Patent application number | Description | Published |
20080236878 | Thin film capacitor, thin film capacitor-embedded printed circuit board and manufacturing method of thin film capacitor - There is provided a thin film capacitor and a capacitor-embedded printed board improved in leakage current characteristics. A dielectric layer is formed of a BiZnNb-based amorphous metal oxide with a predetermined dielectric constant without being heat treated at a high temperature, and metallic phase bismuth of the BiZnNb-based amorphous metal oxide is adjusted in content to attain a desired dielectric constant. Also, another dielectric layer having a different content of metallic phase bismuth may be formed. The thin film capacitor including: a first electrode; a dielectric layer including a first dielectric film formed on the first electrode, the dielectric layer comprising a BiZnNb-based amorphous metal oxide; and a second electrode formed on the dielectric layer, wherein the BiZnNb-based amorphous metal oxide contains metallic phase bismuth. | 10-02-2008 |
20140090881 | PASSIVE DEVICE EMBEDDED IN SUBSTRATE AND SUBSTRATE WITH PASSIVE DEVICE EMBEDDED THEREIN - The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate. | 04-03-2014 |
20140116761 | MULTILAYER CERAMIC CAPACITOR AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - The present invention relates to a multilayer ceramic capacitor and a printed circuit board including the same that can minimize thickness deviations of an external electrode and a multilayer ceramic. A multilayer ceramic capacitor according to an embodiment of the present invention includes a multilayer ceramic and external electrodes formed on both sides of the multilayer ceramic, wherein |T | 05-01-2014 |
20140144676 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one guide hole for exposing a portion of the external electrode; a second insulating layer formed on the lower surface of the first insulating layer to cover the first metal pattern; a first circuit pattern formed on a lower surface of the second insulating layer; and a first via for electrically connecting the first external electrode exposed through the guide hole and the first circuit pattern, and can improve electrical connectivity between the external electrode and the via even when the size of the external electrode of the electronic component is reduced than before. | 05-29-2014 |
20140151104 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to an electronic component embedded substrate including: a cavity formed in at least one insulating layer provided inside the electronic component embedded substrate; an electronic component having at least a portion inserted in the cavity; and a cavity plating portion formed on a surface of the cavity opposite to at least one surface of the electronic component, and can improve electrical connectivity between an external electrode and a via even when the size of the external electrode of the electronic component is reduced than before. | 06-05-2014 |
20140177192 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same. In accordance with an embodiment of the present invention, a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer. | 06-26-2014 |
20140182889 | MULTILAYERED SUBSTRATE - Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring. | 07-03-2014 |
20140182895 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component. | 07-03-2014 |
20140182896 | SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD OF MANUFACTURING THE SAME - A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern. | 07-03-2014 |
20140182897 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer. | 07-03-2014 |
20140182911 | PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers. | 07-03-2014 |
20140182916 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a circuit board, which can miniaturize a conductor pattern formed around a via and improve current pass characteristics of the via at the same time by including a via passing through an insulating layer to be in contact with an upper conductor pattern and a lower conductor pattern and having a bent portion whose cross-sectional area or diameter changes discontinuously. | 07-03-2014 |
20140185258 | SUBSTRATE EMBEDDING PASSIVE ELEMENT - A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via. | 07-03-2014 |
20140321084 | PRINTED CIRCUIT BOARD INCLUDING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board including an electronic component embedded therein and a method for manufacturing the same. The printed circuit board including an electronic component embedded therein includes: a core formed with a cavity which is formed of a through hole and has a side wall formed with an inclined surface having a top and bottom symmetrically formed based on a central portion thereof; an electronic component embedded in the cavity; insulating layers stacked on upper and lower portions of the core including the electronic component; and external circuit layers formed on the insulating layers. | 10-30-2014 |
20150027757 | PCB HAVING GLASS CORE - Disclosed herein is a printed circuit board (PCB) including a glass core for maintaining sufficient rigidity while maintaining a thin thickness to minimize warpage. The PCB includes a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed, a plating layer filled in the pattern formation groves and the through via holes, insulating layers stacked on the upper and lower surfaces of the glass core, and solder resist layers formed on the insulating layers via coating. | 01-29-2015 |
20150195907 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayered substrate includes an insulating layer or core comprised of a glass material and having a light transmittance of about 50% or less; circuit pattern layers or parts respectively formed on the surfaces of the insulating layer or core; and a build-up part covering a surface of the insulating layer or core and one of the circuit pattern layers | 07-09-2015 |
Patent application number | Description | Published |
20150179594 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A package substrate and a method for manufacturing the same are disclosed. The method for manufacturing a package substrate in accordance with an aspect of the present invention includes: forming a first open hole corresponding to a shape of a bonding pad in a first photo resist; laminating a second photo resist on the first photo resist and forming a second open hole corresponding to shapes of a soldering pad, a circuit pattern layer and the bonding pad in the second photo resist; and forming a pattern plating layer up to a predetermined height in the first open hole and the second open hole. | 06-25-2015 |
20150195905 | PACKAGE BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME - There are provided a package board, a method of manufacturing the same, and a semiconductor package using the same. According to an exemplary embodiment of the present disclosure, the package substrate may include: an insulating layer; a circuit layer formed on and beneath the insulating layer; a capacitor formed in the insulating layer and including an upper electrode, a lower electrode, and a dielectric layer formed between the upper electrode and the lower electrode; and a via connecting the circuit layer to the upper electrode and the lower electrode. | 07-09-2015 |
20150342047 | CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD - Disclosed is a circuit board having a contact pad for connection with an external device, which protrudes from an upper surface of an outermost insulating layer. A device can be mounted on the circuit board, and a connection terminal of the device can be connected to the contact pad of the circuit board by a wire etc. | 11-26-2015 |
20150351228 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, a package board includes: a first insulating layer; a second insulating layer formed beneath the first insulating layer; a capacitor embedded in the first insulating layer and including a first electrode, a second electrode, and a dielectric layer formed between the first electrode and the second electrode; circuit layers formed on the first insulating layer and the second insulating layer; and a via formed between the capacitor and the circuit layers or between the circuit layers formed on the first insulating layer and the second insulating layer to electrically connect thererbetween, wherein an upper surface of the first electrode is formed to be exposed from the first insulating layer. | 12-03-2015 |
20150351247 | PACKAGE BOARD AND METHOD FOR MANUFACTURING THE SAME - There are provided a package board and a method for manufacturing the same. According to an exemplary embodiment of the present disclosure, the package board includes: a first insulating layer formed with a penetrating cavity; a capacitor disposed in the cavity and including a first electrode, a second electrode formed on the first electrode, and a dielectric layer formed between the first electrode and the second electrode; a second insulating layer formed on the first insulating layer and in the cavity to embed the capacitor; circuit layers formed on the first insulating layer and the second insulating layer; and a via penetrating through the second insulating layer to electrically connect the circuit layer to the capacitor. | 12-03-2015 |
Patent application number | Description | Published |
20090240062 | COMPOUND DERIVED FROM CYCLOPENTADIENONE, PREPARATION METHOD THEREOF AND EL ELEMENT USING THE SAME - Disclosed are a compound represented by the following formula (1), which is derived from cyclopentadienone and can be used as a core material for an organic electroluminescence element or other optical devices, and preparation method thereof, and an EL element using the same. | 09-24-2009 |
20100301270 | LIQUID-CRYSTALLINE MEDUIM - The invention relates to a liquid-crystalline medium based on a mixture of polar compounds having negative dielectric anisotropy (Δε), which contains at least one compound selected from the group of compounds of the formula I, IIA and IIB | 12-02-2010 |
20110095229 | LIQUID-CRYSTALLINE MEDIUM - The present invention relates to a liquid-crystalline medium, characterised in that it contains
| 04-28-2011 |
20120032112 | LIQUID-CRYSTALLINE MEDIUM AND LIQUID-CRYSTAL DISPLAY - The present invention relates to dielectrically positive, preferably nematic, media comprising one or more polymerisable compounds, to polymer-stabilised media obtained therefrom, to the use thereof in liquid-crystal displays, and to these displays, in particular PSA-IPS, PSA-FFS and PSA-positive VA displays | 02-09-2012 |
20120162595 | LIQUID-CRYSTAL DISPLAY - The present invention relates to the use of LC (liquid-crystal) compounds and LC media comprising them in LC displays of the PS (polymer stabilised) or PSA (polymer sustained alignment) type. | 06-28-2012 |
20130056680 | LIQUID CRYSTALLINE MEDIUM AND LIQUID CRYSTAL DISPLAY - The instant invention relates to liquid crystalline media comprising
| 03-07-2013 |
20130258071 | LIQUID CRYSTAL MEDIUM AND LIQUID CRYSTAL DISPLAY - The present invention relates to a liquid crystal panel, a liquid crystal display device and to a liquid crystal medium having a negative dielectric anisotropy Δ∈. | 10-03-2013 |
20130275804 | NoC-Based Adaptive Error Correction Apparatus - An NoC-based error correction apparatus capable of supporting a network interface that transmits a flit between Tx and Rx IP-elements includes: an encoder configured to receive a k-bit flit from the Tx IP-element and encodes the k-bit flit into n-bit data; and a decoder configured to receive the n-bit data, decode the n-bit data into the k-bit flit, and output the k-bit flit, the decoder having an error correction circuit for correcting an error in the n-bit data, wherein a t-bit adaptive error correction code having a variable error correction capability depending on the number of bits (n) of the received data is applied to the error correction circuit, the error correction capability is proportional to the number of bits (n) of the received data, and the t-bit error correction code has the number of bits proportional to the number of bits (n) of the received data. | 10-17-2013 |
20130335651 | LIQUID-CRYSTALLINE MEDIUM - The present invention relates to a liquid-crystalline medium, characterised in that it contains
| 12-19-2013 |
20130335652 | LIQUID-CRYSTALLINE MEDIUM - The present invention relates to a liquid-crystalline medium, characterised in that it contains
| 12-19-2013 |
20130335653 | LIQUID-CRYSTALLINE MEDIUM - The present invention relates to a liquid-crystalline medium, characterised in that it contains
| 12-19-2013 |
20140173492 | METHOD AND APPARATUS FOR VIRTUAL KEYPAD CONTROL - A method is provided including detecting that a first key in a virtual keypad is pressed, the first key being associated with a first symbol, determining, by an electronic device, whether a predetermined input is received after the first key is pressed, reconfiguring the virtual keypad, without displaying the first symbol, when the predetermined input is received; and displaying the first symbol when the predetermined input is not received. | 06-19-2014 |
20140232700 | APPARATUS AND METHOD FOR MANAGING SECURITY OF TERMINAL - An apparatus and a method for managing security of a terminal which increases reliability of an electronic signature. The apparatus includes a controller for detecting coordinate values of input positions of an electronic pen as interruption information when the interruption is received, and a memory for storing the detected input positions as additional electronic signature information. | 08-21-2014 |
20140232704 | METHOD FOR SWITCHING SCREEN AND ELECTRONIC DEVICE THEREOF - A method and an apparatus for switching a screen in an electronic device that uses a transparent display are provided. In the method, a state where a front direction of the electronic device is reversed from a first direction to a second direction, and a back direction of the electronic device is reversed from the second direction to the first direction are detected. When a front side and a backside of the electronic device are reversed, a left/right reversed screen or an up/down reversed screen is displayed. | 08-21-2014 |
20140240653 | LIQUID-CRYSTAL DISPLAY - The present invention relates to the use of LC (liquid-crystal) compounds and LC media comprising them in LC displays of the PS (polymer stabilised) or PSA (polymer sustained alignment) type. | 08-28-2014 |
20140317381 | METHOD OF PROCESSING IMMEDIATE VALUE IN EISC PROCESSOR - Disclosed is a method of operating an immediate value in an extendable instruction set computer (EISC) processor, comprising: checking whether or not an unsigned immediate value is used to generate an extension register (ER) value for operating an immediate value; and generating the ER value by performing zero extension for the unsigned immediate value using an unsigned load extension register with immediate (ULERI) instruction if the unsigned immediate value is used. It is possible to improve operational efficiency by preventing an LERI instruction from being unnecessarily executed when an immediate value is operated using a 16-bit instruction in the EISC processor. | 10-23-2014 |
20150112850 | AUTOMATIC FINANCIAL PRODUCT TRADING SYSTEM AND METHOD - Provided are an automatic financial product trading system and method for automatically trading a financial product when the financial product satisfies a preset trading condition. Through an automatic ordering accelerator using separate hardware or an automatic ordering accelerator installed in a network card, rather than a main processor of a computer system, information input and output through a network card is collected and a financial product is quickly automatically traded. | 04-23-2015 |
20150120205 | SYSTEM AND METHOD FOR MANAGING STRESS - A device for managing user stress is provided. The device includes a collection unit that collects stress related information, an analysis unit that determines a stress state, and an expression unit provides a stress related expression to a user. The collection unit may receive feedback from the user, and the feedback may be used for determining the stress state. | 04-30-2015 |
20150127654 | METHOD FOR MANAGING USER INFORMATION AND ELECTRONIC DEVICE THEREOF - An apparatus and method for storing and displaying user information in an electronic device is provided to categorize information and designate importance. The method includes identifying a plurality of user information, extracting overlapped common information from the plurality of user information, and storing information which is not overlapped among the plurality of user information to be included in a first category and storing the common information to be included in a second category. | 05-07-2015 |
20150153893 | INPUT PROCESSING METHOD AND ELECTRONIC DEVICE THEREOF - A method for operating an electronic device is provided. The method includes detecting a first gesture on a touch screen, dividing a display region of the touch screen into two or more regions according to the first gesture, detecting a second gesture originating in one of the two or more divided regions, and displaying the second gesture according to a region attribute of the one region and the second gesture. | 06-04-2015 |
20150186199 | METHOD OF ANALYZING ERROR RATE IN SYSTEM-ON-CHIP - In order to improve reliability of a system-on-chip (SoC) through fault tolerance verification, there is provided a method of analyzing an error rate in a system-on-chip (SoC) having at least one internal block obtained by interconnecting two or more gates, comprising: applying an input signal to an input terminal of a certain internal block; defining an input error rate of each gate of the internal block; and defining an output error rate of the internal block based on the input error rate of each gate and an error rate propagating to an output terminal. As a result, there is proposed a method of analyzing a change of the output error rate depending on the input error rate in a gate level in error model development necessary to design and verify a fault-tolerant SoC. Therefore, it is possible to analyze errors in each gate and formularize error rate information modeling including an input/output relationship between each gate of a digital circuit in a library form. | 07-02-2015 |
20150205993 | METHOD FOR PROVIDING CONTROL FUNCTION USING FINGERPRINT SENSOR AND ELECTRONIC DEVICE THEREOF - An apparatus and a method for providing a control function using a fingerprint sensor in an electronic device are provided. The method includes collecting information based on occurrence of an event, detecting a touch input on a fingerprint sensor, and performing a control function for the information based on the touch input on the fingerprint sensor. | 07-23-2015 |
20150253889 | METHOD FOR PROCESSING DATA AND AN ELECTRONIC DEVICE THEREOF - An apparatus and method for inputting an object of an electronic device are provided. The electronic device includes a display; and a processor configured to control display of an object input screen on the display, and to change a configuration for the output object input screen on a basis of an input received on the display. | 09-10-2015 |
20150264028 | METHOD FOR DETERMINING DATA SOURCE - A method for determining a data source is provided. The method includes recognizing, by an electronic device, at least one external device communicating with the electronic device, determining at least one device from of the electronic device and the at least one external device on the basis of at least one of a user's wearing state and authentication information corresponding to the at least one external device, and obtaining, by the electronic device, data relating to the electronic device through the at least one determined device. | 09-17-2015 |
20150271175 | METHOD FOR PERFORMING COMMUNICATION VIA FINGERPRINT AUTHENTICATION AND ELECTRONIC DEVICE THEREOF - A method is provided for operating a first electronic device. The method includes determining sameness of first fingerprint data and second fingerprint data. The method also includes obtaining an access right of a security region based on the determination. The method also includes obtaining at least one item of information stored in the security region based on the obtained access right. The method also includes transmitting the obtained information to a second electronic device connected via Near Field Communication. | 09-24-2015 |
20150271396 | ELECTRONIC DEVICE AND METHOD FOR IMAGE DATA PROCESSING - An electronic device for processing image data including a camera module configured to obtain the image data. The electronic device also including a control module configured to set at least one pointing object in the image data and configured to control the image data on an object corresponding to a position of the set pointing object according to at least one of a position and movement of the at least one pointing object. | 09-24-2015 |
20150324570 | METHOD FOR PROCESSING FINGERPRINT AND ELECTRONIC DEVICE THEREFOR - A method for operating an electronic device is provided. The method includes detecting a fingerprint, detecting reference value based on situation information of the electronic device, and performing a fingerprint recognition based on the detected fingerprint and the reference value. A method for operating an electronic device is not limited to the above method, and other embodiments are possible within the same or similar scope as the present disclosure. | 11-12-2015 |
20150329782 | LIQUID CRYSTALLINE MEDIUM AND LIQUID CRYSTAL DISPLAY - The instant invention relates to liquid crystalline media comprising
| 11-19-2015 |
20150331084 | DEVICE AND METHOD FOR MEASURING POSITION OF ELECTRONIC DEVICE - Apparatuses, systems, and methods for an electronic device to detect the relative position of another electronic device are described. One electronic device includes a communication unit, at least two microphones, and a control unit. The electronic device generates signal information by which another electronic device may generate an output signal which can be detected by the microphones. The signal information is transmitted via the communication unit to the other electronic device. If the output signal is obtained by the microphones, the electronic device determines a relative position of the other electronic device, based on the obtained output signal. | 11-19-2015 |