Patent application number | Description | Published |
20100017245 | RESERVATION MANAGEMENT - A method, information processing system, and computer program product managing reservations of items. A request to reserve an item is received from a first user. The request includes a specification of at least one of a date and a time for a first reservation of the item. A determination is made that a second user holds a prior reservation for the item that conflicts with the first reservation. A determination is made that the second user is no longer requires the prior reservation. The prior reservation is released in response to determining that the second user no longer requires the prior reservation. The first reservation as specified by the request is allowed in response to the releasing and in response to the receiving from the first user the request. | 01-21-2010 |
20110314397 | MODERATOR CONTROL FOR MANAGING DELEGATES OF AN ELECTRONIC COMMUNICATION SESSION - Within a communication system, a real time communication session comprising a set of participants and a session moderator can be defined. At least a portion of the participants can be geographically remote from each other and can be communicatively linked via networked computing devices, each enabling participation with the real-time communication session. It can be determined that one of the participants is not able to participate in the real time communication session. At least one delegate able to substitute for the one participant subject to approval of the moderator can be ascertained. The ascertained delegate can be substituted for the one participant for the real-time communication session. | 12-22-2011 |
20120127263 | MULTIPOINT CONFERENCE SCALABILITY FOR CO-LOCATED PARTICIPANTS - A terminal device associated with a participant of the multipoint session can be identified. The multipoint session can be associated with a video and an audio stream. The terminal device can be a computing device comprising of an audio and video input, and a video output. The multipoint session can be a conference associated with a telephony session. The location of the terminal device and a conferencing device can be determined. The conferencing device can be associated with an audio input and output. If the terminal device is proximate to the conferencing device, a terminal device audio stream can be terminated and a conference device audio stream can be received. A video stream and an audio stream can be simultaneously presented upon the audio and video output of the conferencing device and terminal device. The video and the audio stream can be a synchronized stream of the session. | 05-24-2012 |
20120236110 | MULTIPOINT CONFERENCE SCALABILITIY FOR CO-LOCATED PARTICIPANTS - A terminal device associated with a participant of the multipoint session can be identified. The multipoint session can be associated with a video and an audio stream. The terminal device can be a computing device comprising of an audio and video input, and a video output. The multipoint session can be a conference associated with a telephony session. The location of the terminal device and a conferencing device can be determined. The conferencing device can be associated with an audio input and output. If the terminal device is proximate to the conferencing device, a terminal device audio stream can be terminated and a conference device audio stream can be received. A video stream and an audio stream can be simultaneously presented upon the audio and video output of the conferencing device and terminal device. The video and the audio stream can be a synchronized stream of the session. | 09-20-2012 |
20150371317 | Smart Order Management - An approach is provided for smart order management. Smart utensils measure consumption of a meal by a customer. The smart utensils include at least one processor to perform the measuring and a transmitter that transmits data corresponding to the measured consumption. The smart utensils transmit the measurement to a restaurant data collection device. The approach predicts, based on the measuring, a completion time of the meal by the customer and notifies restaurant staff members of the predicted completion time. | 12-24-2015 |
Patent application number | Description | Published |
20150381576 | Multi-tenant secure separation of data in a cloud-based application - Multi-tenant and single-tenant methodologies are blended into a single solution to provide cost savings of multi-tenancy along with data security and privacy of a single-tenant environment. The cloud infrastructure is partitioned to include a first set of servers, and a second set of servers. The first set of servers are dedicated to a first operation, such as data presentation, while the second set of servers are dedicated to a second operation, such as data processing. The first set is operated in a multi-tenant operating mode, while the second set is operated in a single-tenant operating mode. Thus, the first set is available for general use, presenting data from any of the server(s) in the second set. The second set, in contrast, is dedicated to individual tenants. Preferably, each tenant has dedicated server(s) in the second set, which functions like a traditional, single-tenant environment providing inherent security and privacy guarantees. | 12-31-2015 |
20150381590 | Multi-tenant secure separation of data in a cloud-based application - Multi-tenant and single-tenant methodologies are blended into a single solution to provide cost savings of multi-tenancy along with data security and privacy of a single-tenant environment. The cloud infrastructure is partitioned to include a first set of servers, and a second set of servers. The first set of servers are dedicated to a first operation, such as data presentation, while the second set of servers are dedicated to a second operation, such as data processing. The first set is operated in a multi-tenant operating mode, while the second set is operated in a single-tenant operating mode. Thus, the first set is available for general use, presenting data from any of the server(s) in the second set. The second set, in contrast, is dedicated to individual tenants. Preferably, each tenant has dedicated server(s) in the second set, which functions like a traditional, single-tenant environment providing inherent security and privacy guarantees. | 12-31-2015 |
Patent application number | Description | Published |
20100052174 | COPPER PAD FOR COPPER WIRE BONDING - An integrated circuit package comprising an integrated circuit that includes transistors coupled to copper interconnect structures. The integrated circuit package also comprises copper pads located on the integrated circuit and directly contacting uppermost ones of the copper interconnect structures. Each of copper pads has a thickness of at least about 2 microns. The integrated circuit package further comprises copper wires pressure-welded directly to the copper pads. | 03-04-2010 |
20100243300 | Soldering Method and Related Device for Improved Resistance to Brittle Fracture - A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions. | 09-30-2010 |
20100244276 | THREE-DIMENSIONAL ELECTRONICS PACKAGE - An electronics package | 09-30-2010 |
20120153430 | INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS - A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously. | 06-21-2012 |
20120153492 | METHOD OF FABRICATION OF THROUGH-SUBSTRATE VIAS - A method of manufacturing a through-substrate-via structure. The method comprises providing a substrate having a front-side and an opposite back-side. A through-substrate via opening is formed in the front-side of the substrate. The through-substrate-via opening does not penetrate an outer surface of the back-side of the substrate. The through-substrate-via opening is filled with a solid fill material. Portions of the substrate from the outer surface of the back-side of the substrate are removed to thereby expose the fill material. At least portions of the exposed fill material are removed to form a back-side through-substrate via opening that traverses an entire thickness of the substrate. The back-side through-substrate via opening is filled with an electrically conductive material. | 06-21-2012 |
20120280023 | SOLDERING METHOD AND RELATED DEVICE FOR IMPROVED RESISTANCE TO BRITTLE FRACTURE - A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions. | 11-08-2012 |
20140220760 | INTEGRATION OF SHALLOW TRENCH ISOLATION AND THROUGH-SUBSTRATE VIAS INTO INTEGRATED CIRCUIT DESIGNS - A method of manufacturing an IC, comprising providing a substrate having a first side and a second opposite side, forming a STI opening in the first side of the substrate and forming a partial TSV opening in the first side of the substrate and extending the partial TSV opening. The extended partial TSV opening is deeper into the substrate than the STI opening. The method also comprises filling the STI opening with a first solid material and filling the extended partial TSV opening with a second solid material. Neither the STI opening, the partial TSV opening, nor the extended partial TSV opening penetrate an outer surface of the second side of the substrate. At least either: the STI opening and the partial TSV opening are formed simultaneously, or, the STI opening and the extended partial TSV opening are filled simultaneously. | 08-07-2014 |
20140312495 | FAN OUT INTEGRATED CIRCUIT DEVICE PACKAGES ON LARGE PANELS - A method of manufacturing an integrated circuit package. The method comprises providing a carrier substrate having a planar surface. The method comprises placing a plurality of semiconductor device dies active-side down at laterally spaced-apart locations on the planar surface. The method comprises covering the semiconductor device dies with a mold compound to define laterally spaced-apart mold sub-arrays on the planar surface. The method comprises curing the laterally spaced-apart mold sub-arrays, wherein the semiconductor device dies are retained at substantially the same laterally spaced-apart locations on the planar surface after the curing. | 10-23-2014 |
Patent application number | Description | Published |
20090098687 | Integrated circuit package including wire bonds - It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 μm or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion. | 04-16-2009 |
20090273078 | Electronic packages - Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics. | 11-05-2009 |
20090298286 | Method of making electronic entities - Many electronic entities such as integrated circuits and discrete power devices have contact pads formed from successively deposited layers of nickel and a second metal such as gold. The resulting pad structure is used to make external electrical connection such as solder connection. Problems associated with failure of such connections are avoidable by inspecting the surface of the nickel layer for excessive small particle formation. | 12-03-2009 |
20100022034 | Manufacture of devices including solder bumps - Typical testing of solder joints, (e.g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly. | 01-28-2010 |