Patent application number | Description | Published |
20110264196 | Stents for Prosthetic Heart Valves - A stented valve including a stent structure having a generally tubular body portion, an interior area, a longitudinal axis, an first end, an second end, and an outer surface; at least one outflow barb extending from the outer surface of the stent adjacent to the first end of the stent structure and toward the second end of the stent structure; at least one inflow barb extending from the outer surface of the stent adjacent to the second end of the stent structure and toward the first end of the stent structure; and a valve structure attached within the interior area of the stent structure. | 10-27-2011 |
20110301702 | Transcatheter Delivery System and Method with Controlled Expansion and Contraction of Prosthetic Heart Valve - A delivery system for use with a prosthetic heart valve having a stent frame to which a valve structure is attached, includes a shaft assembly including a distal end and a coupling structure disposed near the distal end and configured to be coupled to a distal end of the prosthetic heart valve. The system includes a sheath assembly defining a lumen sized to slidably receive the shaft assembly. The delivery system is configured to transition from a loaded state in which the sheath assembly encompasses the prosthetic heart valve to a deployed state in which the sheath assembly is withdrawn from the prosthetic heart valve. The coupling structure is configured to provide a controlled expansion or contraction of the distal end of the prosthetic heart valve based on longitudinal movement of the distal end of the shaft assembly. | 12-08-2011 |
20130282113 | Valve Prosthesis - Heart valve prostheses are provided having a self-expanding frame that supports a valve body comprising a skirt and a plurality of coapting leaflets. The self-expanding frame includes an inflow section, a valve section, and an outflow section. The outflow section forms attachment loops in a collapsed configuration to attach the frame to a delivery system. | 10-24-2013 |
20140100653 | Stents For Prosthetic Heart Valves - A stented valve including a stent structure having a generally tubular body portion, an interior area, a longitudinal axis, an first end, an second end, and an outer surface; at least one outflow barb extending from the outer surface of the stent adjacent to the first end of the stent structure and toward the second end of the stent structure; at least one inflow barb extending from the outer surface of the stent adjacent to the second end of the stent structure and toward the first end of the stent structure; and a valve structure attached within the interior area of the stent structure. | 04-10-2014 |
20140142693 | Valve Prosthesis Frames - A prosthesis can include a collapsible, reexpandable frame comprising first, second, and third sets of struts that define first and second rows of expandable cells. In some embodiments, the struts of the first, second, and third set of struts can be tapered. In some embodiments, the frame can include an intermediate section and an inflow section that is proximal to the intermediate section. The inflow section can include a concave saddle portion that is adjacent the intermediate section, and an outwardly flared portion. | 05-22-2014 |
20140200660 | Valve Prosthesis Frames - A prosthesis can include a collapsible, reexpandable frame comprising first, second, and third sets of struts that define first and second rows of expandable cells. In some embodiments, the struts of the first, second, and third set of struts can be tapered. In some embodiments, the frame can include an intermediate section and an inflow section that is proximal to the intermediate section. The inflow section can include a concave saddle portion that is adjacent the intermediate section, and an outwardly flared portion. | 07-17-2014 |
20140277419 | Anti-Paravalvular Leakage Component for a Transcatheter Valve Prosthesis - A transcatheter valve prosthesis includes an expandable tubular stent, a prosthetic valve within the stent, and an anti-paravalvular leakage component coupled to and encircling the stent which includes a plurality of self-expanding struts and an annular sealing membrane. Each strut has a first end coupled to a distal end of the stent and a second end not coupled to the stent. Each anti-paravalvular leakage component is moveable between a compressed configuration and a deployed configuration. In the compressed configuration, each strut extends distally away from the distal end of the stent. In the deployed configuration, each strut extends proximally away from the distal end of the stent. In an embodiment hereof, the deployed strut has a C-shape and is twisted such that the C-shape lies in a plane substantially along or tangential with the outer surface of the stent. In another embodiment hereof, the deployed strut is rolled-up and extends radially away from the outer surface of the stent. | 09-18-2014 |
Patent application number | Description | Published |
20110098805 | TRANSCATHETER VALVE DELIVERY SYSTEMS AND METHODS - Delivery devices and methods for percutaneously delivering a prosthetic valve to the heart of a patient. These prosthetic valves may be configured to provide complimentary features that promote optimal placement of the prosthetic valve in a native heart valve, such as the aortic valve, mitral valve, pulmonic valve, and/or tricuspid valve. The delivery device includes a release sheath assembly housed within an outer delivery sheath. A release sheath component of the assembly captures a portion of the prosthetic valve to the delivery device, and effectuates complete release of the prosthetic valve with retraction of the outer sheath. | 04-28-2011 |
20110238168 | Stents for Prosthetic Heart Valves - A prosthetic valve including a wire frame having a generally tubular body portion, an interior area, a longitudinal axis, a first end comprising a plurality of crowns, and a second end comprising a greater number of crowns than the first end. The wire frame includes a plurality of adjacent rows of modified diamond-shaped structures extending between the first and second ends. The prosthetic valve further includes a valve structure that includes a plurality of leaflets and that is attached within the interior area of the wire frame. | 09-29-2011 |
20130204356 | Transcatheter Valve Delivery Systems and Methods - Delivery devices and methods for percutaneously delivering a prosthetic valve to the heart of a patient. These prosthetic valves may be configured to provide complimentary features that promote optimal placement of the prosthetic valve in a native heart valve, such as the aortic valve, mitral valve, pulmonic valve, and/or tricuspid valve. The delivery device includes a release sheath assembly housed within an outer delivery sheath. A release sheath component of the assembly captures a portion of the prosthetic valve to the delivery device, and effectuates complete release of the prosthetic valve with retraction of the outer sheath. | 08-08-2013 |
Patent application number | Description | Published |
20120018525 | AEROSOL GENERATING AND DELIVERY DEVICE - Particular aspects provide novel atomizers for generating particles over a broad range of MMAD size distributions, the eliminating the requirement for an impaction baffle in generating the desired particle sizes. In particular aspects, the atomization means communicates with a remote particle filter member configured and positioned to provide for particle size filtering. In additional aspects, the atomization means communicates with a particle dispersion chamber suitable to impart a desired particle flow pattern to particles within and exiting the dispersion chamber. In further aspects, the atomization means communicates with a nasal, ocular, oral or ‘vicinity’ adapter. The novel devices provide for targeted (e.g., nasal, ocular, oral, local vicinity), systemic, and/or topical delivery of an atomized liquid (e.g., via the nasal cavity, olfactory region, and mouth). Further exemplary aspects relate to aerosolization and delivery of perfume, fragrance, essential oil or cosmeceutical agents and the like. | 01-26-2012 |
20140251320 | AEROSOL GENERATING AND DELIVERY DEVICE - Particular aspects provide novel atomizers for generating particles over a broad range of MMAD size distributions, the eliminating the requirement for an impaction baffle in generating the desired particle sizes. In particular aspects, the atomization means communicates with a remote particle filter member configured and positioned to provide for particle size filtering. In additional aspects, the atomization means communicates with a particle dispersion chamber suitable to impart a desired particle flow pattern to particles within and exiting the dispersion chamber. In further aspects, the atomization means communicates with a nasal, ocular, oral or ‘vicinity’ adapter. The novel devices provide for targeted (e.g., nasal, ocular, oral, local vicinity), systemic, and/or topical delivery of an atomized liquid (e.g., via the nasal cavity, olfactory region, and mouth). Further exemplary aspects relate to aerosolization and delivery of perfume, fragrance, essential oil or cosmeceutical agents and the like. | 09-11-2014 |
Patent application number | Description | Published |
20090212427 | Solder Structures Including Barrier Layers with Nickel and/or Copper - An electronic device may include an electronic substrate, and an under bump seed metallurgy layer on the electronic substrate. A barrier layer may be provided on the under bump seed metallurgy layer so that the under bump seed metallurgy layer is between the barrier layer and the electronic substrate, and the barrier layer may include nickel and/or copper. Moreover, portions of the under bump seed metallurgy layer may be undercut relative to portions of the barrier layer. In addition, a solder layer may be provided on the barrier layer so that the barrier layer is between the solder layer and the under bump seed metallurgy layer. | 08-27-2009 |
20140042600 | Semiconductor Package and Manufacturing Method Thereof - A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material. | 02-13-2014 |
20140147970 | SEMICONDUCTOR DEVICE USING EMC WAFER SUPPORT SYSTEM AND FABRICATING METHOD THEREOF - Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die. | 05-29-2014 |
20150041975 | SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF - A semiconductor package includes a first package comprising a circuit board and a first semiconductor die mounded on the circuit board, and a second package comprising a mounting board. At least one second semiconductor die may be mounted on the mounting board, and one or more leads may be electrically connected to the mounting board and/or the second semiconductor die. An adhesion member may bond the first package to the second package, and an encapsulant may encapsulate the first package and the second package. the circuit board, the mounting board, and the one or more leads may be arranged to surround the first semiconductor die and the second semiconductor die, and the plurality of leads may be electrically connected to the circuit board and to a constant potential or ground, to reduce the effects of external electromagnetic interference upon the semiconductor package. | 02-12-2015 |
Patent application number | Description | Published |
20080308931 | Electronic Structures Including Barrier Layers Defining Lips - Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask. | 12-18-2008 |
20110037171 | Electronic Structures Including Barrier Layers and/or Oxidation Barriers Defining Lips and Related Methods - An electronic device may include a substrate, a seed layer on the substrate, a barrier layer on the seed layer opposite the substrate, and an oxidation barrier on the barrier layer opposite the seed layer. The barrier layer and the seed layer comprise different materials, and the oxidation barrier and the barrier layer may comprise different materials. The seed layer may be undercut relative to the barrier layer and/or relative to the oxidation barrier so that the barrier layer and/or the oxidation barrier define a lip extending beyond the seed layer in a direction parallel with respect to a surface of the substrate. Related methods are also discussed. | 02-17-2011 |
20110079901 | Methods of Forming Back Side Layers For Thinned Wafers and Related Structures - A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed. | 04-07-2011 |
20110084392 | Electronic Structures Including Conductive Layers Comprising Copper and Having a Thickness of at Least 0.5 Micrometers - An electronic structure may include a conductive pad on a substrate, and an insulating layer on the substrate and on the conductive pad. The insulating layer may have a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer. A conductive layer comprising copper may be on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, and the conductive layer comprising copper may have a thickness of at least approximately 1.0 μm. A conductive barrier layer may be on the conductive layer comprising copper, and the conductive barrier layer may include at least one of nickel, platinum, palladium, and/or combinations thereof. A solder layer may be on the conductive barrier layer, the conductive layer comprising copper and the solder layer may comprise different materials, and the conductive barrier layer may be between the conductive layer comprising copper and the solder layer. | 04-14-2011 |
Patent application number | Description | Published |
20110283646 | METHOD OF MANUFACTURING A SHINGLE - A roofing shingle includes a headlap portion and a tab portion. A layer of a first granular material is adhered to a back side of the headlap portion and defines a first surface. A bead of tab sealant extends longitudinally on a back side of the tab portion. A longitudinally extending groove is formed in the first surface of the back side of the headlap portion. | 11-24-2011 |
20130025224 | WEB FOR SHINGLE WITH REINFORCED NAIL ZONE - A roofing shingle includes a substrate having a headlap portion and a tab portion. Reinforcement material is secured to the headlap portion, wherein the reinforcement material is formed from woven material. | 01-31-2013 |
20130025225 | METHOD OF SEALING OVERLAPPING INSTALLED SHINGLES - A roofing shingle includes a headlap portion and a tab portion. A bead of tab sealant extends longitudinally on a back side of the tab portion. Reinforcement material is secured to the headlap portion and includes outwardly extending attachment members configured to penetrate and mechanically bond with the tab sealant of an overlapping roofing shingle when installed on a roof. | 01-31-2013 |
20130025768 | METHOD OF MANUFACTURING A SHINGLE WITH REINFORCED NAIL ZONE - A method of manufacturing a roofing shingle includes applying an asphalt coating to a substrate to define an asphalt coated sheet, the asphalt coated sheet including a headlap portion and a tab portion. Reinforcement material is applied from a spool to the asphalt coated sheet, wherein the reinforcement material is wound in a waywind pattern on the spool. The reinforcement material is then secured to the headlap portion of the asphalt coated sheet. | 01-31-2013 |
20130025771 | METHOD OF MANUFACTURING A SHINGLE WITH REINFORCED NAIL ZONE - A method of manufacturing a roofing shingle includes applying an asphalt coating to a substrate to define an asphalt-coated sheet, the asphalt coated sheet including a headlap portion and a tab portion. Reinforcement material is secured to the headlap portion of the asphalt-coated sheet, and the amount of the asphalt coating that penetrates into the reinforcement material is controlled. | 01-31-2013 |
20140325929 | WEB FOR SHINGLE WITH REINFORCED NAIL ZONE - A roofing shingle includes a substrate having a headlap portion and a tab portion. Reinforcement material is secured to the headlap portion, wherein the reinforcement material is formed from woven material. | 11-06-2014 |