Patent application number | Description | Published |
20090273124 | NANOIMPRINTING METHOD AND MOLD FOR USE IN NANOIMPRINTING - A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other. | 11-05-2009 |
20100072653 | IMPRINTING APPARATUS AND METHOD THEREFOR - There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel. | 03-25-2010 |
20100072664 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto. | 03-25-2010 |
20100072667 | IMPRINTING METHOD - An imprinting method for depositing resins to a substrate, bringing a mold into contact with the resins, and transferring a pattern formed on the mold to the resins includes a first imprinting process for transferring the pattern to a first resin and a second imprinting process for forming the pattern on a second resin in an area adjacent to an area formed during the first imprinting process. The amount of the second resin to be deposited during the second imprinting process is different from that of the first resin used during the first imprinting process so that a gap between the area formed during the first imprinting process and an area to be formed during the second imprinting process is filled. | 03-25-2010 |
20100078840 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An apparatus for pressing resin on a shot region of a substrate and a mold to each other to form a resin pattern on the shot region, including: a mold chuck; an X-Y stage including a substrate chuck, the resin held by the substrate chuck and mold held by the mold chuck being pressed to each other in a Z-axis direction; a dispenser for dispensing the resin on the shot region; a scope for measuring, in an X-Y plane, a position of a substrate mark formed in each of a plurality of shot regions of the substrate held by the substrate chuck; and a reference mark formed on the X-Y stage. The X-Y stage has a moving range allowing the dispenser to dispense the resin on all shot regions of the substrate, and the position of the reference mark can be measured within the moving range of the X-Y stage. | 04-01-2010 |
20130152390 | PROCESS FOR PRODUCING A LIQUID EJECTION HEAD - Provided is a process for producing a liquid ejection head which includes a substrate having an energy generating element and a wall member joined with the substrate to form an ejection orifice which ejects liquid and a flow path which communicates to the ejection orifice, the process including, in the following order, the steps of (B) forming, on the substrate, a flow path pattern form for forming the flow path, (C) forming, around the flow path pattern form, a cover resin layer for forming the wall member, and (D) transferring a surface form of the substrate to a surface of the cover resin layer so as to correspond to a pattern of the surface form of the substrate. | 06-20-2013 |
20140349086 | PHOTO-CURABLE COMPOSITION AND PATTERNING METHOD USING THE SAME - The present invention provides a photo-curable composition that requires a small demolding force. The present invention also provides a UV imprint method that requires a small demolding force. | 11-27-2014 |
20150086755 | PHOTOCURED PRODUCT - To provide a photocured product having small mold releasing force. A photocured product obtained by curing with light and containing a surface active agent, wherein a peak area of the ether bond derived peak is 3.0 times or more as large as a peak area of the ester bond derived peak, wherein the peak areas are obtained by peak separation processing by curve fitting of an X-ray photoelectron spectroscopy spectrum obtained as an analytical result on a chemical state of carbon at topmost surface of the photocured product, the analytical result being among analytical results on the topmost surface of the photocured product obtained by surface analysis of the photocured product with angle resolved X-ray photoelectron spectroscopy. | 03-26-2015 |