Ricotta
Gesueldo Ricotta, Lincolnwood, IL US
Patent application number | Description | Published |
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20160003500 | EVAPORATOR AND METHODS OF USING SAME - An evaporator and methods of using the same are described herein. A vapor-compression refrigeration apparatus in accordance with an embodiment of the present technology utilizes a fluid refrigerant and can include a compressor, a condenser, an expansion device and an evaporator arranged in succession and in fluid communication within a closed loop in order to circulate the fluid refrigerant. The apparatus can include at least one line within the closed loop in operable communication with the condenser for reducing temperature of at least a portion of the fluid refrigerant coming from the condenser prior to the fluid refrigerant entering the expansion device. | 01-07-2016 |
John P. Ricotta, Kenmore, NY US
Patent application number | Description | Published |
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20140374927 | COMBINED COLLECTOR AND DISTRIBUTOR - A combined collector and distributor for a distillation column that includes a collector portion connected to a distributor portion. The distributor portion includes a channel-like distributor to distribute liquid into an underlying packing The collector portion has spaced rows of collection elements that cover the open spaces and distribution elements of the distributor portion and one or more rectangular sumps into which descending liquid drains from the collection elements. The liquid in turn drains from the rectangular sump or sumps into a pre-distribution box located within a header of the distributor portion. The collection elements that cover the open spaces are set at higher positions than the collection elements covering the distribution elements to form chimneys to allow the ascending vapor to escape from the collector portion. | 12-25-2014 |
20150174505 | COMBINED COLLECTOR AND DISTRIBUTOR - A combined collector and distributor for a distillation column that includes a collector portion connected to a distributor portion. The distributor portion includes a channel-like distributor to distribute liquid into an underlying packing. The collector portion has spaced rows of collection elements that cover the open spaces and distribution elements of the distributor portion and one or more rectangular sumps into which descending liquid drains from the collection elements. The liquid in turn drains from the rectangular sump or sumps into a pre-distribution box located within a header of the distributor portion. The collection elements that cover the open spaces are set at higher positions than the collection elements covering the distribution elements to form chimneys to allow the ascending vapor to escape from the collector portion. | 06-25-2015 |
Joseph A. Ricotta, Golden, CO US
Patent application number | Description | Published |
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20150337218 | System and Method for Oil and Condensate Processing - A system and method for the on-site separating and treating of a hydrocarbon liquid stream at an oil and gas production site is disclosed. The system comprises an oil and condensate distillation unit and a vapor recovery unit. In one embodiment, the oil and condensate distillation unit operates at low pressure or vacuum conditions to reduce the vapor pressure above the column of oil within the tubing, thereby increasing the production of oil and condensate and capturing entrained natural gas otherwise lost or burned off. The system further functions to improve the quality and volume of recovered natural gas and to decrease air pollution, in addition to increasing oil and condensate production at the well site. | 11-26-2015 |
Mark S. Ricotta, Tempe, AZ US
Patent application number | Description | Published |
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20130334680 | WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS - A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips. | 12-19-2013 |
20140275915 | IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER - The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit. | 09-18-2014 |
20140277223 | IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER - The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps. | 09-18-2014 |
20150342060 | SYSTEMS FOR ENCAPSULATING A HYBRID ASSEMBLY OF ELECTRONIC COMPONENTS AND ASSOCIATED METHODS - During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system. | 11-26-2015 |