Patent application number | Description | Published |
20080301932 | Substrate Processing Apparatus and Mounter - The final-bonder ( | 12-11-2008 |
20090288777 | TAPE SPLICING APPARATUS AND ATTACHING APPARATUS - Provided is an apparatus capable of easily splicing ACF tapes that are thin and are hard to handle. The tape splicing apparatus splices two ACF tapes ( | 11-26-2009 |
20090321006 | APPARATUS AND METHOD FOR APPLYING ADHESIVE SHEET - The apparatus for applying adhesive sheets includes a sheet applying base which is placed on a placement base so as to be withdrawable from the placement base and which has a sheet applying region to which adhesive sheets closely before and after a junction portion is to be applied. In the sheet applying base, an upstream-side end portion of the sheet applying region in the adhesive sheet feed direction is placed so as to confront an end portion of the sheet applying head, and moreover a sheet escaping space opened downward is set in place. | 12-31-2009 |
20100126654 | WORKING APPARATUS, APPARATUS FOR APPLYING ADHESIVE TAPE, AND TAPE MEMBER ADDING METHOD - In adhesive tape applying process for transferring, along a tape transfer path, a tape member with an adhesive tape applied on one side of a release tape, cutting the adhesive tape into a specified length, peeling the adhesive tape from the release tape, and applying the adhesive tape to a substrate, the process includes: placing a terminal end portion of an in-use first tape member and a leading end portion of a newly added second tape member in superimposition on each other in their thicknesswise direction by an apparatus for applying adhesive tape; and pressuring and heating a superposition region of end portions of the first and second tape members at least partly in a widthwise direction of the tape members to partly fuse and join together the terminal end portion of the first tape member and the leading end portion of the second tape member at their superposition regions. | 05-27-2010 |
20120097313 | TAPE APPLYING APPARATUS - A base is removably mounted to a holder mounted on a frame. A feed reel for feeding a tape member formed by lamination of a separator and anisotropic conductive tape, and a wind-up reel which is placed coaxial with the feed reel and which serves for winding up the tape member of which the anisotropic conductive tape has been press-applied to the board by a press-applying head mounted on the holder are mounted on the base. | 04-26-2012 |
20120312461 | TAPE ADHERING APPARATUS AND TAPE ADHERING METHOD - It is an objective of the invention to provide a tape adhering apparatus and a tape adhering method that enable shortening of a time consumed by operation for adhering one cut piece of an ACF tape. After a cut piece | 12-13-2012 |
20120318445 | TAPE APPLYING DEVICE, TAPE HOLDING UNIT, AND TAPE APPLYING METHOD - A tape applying device for applying electrically conductive tape onto a board includes: a applying head for pressing the conductive tape; a tape holding unit including a reel section having a feed reel for feeding the conductive tape laminated with a separator and a wind-up reel to which the separator is to be wound up, and a tape guide section for guiding the conductive tape along with the separator to a position of pressing by the applying head; and a base section which has a tape guide driving unit for moving up and down the tape guide section, and to and from which the tape holding unit is fittable and removable. The tape guide section, while in a fitted state of being fitted to the base section, is separated from the reel section and moved up and down by driving force of the tape guide driving unit. | 12-20-2012 |
20130269870 | TAPE ADHERING DEVICE AND TAPE ADHERING METHOD - The pressing tool and the ACF tape cutting device are linked and connected with each other by a link device, and the forcing member is caused to move relatively towards and away from the knife member by lifting up and down the pressing tool so as to form a cut. By allowing the tool lifting device to double as a drive device for causing the forcing member to move relatively towards and away from the knife member, the necessity of the actuator of the ACF tape cutting device which is needed in the related art tape adhering device can be obviated. | 10-17-2013 |
Patent application number | Description | Published |
20110006309 | EPITAXIAL SiC SINGLE CRYSTAL SUBSTRATE AND METHOD OF MANUFACTURE OF EXPITAXIAL SiC SINGLE CRYSTAL SUBSTRATE - An epitaxial SiC single crystal substrate including a SiC single crystal wafer whose main surface is a c-plane or a surface that inclines a c-plane with an angle of inclination that is more than 0 degree but less than 10 degrees, and SiC epitaxial film that is formed on the main surface of the SiC single crystal wafer, wherein the dislocation array density of threading edge dislocation arrays that are formed in the SiC epitaxial film is 10 arrays/cm | 01-13-2011 |
20120146056 | SILICON CARBIDE EPITAXIAL WAFER AND MANUFACTURING METHOD THEREFOR - Provided is a silicon carbide epitaxial wafer, the entire surface of which is free of step bunching. Also provided is a method for manufacturing said silicon carbide epitaxial wafer. The provided method for manufacturing a silicon carbide semiconductor device includes: a step wherein a 4H—SiC single-crystal substrate having an off-axis angle of 5° or less is polished until the lattice disorder layer on the surface of the substrate is 3 nm or less; a step wherein, in a hydrogen atmosphere, the polished substrate is brought to a temperature between 1400° C. and 1600° C. and the surface of the substrate is cleaned; a step wherein silicon carbide is epitaxially grown on the surface of the cleaned substrate as the amounts of SiH | 06-14-2012 |
20120280254 | SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME - According to the present invention, there is provided an SiC epitaxial wafer which reduces triangular defects and stacking faults, which is highly uniform in carrier concentration and film thickness, and which is free of step bunching, and its method of manufacture. The SiC epitaxial wafer of the present invention is an SiC epitaxial wafer in which an SiC epitaxial layer is formed on a 4H—SiC single crystal substrate that is tilted at an off angle of 0.4°-5°, wherein the density of triangular-shaped defects of said SiC epitaxial layer is 1 defect/cm | 11-08-2012 |
20130009170 | EPITAXIAL SiC SINGLE CRYSTAL SUBSTRATE AND METHOD OF MANUFACTURE OF EPITAXIAL SiC SINGLE CRYSTAL SUBSTRATE - An epitaxial SiC single crystal substrate including a SiC single crystal wafer whose main surface is a c-plane or a surface that inclines a c-plane with an angle of inclination that is more than 0 degree but less than 10 degrees, and SiC epitaxial film that is formed on the main surface of the SiC single crystal wafer, wherein the dislocation array density of threading edge dislocation arrays that are formed in the SiC epitaxial film is 10 arrays/cm | 01-10-2013 |
20140175461 | SIC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME - Provided are a SiC epitaxial wafer in which the surface density of stacking faults is reduced, and a manufacturing method thereof. The method for manufacturing such a SiC epitaxial wafer comprises a step of determining a ratio of basal plane dislocations (BPD), which causes stacking faults in a SiC epitaxial film of a prescribed thickness which is formed on a SiC single crystal substrate having an off angle, to basal plane dislocations which are present on a growth surface of the SiC single crystal substrate, a step of determining an upper limit of surface density of basal plane dislocations on the growth surface of a SiC single crystal substrate used based on the above ratio, and a step of preparing a SiC single crystal substrate which has surface density equal to or less than the above upper limit, and forming a SiC epitaxial film on the SiC single crystal substrate under the same conditions as the growth conditions of the epitaxial film used in the step of determining the ratio. | 06-26-2014 |
20140339571 | SILICON CARBIDE EPITAXIAL WAFER AND MANUFACTURING METHOD THEREFOR - A SiC epitaxial wafer obtained by forming a SiC epitaxial layer on a 4H—SiC single-crystal substrate that is tilted at an off-angle of 0.4° to 5°, wherein linear density of step bunchings, which are connected to shallow pits which are due to screw dislocation in the SiC epitaxial wafer, is 5 mm | 11-20-2014 |
Patent application number | Description | Published |
20100253715 | DISPLAY DEVICE, AND METHODS FOR MANUFACTURING AND CONTROLLING THE DISPLAY DEVICE - A display device corrects uneven luminance due to uneven element characteristics by simple measurement and correction with a low cost. The display device includes pixels that each include a light emitter and a driver. Data lines supply a voltage signal to the driver of each pixel. A data line driver supplies the voltage signal to each data line. A first memory stores, for each pixel, a luminance gain for adjusting a luminance corresponding to a video signal to a standard luminance. A second memory stores conversion curve information representing a representative conversion curve common to the pixels. A corrector converts, for each pixel, the luminance into a corresponding standard luminance value based on a corresponding luminance gain stored in the first memory, while a converter converts, for each pixel, the corresponding standard luminance into a corresponding voltage signal based on the conversion information stored in the second memory. | 10-07-2010 |
20100259527 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND DRIVING METHOD - A display device includes data lines and pixels. Each pixel includes a driving transistor, a switch between one of the data lines and a gate of the driving transistor, and a luminescence element connected to the driving transistor. A first circuit path former flows a first test current from the one of the data lines through the first transistor and a second test current from the one of the data lines through the luminescence element. A second circuit path former generates a first voltage and a second voltage in the one of the data lines. The first voltage corresponds to a gate voltage of the first transistor generated by the first test current. The second voltage corresponds to a luminescence voltage of the luminescence element generated by the second test current. A voltage detector detects the first voltage and the second voltage in the one of the data lines. | 10-14-2010 |
20120176362 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND DRIVING METHOD - An electronic device is described. The device includes a substrate for a luminescence panel that includes data lines and pixels in which a luminescence element can be formed. Each pixel includes a driving transistor that converts a signal voltage from a data line into a signal current, and a first switch between the data line and the gate of the driving transistor. The device includes a first circuit to flow a test current from the data line through the driving transistor, a second circuit to generate a voltage on the data line corresponding to a gate voltage on the driving transistor generated by the test current, and a voltage detector to detect the voltage in the data line. | 07-12-2012 |
20130021389 | ORGANIC EL DISPLAY APPARATUS AND METHOD OF FABRICATING ORGANIC EL DISPLAY APPARATUS - A method of fabricating an organic EL display apparatus includes: obtaining a representative current (I)-voltage (V) characteristic of a display panel including pixels each having an organic EL device and a driving transistor; dividing the display panel into a plurality of divided regions, and calculating a light-emitting efficiency and a light-emission starting current value for each of the divided regions calculated by a luminance (L)-I characteristic of the divided region; measuring luminance of light emitted from each of the pixels and calculating an L-V characteristic of each of the pixels; calculating an I-V characteristic of each pixel by dividing each luminance value of the L-V characteristic calculated for the pixel by light-emitting efficiency, and by adding a light-emission starting current value; and calculating a correction parameter for each pixel such that the I-V characteristic of each pixel is corrected to the representative I-V characteristic. | 01-24-2013 |
20130027383 | ORGANIC EL DISPLAY APPARATUS AND METHOD OF FABRICATING ORGANIC EL DISPLAY APPARATUS - A method of fabricating an organic EL display apparatus includes: obtaining a representative current (I)-voltage (V) characteristic of a display panel including pixels each having an organic EL device and a driving transistor; dividing the display panel into a plurality of divided regions, and calculating a light-emitting efficiency and an offset luminance value for each of the divided regions calculated by an I-luminance (L) characteristic of the divided region; measuring luminance of light emitted from each of the pixels and calculating an L-V characteristic of each of the pixels; calculating an L-V characteristic of each divided region by dividing each current value of the representative I-V characteristic by light-emitting efficiency, and by adding an offset luminance value; and calculating a correction parameter for each pixel such that the L-V characteristic of each pixel is corrected to the L-V characteristic of the divided region including the pixel. | 01-31-2013 |
20130093651 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND DRIVING METHOD - A display device is described. The device includes an active-matrix luminescence panel that has data lines and pixels for determining luminescence of the pixels. Each pixel includes a driving transistor that converts a signal voltage from a data line into a signal current, and a first switch between the data line and the gate of the driving transistor. The device includes a test current generator to supply a test current to one of the data lines, a voltage detector to detect the voltage of one of the data lines, and a controller to control switches, the test current generator and the voltage detector. | 04-18-2013 |
Patent application number | Description | Published |
20130157689 | TERMINAL-COUNT ESTIMATION DEVICE AND TERMINAL-COUNT ESTIMATION METHOD - A number-of-terminals estimation device includes: a location data acquisition unit to acquire location data which are a collection of multiple pieces of location information including location registration information; a first presence count estimation unit to estimate a first presence count to be the number of terminals in observation area during observation period, based on the location data; a signal removal unit to extract location data in accordance with a type of location data from the location data; a second presence count estimation unit to estimate a second presence count to be the number of terminals in observation area during observation period, based on extracted location data; and a third presence count estimation unit to estimate a third presence count to be the number of terminals in observation area during observation period, based on one or both of first and second presence counts. | 06-20-2013 |
20130173346 | INFORMATION ANALYSIS DEVICE AND INFORMATION ANALYSIS METHOD - An information analysis device includes: a receiving unit for receiving a location registration signal including a sector ID, location registration time information and a user ID subjected to location registration; an extracting unit for extracting a location registration signal of which the location registration time is immediately preceding a target time and a location registration signal of which the location registration time is immediately following the target time, from the location registration signal for each user; and a population distribution calculation unit for calculating population distribution by sector at the target time based on location registration time information and a location corresponding to the sector ID in the location registration signal immediately preceding the target time for each user, location registration time information and a location corresponding to the sector ID in the location registration signal immediately following the target time for each user, and the target time. | 07-04-2013 |
20130288707 | INFORMATION PROCESSING DEVICE AND METHOD FOR ESTIMATING NUMBER OF TERMINALS - An information processing device and a method for estimating a number of terminals, which can accurately count a number of mobile terminals in an analysis target region of which address attribute is an adjacent region, taking the intake phenomenon into account. A terminal counting portion counts numbers of first and second position information pieces. An intake coefficient calculation portion calculates an intake coefficient based on the numbers of position information pieces. An intaked terminal calculation portion calculates a number of intaked terminals based on the counted number of position information pieces at an analysis target time and the calculated intake coefficient, subtracts the number of intaked terminals from the number of position information pieces, and calculates an estimated number of mobile terminals. | 10-31-2013 |