Patent application number | Description | Published |
20120250392 | DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME - A data holding device includes a loop structure unit configured to hold data using a plurality of logic gates connected in a loop shape, a nonvolatile storage unit including a plurality of ferroelectric elements, the nonvolatile storage unit configured to store the data held in the loop structure unit in a nonvolatile manner using hysteresis characteristics of the ferroelectric elements, and a circuit separation unit configured to electrically separate the loop structure unit and the nonvolatile storage unit. The ferroelectric elements of the nonvolatile storage unit are surrounded by a dummy element smaller in width than the ferroelectric elements. | 10-04-2012 |
20140362632 | DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME - A data holding device includes a loop structure unit configured to hold data using a plurality of logic gates connected in a loop shape, a nonvolatile storage unit including a plurality of ferroelectric elements, the nonvolatile storage unit configured to store the data held in the loop structure unit in a nonvolatile manner using hysteresis characteristics of the ferroelectric elements, and a circuit separation unit configured to electrically separate the loop structure unit and the nonvolatile storage unit. The ferroelectric elements of the nonvolatile storage unit are surrounded by a dummy element smaller in width than the ferroelectric elements. | 12-11-2014 |
20150103580 | DATA HOLDING DEVICE AND LOGIC OPERATION CIRCUIT USING THE SAME - A data holding device includes a loop structure unit configured to hold data using a plurality of logic gates connected in a loop shape, a nonvolatile storage unit including a plurality of ferroelectric elements, the nonvolatile storage unit configured to store the data held in the loop structure unit in a nonvolatile manner using hysteresis characteristics of the ferroelectric elements, and a circuit separation unit configured to electrically separate the loop structure unit and the nonvolatile storage unit. The ferroelectric elements of the nonvolatile storage unit are surrounded by a dummy element smaller in width than the ferroelectric elements. | 04-16-2015 |
Patent application number | Description | Published |
20130119406 | SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFACTURING THEM - A silicon carbide substrate includes a base layer made of silicon carbide, silicon carbide layers made of single-crystal silicon carbide and arranged side by side on the base layer when viewed in plan view, and a filling portion made of silicon carbide and filling a gap formed between the adjacent silicon carbide layers. The filling portion has a surface roughness of not more than 50 μm in RMS value. | 05-16-2013 |
20130249008 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor chip, a second semiconductor chip, a gate electrode terminal, and a die pad. The first semiconductor chip has a first gate electrode pad and a second gate electrode pad electrically connected to the first gate electrode pad. The second semiconductor chip has a gate electrode pad connected to the second gate electrode pad via a wiring. The gate electrode terminal is connected to the first gate electrode pad of the first semiconductor chip via a wiring. The die pad has a chip mounting surface for mounting the first and second semiconductor chips. | 09-26-2013 |
20130256920 | SEMICONDUCTOR DEVICE - A semiconductor device in one embodiment includes a chip-mount substrate, a first semiconductor chip mounted on the chip-mount substrate, and a second semiconductor chip mounted adjacent to the first semiconductor chip on the chip-mount substrate. | 10-03-2013 |
20130264697 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip, a die pad having a chip mount surface for mounting the semiconductor chip, and an electrode terminal for connecting with the semiconductor chip through first and second wirings. The electrode terminal has a first surface including a connection point with the first wiring and a second surface including a connection point with the second wiring. The connection point with the first wiring is located at a first height from a reference plane extending from the chip mount surface. The connection point with the second wiring is located at a second height different from the first height from the reference plane. | 10-10-2013 |
20130270706 | SEMICONDUCTOR DEVICE - A semiconductor device according to an embodiment includes: first and second semiconductor chips, each including a first electrode and a second electrode opposite to each other in a predetermined direction; a chip-mount substrate on which the first and second semiconductor chips are mounted; and a first wiring terminal to which the second electrodes of the first and second semiconductor chips are connected. The second semiconductor chip lies over the first semiconductor chip in the predetermined direction such that the second electrode of the first semiconductor chip and the second electrode of the second semiconductor chip face each other across the first wiring terminal, and the chip-mount substrate is bent such that the first electrode of the first semiconductor chip is connected to the first electrode of the second semiconductor chip. | 10-17-2013 |
20140001481 | SEMICONDUCTOR DEVICE | 01-02-2014 |
20150294919 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device which can improve its reliability and a method for manufacturing the same are provided. A semiconductor device ( | 10-15-2015 |
Patent application number | Description | Published |
20130286592 | ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS - A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body. | 10-31-2013 |
20140237805 | METHOD OF MANUFACTURING MOUNTING MEMBER AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - The method of the invention includes: placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member; adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent; and cooling the base member and the frame member from the curing temperature. The frame member in the state is warped so that a flatness error of the frame member after having been cooled becomes smaller than that in a case where the frame member is flat in the state. | 08-28-2014 |
20150255383 | MOUNTING MEMBER, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MODULE - A mounting member includes a plurality of internal connecting portions, each of which is electrically connected to an electronic device, and a plurality of external connecting portions, each of which is soldered, wherein the plurality of external connecting portions include a first connecting portion in communication with at least any of the plurality of internal connecting portions, and a second connecting portion different from the first connecting portion, and surfaces of the first connecting portion and the second connecting portion include gold layers, and a thickness of the gold layer of the second connecting portion is smaller than a thickness of the gold layer of the first connecting portion. | 09-10-2015 |
Patent application number | Description | Published |
20080309787 | PHASE ADJUSTMENT DEVICE AND DIGITAL CAMERA - In a phase adjustment device according to the present invention, a first luminance level detector detects a luminance level of a digital imaging signal in a first pixel region, a second luminance level detector detects a luminance level of the digital imaging signal in a second pixel region, a data comparator compares detection results by the first and second luminance level detectors, an adjustment judger judges if it is necessary to adjust a phase of a pulse based on a result of the comparison by the data comparator, a timing adjuster shifts the phase of the pulse in the second pixel region when the luminance levels are detected, and further, the timing adjuster adjusts the phase of the pulse when the judgment by the adjustment judger indicates that the phase adjustment is necessary. | 12-18-2008 |
20110141282 | INTERSECTION SITUATION RECOGNITION SYSTEM - An image pickup device that picks up an image of a direction not visible from a vehicle that is about to enter an intersection, and transmits the picked-up image to the vehicle is installed in the vicinity of a blind intersection. In addition, an in-vehicle device that receives the image from the image pickup device, and displays the image on a display device is mounted in the vehicle. The in-vehicle device retrieves an image pickup device identification number of an image pickup device installed at the intersection that the vehicle is about to enter and transmits the retrieved image pickup device identification number to the image pickup device and, only when an image pickup device identification number received from the image pickup device together with an intersection image and the retrieved image pickup device identification number match with each other, the in-vehicle device displays the received intersection image. | 06-16-2011 |
20110267452 | IMAGE COMPRESSING APPARATUS, IMAGE COMPRESSING METHOD AND VEHICLE-MOUNTED IMAGE RECORDING APPARATUS - A road shape recognition device checks a position of a currently travelling vehicle detected by a position detection device with map information so that a road shape at each travelling spot of the currently travelling vehicle is recognized. An image division device divides a display screen of surrounding image data of the currently travelling vehicle into a plurality of divided regions depending on the road shape and sets a data compression rate suitable for the road shape in each of the plurality of divided regions. An image compression device compresses the surrounding image data in each of the plurality of divided regions into codes based on the data compression rate set for each of the divided regions. | 11-03-2011 |