Shu-Jung
Shu-Jung Chang, Kaoshiung TW
Patent application number | Description | Published |
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20120066846 | Structural Improvement For Robotic Cleaner - The present invention is an improved structure for robotic cleaner primarily comprising of a chassis with plurality of spherical casters fixed to the periphery of bottom deck, a dust collector mounted on the chassis, a lifting actuation mechanism mounted on the chassis that includes a lifting power supply at least to drive two parallel & extendable first swing arms and two parallel & extending second swing arms through a relevant linking device, a first gear train and a second gear train that can pivotally rotate in reverse direction, a drive wheel mounted at the moveable end of the two parallel & extending first swing arms each, a driven wheel mounted at the moveable end of the two parallel & extending second swing arms each, plural advancing power supplies mounted at the middle section of the first swing arms. | 03-22-2012 |
Shu-Jung Wu, Taipei TW
Patent application number | Description | Published |
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20100052820 | COMMON MODE FILTERING METHOD AND DEVICE - Provided are common mode filtering method and device for use with a defected ground structure, the device including a substrate, coupled microstrip lines formed on the substrate and a ground plane formed underneath the substrate, the common mode filtering method being characterized by forming at least a defected ground structure on the ground plane and making dual mode signals pass through the coupled microstrip lines, thereby using the defected ground structure to suppress dual model noises within a specific frequency band and prevent signal distortion. | 03-04-2010 |
Shu-Jung Wu, Hsinchu City TW
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20140095756 | HIGH-SPEED DATA TRANSMISSION INTERFACE CIRCUIT AND DESIGN METHOD OF THE SAME - A high-speed data transmission interface circuit used in a network switch device is provided. The high-speed data transmission interface circuit comprises a main circuit hoard, a connector and a daughter circuit board. The main circuit board comprises a transmission port interface module and a first wire. The transmission port interface module comprises a reduced pin extended attachment unit interface (RXAUI). The first wire connects the connector and the main circuit board. The daughter circuit board comprises a high definition multimedia interface (HDMI) module and a second wire. The HDMI module is connected to an external network device through a HDMI signal wire. The second wire connects the connector and the HDMI module. The transmission port interface module communicates with the external network device through the connector and the daughter board. | 04-03-2014 |
Shu-Jung Yang, Guiren Township TW
Patent application number | Description | Published |
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20100085754 | LIGHT EMITTING DEVICES HAVING HEAT-DISSIPATING SURFACE - A light-emitting device may include a heat-dissipating base, a light-emitting unit, a housing, and a first conductive contact and a second conductive contact. The heat-dissipating base has a top portion and a bottom portion. The bottom portion of the heat-dissipating base may include an exposed heat-dissipation surface. The light-emitting unit is over the top portion of the heat-dissipating base and is arranged to provide heat conductivity at least from the light-emitting unit to the heat-dissipating base. The light-emitting unit may include at least one light-emitting diode for emitting light and a first electrode and a second electrode. Heat may be generated as the light-emitting diode emits light, and the at least one light-emitting diode may have power input terminals for receiving power input to the at least one light-emitting diode. The power input may include one of an alternating-current input and a direct-current input. The first electrode and the second electrode are electrically coupled with the input terminals of the at least one light-emitting diode. The housing encloses at least a portion of the light emitting unit and covers the top portion of the heat-dissipating base. The first conductive contact and the second conductive contact are near or below a portion of the heat-dissipating base and are configured to receive external power supply. The first conductive contact may be electrically coupled with the first electrode, and the second conductive contact may be electrically coupled with the second electrode. | 04-08-2010 |