods of fabricating cooling apparatus are provided which facilitate cooling a multi-component assembly, such as a hub module assembly. The cooling apparatus includes a first liquid-cooled heat sink configured to facilitate removal of heat generated by one or more first electronic components of the multi-component assembly, and a second liquid-cooled heat sink configured to facilitate removal of heat generated by one or more second electronic components of the multi-component assembly. The first liquid-cooled heat sink is separably coupled to the multi-component assembly, and the second liquid-cooled heat sink is fixedly secured to the multi-component assembly. Fluid couplers fluidically couple the first and second liquid-cooled heat sinks to facilitate liquid coolant flow through the fixedly-secured, second liquid-cooled heat sink from the separably-coupled, first liquid-cooled heat sink. | 03-19-2015 |