Patent application number | Description | Published |
20090244513 | POSITION DETECTION APPARATUS, POSITION DETECTION METHOD, EXPOSURE APPARATUS, AND DEVICE FABRICATION METHOD - The present invention provides a position detection apparatus including a first obtaining unit configured to obtain imaging characteristics of an imaging optical system for a plurality of light beams, having different wavelength with each other, of the light having the wavelength width, a second obtaining unit configured to obtain optical images of a target object for the plurality of light beams, a restoration unit configured to restore optical images of the target object for the plurality of light beams by correcting, deterioration in the obtained optical images of the target object attributed to the imaging optical system, based on the obtained imaging characteristics of the imaging optical system, and a generation unit configured to generate an optical image of the target object for light including the plurality of light beams by synthesizing the restored optical images of the target object for the plurality of light beams. | 10-01-2009 |
20090286172 | SURFACE SHAPE MEASUREMENT APPARATUS AND EXPOSURE APPARATUS - A surface shape measurement apparatus is configured to measure a surface shape of an object to be measured, and includes a beam splitter configured to split white light from a light source into two light beams, a pair of prisms each configured to increase an incident angle of each light beam that has been split by the beam splitter and directed to the object or a reference surface, each prism having an antireflection part that is formed at a period of a wavelength of the white light or smaller and has a moth-eye shape, a superimposition unit configured to superimpose object light from the object with reference light from the reference surface and has passed the second prism, and to generate white interference light, and a Lyot filter configured to discretely separate the white interference light for each of a plurality of wavelengths. | 11-19-2009 |
20100002215 | IMAGING OPTICAL SYSTEM, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - An optical system is used in a detection unit of an exposure apparatus that projects an original pattern by exposure onto a substrate via a projection optical system. The detection unit detects a position of the substrate in the optical axis direction of the projection optical system. The optical system includes a first imaging optical system configured to form an object image in the measurement region of the substrate by oblique light incidence, and a second imaging optical system configured to focus the object image onto a light receiving unit. The following relationship is satisfied: | 01-07-2010 |
20100209828 | RETICLE MANUFACTURING METHOD, SURFACE SHAPE MEASURING APPARATUS AND SIGNAL PROCESSOR - A reticle manufacturing method of the present invention comprises the steps of holding a reference mask blank by a reference chuck to measure a surface shape of the reference mask blank as a first surface shape, holding the reference mask blank by a reticle chuck of the exposure apparatus to measure a surface shape of the reference mask blank as a second surface shape, holding the electron beam drawing mask blank by the reference chuck to measure a surface shape of the electron beam drawing mask blank as a third surface shape, calculating a difference between the measurement values of the first surface shape and the second surface shape as a first deference value, calculating, as a forth surface shape, a surface shape of the electron beam drawing mask blank held by the reticle chuck on the basis of the first deference value and the measurement value of the third surface shape, and drawing the pattern on the electron beam drawing mask blank on the basis of the forth surface shape. | 08-19-2010 |
20110310373 | LITHOGRAPHY APPARATUS AND DEVICE MANUFACTURING METHOD - A lithography apparatus includes a first measurement device which measures a position of a mark on a substrate with light, a second measurement device which measures a position of a reference mark on a stage with a charged-particle, a detector which detects the position of the stage in a first direction parallel to the axis of a projection system and a second direction perpendicular to this axis, and a controller. The controller determines a charged-particle beam, in which the angle, with respect to the first direction, at which it is incident on the reference mark falls within a tolerance, and obtains a baseline for the first measurement device from the position of the reference mark measured by the second measurement device using the determined charged-particle beam and the position of the reference mark measured by the first measurement device. | 12-22-2011 |
20130148091 | LITHOGRAPHY APPARATUS AND METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus which positions a substrate based on measurement of a position of an alignment mark on the substrate to form a pattern on the substrate. The apparatus includes an acquisition unit configured to acquire a first required alignment precision in a first direction, and a second required alignment precision in a second direction different from the first direction, and a controller configured to determine, based on the first required alignment precision, a first condition for a first measurement process of measuring a position of an alignment mark in the first direction, to determine, based on the second required alignment precision, a second condition for a second measurement process of measuring a position of an alignment mark in the second direction. | 06-13-2013 |
20130148122 | METHOD OF MANUFACTURING DEVICE, AND SUBSTRATE - A method includes a first step of forming a circuit pattern and an alignment mark on a substrate and a second step of measuring a position of the alignment mark and positioning the substrate. The alignment mark includes a first linear pattern arranged on one side of a first straight line, a second linear pattern arranged on the other side of the first straight line, a third linear pattern arranged on one side of a second straight line, and a fourth linear pattern arranged on the other side of the second straight line. The first step includes determining total number of the third and fourth linear patterns to be formed and total number of the first and second linear patterns to be formed based on required precisions in directions along the first and second straight lines. | 06-13-2013 |
20130171570 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a drawing apparatus including a stage having a reference mark, and configured to hold a substrate and to be moved, a charged particle optical system, a first measuring device having an optical axis spaced apart from an axis of the charged particle optical system by a first distance and configured to measure a position of an alignment mark formed on the substrate, a second measuring device having an optical axis spaced apart from the axis of the charged particle optical system by a second distance and configured to measure a position of the reference mark, and a processor configured to obtain a baseline of the first measuring device based on positions of the reference mark respectively measured by the first measuring device and the second measuring device. | 07-04-2013 |
20130188165 | LITHOGRAPHY APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus includes: a rotation mechanism configured to rotate a substrate; a first measurement device configured to measure a position of an alignment mark formed on the substrate in a first direction with a first precision; a second measurement device configured to measure a position of an alignment mark formed on the substrate in a second direction with a second precision higher than the first precision; and a controller configured to control the rotation mechanism so that a direction, in which the substrate requires an overlay precision higher than another direction, is aligned with the second direction. | 07-25-2013 |
20130216954 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A drawing apparatus, which draws a pattern on a substrate with a plurality of charged particle beams, includes: a charged particle optical system configured to emit the plurality of charged particle beams onto the substrate; and a controller configured to control an operation of the charged particle optical system. The controller is configured to control the operation so as to compensate for a distortion of the pattern that is determined based on first data of an undulation of a surface of the substrate and second data of an inclination of each of the plurality of charged particle beams with respect to an axis of the charged particle optical system. | 08-22-2013 |
20140320836 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD FOR MANUFACTURING DEVICE - An apparatus includes an optical system configured to irradiate a surface of a substrate with a beam, a control unit configured to control a position of the irradiation of the beam, and a first measurement unit and a second measurement unit each configured to measure a position of a mark formed on the substrate. The second measurement unit is placed at a position closer to an optical axis of the optical system than the first measurement unit is. Based on a position measurement value measured by the first measurement unit and position measurement values measured at different timings by the second measurement unit, the control unit controls the position of the beam irradiated to the substrate. The position measurement values measured at the different timings are values obtained from the same mark or values obtained from two marks adjacent to a common shot area. | 10-30-2014 |
20140322654 | LITHOGRAPHY APPARATUS, AND METHOD FOR MANUFACTURING ARTICLE - A lithography apparatus for substrate patterning, includes a substrate stage having a reference mark, an optical system irradiating the substrate with the charged particle beam, a first measurement device measuring a position of an alignment mark formed on the substrate, a second measurement device having an optical axis apart from an axis of the optical system by a distance shorter than that of the first measurement device, and measuring a position of the reference mark, a processor obtaining a base line of the first measurement device based on positions of the reference mark respectively measured by the first and second measurement device and a base line of the second measurement device, the position of the reference mark being measured by the second measurement device based on an optical signal obtained via the reference mark with the stage moved. | 10-30-2014 |
20140322831 | LITHOGRAPHY APPARATUS, LITHOGRAPHY METHOD, AND METHOD OF MANUFACTURING ARTICLE - A lithography apparatus for performing pattern formation on a substrate includes a stage configured to hold the substrate and be movable, an optical system configured to irradiate the substrate with an energy beam for the pattern formation, and a controller configured to set an arrangement of first and second marks for overlay inspection, which is variable with respect to a first substrate for condition setting, and control the stage and the optical system so that first processing for forming the first mark on the first substrate without the pattern formation and second processing for forming the second mark on the first substrate with the pattern formation are performed based on the set arrangement. | 10-30-2014 |
20150015861 | CALIBRATION METHOD, MEASUREMENT APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a method for calibrating an encoder which includes a scale and a light receiving unit configured to receive light reflected by the scale, and detects a change in relative position between the scale and the light receiving unit, the method comprising a measurement step of measuring a deformation amount of a surface shape of the scale, a specifying step of specifying, based on a measurement result in the measurement step, a range which includes a portion of a surface of the scale, where the deformation amount exceeds a threshold, and within which a detection value of the encoder is corrected, and a determination step of determining a correction value for correcting the detection value of the encoder within the range specified in the specifying step. | 01-15-2015 |
20150044614 | DRAWING APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides a drawing apparatus which performs drawing on a substrate with a plurality of charged particle beams, the apparatus comprising a blanker array including a plurality of blankers and configured to individually blank the plurality of charged particle beams, a plurality of deflectors configured to individually deflect a plurality of charged particle beam groups constituting the plurality of charged particle beams, and a controller configured to individually control positions of the plurality of charged particle beam groups by the plurality of deflectors, and individually control blanking of the plurality of charged particle beams by the blanker array, based on information of a region on the substrate where a shot region exists. | 02-12-2015 |