Patent application number | Description | Published |
20080258285 | Simplified Substrates for Semiconductor Devices in Package-on-Package Products - An insulating sheet-like substrate ( | 10-23-2008 |
20090032939 | METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE - A method of forming a stud bump over passivation, and related device. At least some of the illustrative embodiments are methods comprising depositing a first passivation layer over a semiconductor die, depositing a capping metal layer over the first passivation layer (the capping metal layer comprises a capping metal pad), and depositing a stud bump onto the capping metal pad. | 02-05-2009 |
20090057889 | Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling - One aspect of the invention provides a semiconductor device that includes a microchip having an outermost surface. First and second bond pads are located on the microchip and near the outermost surface. A first UBM contact is located on the outermost surface and between the first and second bond pads. The first UBM contact is offset from the first bond pad. A second UBM contact is located on the outermost surface and between the first and second bond pads. The second UBM contact is offset from the second bond pad, and a capacitor supported by the microchip is located between the first and second UBM contacts. | 03-05-2009 |
20090115072 | BGA Package with Traces for Plating Pads Under the Chip - A semiconductor flip-chip ball grid array package ( | 05-07-2009 |
20090166889 | PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS - Packaged integrated circuits having surface mount devices and methods to form the same are disclosed. A disclosed method comprises attaching an integrated circuit to a first side of a substrate, forming one or more first conductive elements on the substrate, attaching a surface mount device to a second side of the substrate via the first conductive elements, forming one or more second conductive elements on the second side of the substrate. | 07-02-2009 |
20090206455 | INTEGRATED CIRCUIT STACKED PACKAGE PRECURSORS AND STACKED PACKAGED DEVICES AND SYSTEMS THEREFROM - A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads. | 08-20-2009 |
20090289362 | Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias - A high-frequency BGA device ( | 11-26-2009 |
20090315156 | PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME - Example packaged integrated circuit (IC) chips having conformal electromagnetic shields and methods to form the same are disclosed. A disclosed packaged IC chip comprises an IC attached to a first surface of a substrate, the substrate having a conductive pad on the first surface, a first conductive element electrically coupled to the conductive pad on the first surface of the substrate, a molding compound to encapsulate the IC and the first conductive element, the molding compound exposing a surface of the first conductive element, a conformal electromagnetic shield on the molding compound in electrical contact with the exposed surface of the first conductive element, and an externally exposed second conductive element attached to a second surface of the substrate, the second conductive element in electrical contact with the first conductive element. | 12-24-2009 |
20100006987 | INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD - An integrated circuit (IC) device ( | 01-14-2010 |
20120013003 | BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP - A semiconductor flip-chip ball grid array package with one-metal-layered substrate. The sites of a two-dimensional array become usable for attaching solder balls of the signal (non-common net assignment) I/O type to the substrate under the chip area, when the sites can be routed for metal plating. The space to place a maximum number of signal routing traces is opened up by interrupting the periodicity of the site array from the edge of the substrate towards the center under the chip. The periodicity is preferably interrupted by depopulating entire aligned lines and rows of the two-dimensional array. | 01-19-2012 |
20120015478 | Integrated Circuit Stacked Package Precursors and Stacked Packaged Devices and Systems Therefrom - A package-on-package (POP) package precursor and packaged devices and systems therefrom includes an electronic substrate including electrically conductive layers and a top surface. A first portion of the top surface has an IC die attached thereon. A second portion of the top surface has a plurality of first attach pads on opposing sides of the IC die for electrically coupling to a first electronic device on top of the IC die. At least a third portion of the top surface is positioned laterally with respect to the first and second portion. The third portion includes a plurality of second attach pads for electrically coupling to at least a second electronic device. At least one of the electrically conductive layers includes a coupling trace that couples at least one of the plurality of second attach pads to the IC die and/or one or more of the plurality of first attach pads. | 01-19-2012 |