Patent application number | Description | Published |
20100012365 | PRINTED CIRCUIT BOARD - A printed circuit board includes first and second connector pads, first and second connection components, and first, second, and third transmission lines. A method for supporting two connectors on the printed circuit board is also provided. The printed circuit board is capable of supporting different types of connectors by setting the first and second connection components on the printed circuit board. | 01-21-2010 |
20100237961 | DIFFERENTIAL SIGNAL TRANSMISSION CABLE AND METHOD FOR COMPENSATING LENGTH OFFSET THEREOF - A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship. | 09-23-2010 |
20100243310 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer, a ground layer, a through hole, and a conductor. The through hole goes through the power layer and the ground layer. The conductor includes a hollow columnar main body and an extending portion. The main body is formed in a bounding wall of the through hole, and is conductively connected to one of the power layer and the ground layer, and insulated from the other one of the power layer and the ground layer by an insulation area. The extending portion extends out from the circumferential surface of the main body. The extending portion extends into the insulation area and is insulated from the other one of the power layer and the ground layer, to increase an area of the power layer facing the ground layer. | 09-30-2010 |
20100271149 | HIGH-FREQUECY MODULE FOR WIRELESS COMMUNICATIONS - A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer. | 10-28-2010 |
20100283697 | ELECTRONIC DEVICE AND MULTI-FREQUENCY ANTENNA THEREOF - An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap. | 11-11-2010 |
20100328181 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line | 12-30-2010 |
20110025434 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor. | 02-03-2011 |
20110037556 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first layer, a second layer, a number of vias each passing through the first and second layers, and a number of transmission lines. Each transmission line is connected between bonding pads of the two of the number of vias to form a helical-shaped transmission path by the vias and the transmission lines. As a result, the printed circuit board can generate inductive effect. | 02-17-2011 |
20110050365 | SIGNAL TRANSMISSION APPARATUS - A signal transmission apparatus includes a first ground layer, a second ground layer and a band pass filter. The band pass filter includes a first transmission line positioned in a void defined in the first ground layer and a second transmission line positioned in a void defined in the second ground layer. Each of the first transmission line and the second transmission line includes a coil with a plurality of turns spirally extending in the same plane, a gasket extending from the coil and located in the center of the coil, and a signal terminal extending from extremity of the coil. According to employing the band pass filter, the signal transmission apparatus has filtering function, therefore, quality of signals transmitted through the signal transmission apparatus is improved. | 03-03-2011 |
20110051793 | SYSTEM AND METHOD FOR EVALUATING PERFORMANCE OF A MIMO ANTENNA SYSTEM - A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system. | 03-03-2011 |
20110094786 | PRINTED CIRCUIT BOARD - A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity. | 04-28-2011 |
20110266046 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI. | 11-03-2011 |
20110266047 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference. | 11-03-2011 |
20110273245 | PRINTED CIRCUIT BOARD AND COMMON MODE FILTER THEREOF - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollowing patterns on the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines on the ground layer. Each of the two filter portions includes a number of long narrow parallel strips connected in a snake like pattern. Hollowed areas of the two filter portions are bridged through a void. | 11-10-2011 |
20110297413 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference. | 12-08-2011 |
20110297435 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a ventilation plate. The ventilation plate defines a number of through holes. Two hollow bulges extend from an edge bounding each of the through holes at two opposite sides of the plate. A top of each of the bulges defines an opening. The openings of the two bulges and the corresponding through hole define a passage for ventilation and elongate a path that electromagnetic signals must travel to pass through the ventilation plate. The enclosure can better shield the electronic device from EMI. | 12-08-2011 |
20110297438 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI. | 12-08-2011 |
20110298341 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole. | 12-08-2011 |
20110298563 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines. | 12-08-2011 |
20110299263 | ENCLOSURE OF ELECTRONIC DEVICE - An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device. | 12-08-2011 |
20110309898 | PRINTED CIRCUIT BOARD - A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void. | 12-22-2011 |
20110320183 | COMPUTING DEVICE AND METHOD FOR ANALYZING DIFFERENTIAL TRANSMISSION LINES PORT RELATIONSHIPS - A computing device and a method determines port relationships of a differential transmission line of a circuit board according to an original scattering parameters file, which records scattering parameter values measured from ports of the differential transmission line under different signal frequencies. The computing device generates a new scattering parameters file matching a scattering parameters model predefined for the differential transmission line according to the determined port relationships. Design of the differential transmission line is analyzed to determine if the differential transmission line is qualified according to the new scattering parameters file and the scattering parameters model. | 12-29-2011 |
20120000700 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces. | 01-05-2012 |
20120005388 | HIGH SPEED DATA STORAGE SYSTEM - An exemplary high speed data storage system includes hard disks, a first control panel, a second control panel and a midplane interconnected between each of the first and second control panels and the hard disks. Each of the first and second control panels includes a control chip and a connector. First and second printed circuit wires corresponding to the hard disks are layered on the first and second control panels for electrically connecting the control chip with the connector, respectively. The first printed circuit wires of the first control panel and the second printed circuit wires of the second control panel are arranged symmetrically with respect to each other, and an order of stacking circuit layers of the first printed circuit wires of the first control panel is the reverse of an order of stacking of circuit layers of the second printed circuit wires of the second control panel. | 01-05-2012 |
20120125679 | PRINTED CIRCUIT BOARD HAVING DIFFERENTIAL VIAS - A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads. | 05-24-2012 |
20120145448 | PRINTED CIRCUIT BOARD WITH COMPOUND VIA - A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon. | 06-14-2012 |
20120197583 | ELECTRONIC DEVICE AND METHOD FOR AUTOMATICALLY TESTING PRINTED CIRCUIT BOARDS - A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures. | 08-02-2012 |
20130006561 | COMPUTING DEVICE, STORAGE MEDIUM, AND METHOD FOR ANALYZING SIGNAL GROUP DELAY OF PRINTED CIRCUIT BOARD - In a method for analyzing a signal group delay of a printed circuit board (PCB) using a computing device, the computing device connects to a signal measuring device that measures S-parameters from a pair of data signal line and clock signal line of the PCB. The method analyzes a differential loss coefficient of the data signal line and the clock signal line based on the S-parameters, and calculates a first signal delay of the data signal line and a second signal delay of the clock signal line according to the differential loss coefficient. The method further analyzes a signal group delay of the PCB according to the first signal delay and the second signal delay, and displays the signal group delay on a display device if the signal group delay does not satisfy a PCB design specification. | 01-03-2013 |
20130093530 | MARCHAND BALUN CIRCUIT - A Marchand balun circuit includes a Marchand balun, an unbalanced matching circuit, and a balanced matching circuit. The Marchand balun includes an unbalanced terminal, and two balanced terminals. The unbalanced matching circuit includes a first and the second impedances which are connected between the unbalanced terminal and ground in series, and a first resistor which is connected between ground and a connection node of the first and the second impedances. The balanced matching circuit includes a third and a fourth impedances which are connected between one balanced terminal and ground in series, a fifth and a sixth impedance which are connected between the other balanced terminal and ground in series, a second resistor which is connected between ground and a connection node of the third and the fourth impedances, and a third resistor which is connected between ground and a connection node of the fifth and the sixth impedances. | 04-18-2013 |
20130151732 | ELECTRONIC DEVICE AND PORT REDUCING METHOD - An exemplary port reducing method is for removing unselected ports of an original S-parameter file and generating an optimized S-parameter file. The method controls a display unit to display a user interface to receive commands from a user in response to user operation; the commands comprise a calling command, a selecting command, and an executing command. The method obtains the original S-parameter file in response to the calling command Next, the method determines which of the ports of the original S-parameter file are unselected in response to the selecting command, and connects each unselected port to the ground through one terminal impedance. The method then generates an optimized S-parameter file that comprises only the selected ports in response to the executing command. | 06-13-2013 |
20130222082 | EQUALIZER FOR MULTI-LEVEL EQUALIZATION - An equalizer includes a first delay module, a second delay module, a first amplitude module, a second amplitude module, and a combining unit. The first delay module receives a first signal and delays the first received signal for a preset period, and the first amplitude module transfers the first delayed signal to transmit a first weighted signal with a first peak amplitude. Similarly, the second delay module receives the first delayed signal and delays the second received signal for the preset period, and the second amplitude module transfers the second delayed signal to transmit a second weighted signal with a second peak amplitude. The combining unit combines an input signal and the first and the second weighted signals together to generate an equalized signal. | 08-29-2013 |
20130284508 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a power layer and a signal layer. A signal line is arranged on the signal layer. A power via extends through the power layer and the signal layer, and is electrically connected to the power layer and the signal layer. A number of through holes is defined in the PCB, through the power layer and the signal layer, and arranged between the signal line and the power via. The through holes are insulated from the power via. The inside wall of the power via is made of conductive material. | 10-31-2013 |
20140060914 | ENCLOSURE WITH SHIELD APPARATUS - An enclosure includes a sidewall defining a number of first vents and a shield apparatus installed to the sidewall. The shield apparatus includes a shield plate spaced from the sidewall. A distance between the sidewall and the shield plate is greater than a size of the first vent. The shield plate defines a number of second vents respectively aligning with the first vents. | 03-06-2014 |