Sang-Duck
Sang-Duck Kim, Chungjoo-Si KR
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20110100952 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP - A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented. | 05-05-2011 |
20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 05-12-2011 |
20110186342 | SINGLE-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed. | 08-04-2011 |
Sang-Duck Kim, Suwon-Si KR
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20090011220 | Carrier and method for manufacturing printed circuit board - A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density. | 01-08-2009 |
Sang-Duck Kim, Heungduk-Gu KR
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20120244662 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 09-27-2012 |
Sang-Duck Park, Seoul KR
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20150274583 | GLASS-REINFORCING COMPOSITION AND METHOD OF MANUFACTURING TOUCHSCREEN GLASS USING THE SAME - A glass-reinforcing composition and method of using the same, the composition including 1 weight % to 20 weight % of hydrofluoric acid, 0.1 weight % to 5 weight % of ammonium fluoride, 1 weight % to 20 weight % of an inorganic acid, an organic acid, or 1 weight % to 10 weight % of an organic acid salt, and a remainder of water. | 10-01-2015 |
Sang-Duck Park, Yongin-City KR
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20150277605 | TOUCH SCREEN PANEL AND METHOD OF FABRICATING THE SAME - Disclosed is a touch screen panel, including: a glass substrate including an active area and a non-active area; enhancement layers formed on upper and lower surfaces of the glass substrate; sensing patterns disposed on a surface of one of the enhancement layers in the active area; and sensing lines disposed in the non-active area, and electrically connected with the sensing patterns. Here, a side surface of the glass substrate may include a plurality of blunt areas depressed in a shape of a curved surface. | 10-01-2015 |