Patent application number | Description | Published |
20120205700 | Light-Emitting Device and Manufacturing Method Thereof, Lighting Device, and Display Device - The present invention focuses on a structure in which an auxiliary wiring for increasing the conductivity of an upper electrode is provided on the substrate side. The conductive auxiliary wiring of a light-emitting device is provided over a substrate, and an upper portion of the auxiliary wiring protrudes in a direction parallel to the substrate. Further, an EL layer formed in a region including a lower electrode layer and the auxiliary wiring is physically divided by the auxiliary wiring. An upper electrode layer formed in a manner similar to that of the lower electrode layer may be electrically connected to at least part of a side surface of the auxiliary wiring. Such an auxiliary wiring may be used in a lighting device and a display device. | 08-16-2012 |
20130164437 | Film Formation Apparatus and Film Formation Method - A film formation apparatus with which a deposited film to cover a deposition object having a three-dimensional curved surface can be formed and a method of forming a deposited film to cover a three-dimensional curved surface. The film formation apparatus includes a deposition source having deposition directivity, a deposition-source-moving mechanism which moves the deposition source, a deposition-object-holding mechanism which holds a deposition object having a three-dimensional curved surface, a deposition-direction-changing mechanism which changes the deposition direction, and a control portion which controls the deposition-source-moving mechanism and the deposition-direction-changing mechanism. | 06-27-2013 |
20130216709 | Film Formation Apparatus, Method for Forming Film and Method for Cleaning Shadow Mask - A film formation apparatus that can remove a film formation material attached to a shadow mask is provided. Alternatively, a method for forming a film and a method for cleaning a shadow mask are provided. The film formation apparatus includes a film formation chamber including an evaporation source; a shadow mask transfer mechanism; and a plasma source. The shadow mask transfer mechanism includes a first mode in which a film is formed on an object to be film-formed with a film formation material ejected by the evaporation source while the object to be film-formed and a shadow mask are transferred, and a second mode in which plasma irradiation is performed by the plasma source to remove the film formation material attached to the shadow mask while the evaporation source is parted from the plasma source by a sluice valve and the shadow mask is transferred. | 08-22-2013 |
20130299789 | Light-Emitting Device and Electronic Device - A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC. | 11-14-2013 |
20130302937 | Film Formation Apparatus, Method for Forming Film, Method for Forming Multilayer Film or Light-Emitting Element, and Method for Cleaning Shadow Mask - The inventors have reached the idea of a film formation apparatus including a film formation chamber, a removal chamber, two sluice valves provided apart from each other between the film formation chamber and the removal chamber, and a shadow mask transfer mechanism. The film formation chamber includes an evaporation source, and the removal chamber includes a parallel plate plasma source and a shadow mask stage. The film formation apparatus has a film formation mode in which a shadow mask overlapped with an object is transferred by the shadow mask transfer mechanism and a film is formed on the object; and a cleaning mode in which the shadow mask is irradiated with plasma by the plasma source, the shadow mask being held between an upper electrode and a lower electrode by the shadow mask stage. | 11-14-2013 |
20140234664 | PEELING METHOD, SEMICONDUCTOR DEVICE, AND PEELING APPARATUS - To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer. | 08-21-2014 |
20150035001 | LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE - A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer. | 02-05-2015 |
20150055286 | DISPLAY DEVICE - A display device includes a display panel, a member, a first fixing portion, a second fixing portion, and a roll-up portion. The display device has a function that enables selection between a first state in which an image is displayed with the display panel not folded and a second state in which an image is displayed with the display panel folded. The display panel is fixed to the first fixing portion and the second fixing portion. One end of the member is fixed to the first fixing portion. The other end of the member is connected to the roll-up portion. The roll-up portion has a function that enables rolling up of the member from the other end of the member. The display panel is folded by rolling up the member. The display panel is unfolded by pulling out the rolled-up member from the roll-up portion. | 02-26-2015 |
20150059986 | DEVICE FOR FORMING SEPARATION STARTING POINT, STACK MANUFACTURING APPARATUS, AND METHOD FOR FORMING SEPARATION STARTING POINT - A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage. | 03-05-2015 |
20150059987 | PROCESSING APPARATUS AND PROCESSING METHOD OF STACK - A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack. | 03-05-2015 |
20150060933 | SUPPORT SUPPLY APPARATUS AND METHOD FOR SUPPLYING SUPPORT - An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included. | 03-05-2015 |
20150068683 | BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS - A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other. | 03-12-2015 |