Sabatini, NY
James Sabatini, Scotia, NY US
Patent application number | Description | Published |
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20100244225 | STACKABLE ELECTRONIC PAGKAGE AND METHOD OF FABRICATING SAME - An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween. | 09-30-2010 |
20100244226 | STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME - An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween. | 09-30-2010 |
20100244235 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME - An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film, and a via is formed through the dielectric film by the die stud. | 09-30-2010 |
20100244240 | STACKABLE ELECTRONIC PACKAGE AND METHOD OF MAKING SAME - An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities. | 09-30-2010 |
20110156261 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME - An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. | 06-30-2011 |
20110210440 | STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME - An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween. | 09-01-2011 |
20120168941 | STACKABLE ELECTRONIC PACKAGE AND METHOD OF MAKING SAME - An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities. | 07-05-2012 |
20120171816 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME - An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. | 07-05-2012 |
20130344653 | STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME - An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween. | 12-26-2013 |
James Enrico Sabatini, Scotia, NY US
Patent application number | Description | Published |
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20090284374 | ACTIVATION SYSTEM AND METHOD FOR ACTIVATING AN OPTICAL ARTICLE - An equipment comprising a receptacle for receiving an optical article; a first set of electrical connectors configured to be in direct contact with a second set of electrical connectors disposed on the optical article, when the optical article is received by the receptacle; an activation device operably coupled with the first set of electrical connectors; wherein the activation device is configured to generate an activation signal which is transmitted to the second set of electrical connectors by the first set of electrical connectors, wherein an electrical device is configured to provide a power component to the optical article via the first set of electrical connectors and the second set of electrical connectors which are in direct contact. A system comprising the equipment is also provided. Also provided is a checkout device. | 11-19-2009 |
20090285083 | ACTIVATION SYSTEM AND METHOD FOR ACTIVATING AN OPTICAL ARTICLE - An optical article comprising a plurality of optically detectable marks disposed on a surface of the optical article; a removable electrical device disposed on the surface of the optical article; wherein the electrical device is operatively coupled to the optical article; and wherein the electrical device is configured to interact with an activation signal when brought in direct contact with a communication device that applies the activation signal to the electrical device. A removable electrical device is also provided. A system and a method for activation are also provided. | 11-19-2009 |
20090316565 | METHOD AND SYSTEM FOR ACTIVATION OF AN OPTICAL ARTICLE - A method for activating an optical article includes providing an optical article, wherein at least one mark is disposed on the optical article, wherein the mark comprises an optical-state change material in an initial state, the initial state preventing the optical article from being read by a player; deriving an unlock code by cryptographic operations on an optical article operatively coupled with a POS equipment and a data input from a medium encrypted with a cryptographic algorithm; deriving a toggling signal from an unlock code, and applying the toggling signal to the at least one mark resulting in changing the optical-state change material to a final state, the final state allowing the optical article to be read by the player; wherein the toggling signal comprises a set of values corresponding to the respective states of each of a plurality of marks on the surface of the optical article, and wherein applying the toggling signal results in setting each of the marks to either one of an initial state or a final state, corresponding to the value for the mark in the toggling signal. | 12-24-2009 |
20100072090 | PACKAGING FOR AN OPTICAL ARTICLE - A packaging for an optical article comprises an electrical device configured to be in contact with the optical article; and an electrical circuit element configured to interact with an activation signal provided by a communication device configured to interact with the electrical device. A system and a method of packaging are also provided. | 03-25-2010 |
20100073167 | SECURITY TAG FOR OPTICAL MEDIA AND PROCESSES FOR FABRICATION AND ATTACHMENT - An activation system for optical media in one embodiment includes a tag having at least one pair of conductors with at least one heating element coupled to the conductors. The heating element is oriented proximate one or more activation regions on the optical media, and wherein the heating element activates the optical media. The tag in one embodiment is an elongate flexible tag material with a number of conductors that couple on one end to heating elements wherein the heating elements are disposed within a media case such that they are proximate activation regions on a media article. | 03-25-2010 |
Joshua James Sabatini, White Plains, NY US
Patent application number | Description | Published |
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20080269213 | 8-Hydroxyquinoline compounds and methods thereof - The present invention relates to 8-Hydroxyquinoline Compounds; compositions comprising an 8-Hydroxyquinoline Compound; and methods for treating or preventing a metalloproteinase-related disorder, such as, an arthritic disorder, osteoarthritis, malignant neoplasm, rheumatoid arthritis, asthma, chronic obstructive pulmonary disease, atherosclerosis, age-related macular degeneration, myocardial infarction, a corneal ulceration, an ocular surface disease, hepatitis, an aortic aneurysm, tendonitis, a central nervous system disorder, abnormal wound healing, angiogenesis, restenosis, cirrhosis, multiple sclerosis, glomerulonephritis, graft versus host disease, diabetes, an inflammatory bowel disease, shock, invertebral disc degeneration, stroke, osteopenia or a periodontal disease or comprising administering an effective dose of an 8-Hydroxyquinoline Compound to a mammal in need thereof. | 10-30-2008 |
20100010012 | GLUTAMATE AGGRECANASE INHIBITORS - The present invention relates to modulators of metalloproteinase activity. | 01-14-2010 |