Patent application number | Description | Published |
20080271384 | CONDITIONING TOOLS AND TECHNIQUES FOR CHEMICAL MECHANICAL PLANARIZATION - Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value. | 11-06-2008 |
20090017736 | SINGLE-USE EDGING WHEEL FOR FINISHING GLASS - A single-use grinding tool includes a wheel portion having a profiled recess (e.g., such as a U, V, or bowl shape) extending circumferentially along the wheel portion's periphery. A multi-layered bonded abrasive (e.g., 3-dimensional matrix of abrasive grains and bond material, or multiple layers of abrasive tape) is conformably coated or otherwise applied in a uniform thickness along the profiled recess. The bonded abrasive in one particular case includes a metal bond with diamonds. However, organic, resinous, vitrified, and hybrid bonds, as well as other abrasive grit types, can be used. The wheel portion is supported by an arbor portion which may be removably coupled to the wheel portion, or formed integrally with the wheel portion. The tool is useful, for example, in edge grinding a workpiece, such as sheet glass. Methods of tool use and tool manufacture are disclosed as well. | 01-15-2009 |
20100000159 | Abrasive Slicing Tool for Electronics Industry - A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations. | 01-07-2010 |
20100154315 | BONDED ABRASIVE ARTICLES AND METHODS OF FORMING - A method of forming an abrasive article includes forming a mixture comprising a liquid carrier and a glass precursor material, wherein the glass precursor material comprises a material selected from the group of materials consisting of a hydrated metal compound, an organic silicate compound, or a combination thereof. The method further includes providing abrasive grains within the mixture, forming the mixture into a green ceramic body, and heating the green ceramic body to form a bonded abrasive article comprising the abrasive grains contained within a bond matrix, wherein the bond matrix comprises an amorphous phase formed from the glass precursor material. | 06-24-2010 |
20100159806 | BONDED ABRASIVE ARTICLE AND METHOD OF USE - An abrasive tool including a bonded abrasive article including a bond material comprising a metal or metal alloy, abrasive grains contained within the bond material, and a reaction agent dispersed within the bond material, wherein the reaction agent chemically reacting with a surface of the workpiece during abrasion to form a reaction product. | 06-24-2010 |
20100248595 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate. | 09-30-2010 |
20100330886 | Corrosion-Resistant CMP Conditioning Tools and Methods for Making and Using Same - An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad. | 12-30-2010 |
20110143641 | ABRASIVE ARTICLE FOR USE WITH A GRINDING WHEEL - An abrasive article for use with a grinding wheel including an abrasive body having abrasive grains contained within a matrix of bond material, the abrasive body having a plurality of arm portions defining a twisted path having a plurality of linear portions joined by a plurality of turns. | 06-16-2011 |
20120028553 | FLEXIBLE ABRASIVE GRINDING APPARATUS AND RELATED METHODS - Flexible abrasive articles and related methods are presented. | 02-02-2012 |
20120034847 | ABRASIVE TOOL AND A METHOD FOR FINISHING COMPLEX SHAPES IN WORKPIECES - An abrasive tool includes a bonded abrasive body having abrasive grains contained within a bonding material, wherein the bonded abrasive body comprises a complex shape having a form depth (FD) of at least about 0.3. The form depth is described by the equation [(Rl−Rs)/Rl], wherein Rs is a smallest radius (Rs) at a point along the longitudinal axis of the bonded abrasive body and Rl is a largest radius (Rl) at a point along the longitudinal axis of the bonded abrasive body. The abrasive tool can be used to finish complex shapes in workpieces. | 02-09-2012 |
20120036789 | Abrasive Article for Use in Grinding of Superabrasive Workpieces - An abrasive article including a bonded abrasive having a body formed of abrasive grains contained within a bond material, wherein the body grinds a superabrasive workpiece having an average Vickers hardness of at least about 5 GPa at an average specific grinding energy (SGE) of not greater than about 350 J/mm | 02-16-2012 |
20120040589 | METHODS OF GRINDING WORKPIECES COMPRISING SUPERABRASIVE MATERIALS - A method of grinding a superabrasive workpiece includes placing a bonded abrasive article in contact with a superabrasive workpiece, wherein the bonded abrasive article comprises a body including abrasive grains contained within a bond material, and the superabrasive workpiece has an average Vickers hardness of at least about 1 GPa, and removing material from the superabrasive workpiece at an average specific grinding energy (SGE) of not greater than about 350 J/mm | 02-16-2012 |
20120055098 | BONDED ABRASIVE ARTICLE AND METHOD OF FORMING - An abrasive article includes a body having abrasive grains contained within a bond material comprising a metal or metal alloy, wherein the body comprises a ratio of V | 03-08-2012 |
20120060426 | Conditioning Tools and Techniques for Chemical Mechanical Planarization - Tools for conditioning chemical mechanical planarization (CMP) pads comprise a substrate with abrasive particles coupled to at least one surface. The tools can have various particle and bond configurations. For instance, abrasive particles may be bonded (e.g., brazed or other metal bond technique) to one side, or to front and back sides. Alternatively, abrasive particles are bonded to a front side, and filler particles coupled to a back side. The abrasive particles can form a pattern (e.g., hexagonal) and have particle sizes that are sufficiently small to penetrate pores of a CMP pad during conditioning, leading to fewer defects on wafers polished with the conditioned CMP pad. Grain bonding can be accomplished using brazing films, although other metal bonds may be used as well. Also, balanced bond material (e.g., braze on both sides) allows for low out-of-flatness value. | 03-15-2012 |
20120066982 | BONDED ABRASIVE ARTICLES, METHOD OF FORMING SUCH ARTICLES, AND GRINDING PERFORMANCE OF SUCH ARTICLES - An abrasive tool having a bonded abrasive body including abrasive grains contained within a bond material comprising a metal. During a grinding operation, the bonded abrasive body has a power variance [(Po−Pn)/Po]×100% of not greater than about 40%, wherein Po represents the grinding power to grind a workpiece with the bonded abrasive body at an initial grinding cycle and Pn represents the grinding power to grind the workpiece for a nth grinding cycle, wherein n>4. | 03-22-2012 |
20120149287 | CHEMICAL MECHANICAL PLANARIZATION (CMP) PAD CONDITIONER AND METHOD OF MAKING - A method of forming a chemical mechanical planarization (CMP) pad conditioner includes placing abrasive grains on a major surface of a substrate, forming a binding composition at an exterior surface of the abrasive grains, and depositing a bonding layer over the surface of the substrate and a portion of the abrasive grains to secure the abrasive grains to the major surface of the substrate. | 06-14-2012 |
20120220205 | Chemical Mechanical Polishing Conditioner - A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern. | 08-30-2012 |
20130000211 | ABRASIVE ARTICLE AND METHOD OF MAKING - An abrasive article includes a bonded abrasive having a body made of abrasive grains contained within a composite bond material. The composite bond material can include an organic material and a metal material. The body can also include a filler material made of a superabrasive material. In an embodiment, the filler material can have an average particle size at least about 10 times less than an average particle size of the abrasive grains. | 01-03-2013 |
20130078895 | ABRASIVE TOOL FOR USE AS A CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate. | 03-28-2013 |
20130316630 | TOOL FOR USE WITH DUAL-SIDED CHEMICAL MECHANICAL PLANARIZATION PAD CONDITIONER - A tool includes a holder configured to couple to a dual-sided chemical mechanical planarization (CMP) pad conditioner. The holder has a magnetic material, a first magnetic field strength (H | 11-28-2013 |
20140007513 | ABRASIVE ARTICLE AND METHOD OF FORMING - An abrasive article includes a substrate comprising an elongated body, a tacking layer comprising tin overlying the substrate, and a first type of abrasive particle comprising an agglomerated particle overlying the tacking layer. | 01-09-2014 |
20140017984 | Abrasive Article and Method Of Forming - An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer. | 01-16-2014 |
20140182214 | Abrasive Articles and Method of Forming Same - An abrasive article including a bonded abrasive body having a bond material made of a vitrified material, abrasive particles comprising a first type of superabrasive material contained in the bond material, a porosity of at least about 50 vol % of the total volume of the bonded abrasive body, and a ΔCTE of not greater than about 5.5 ppm/° C., wherein ΔCTE is defined as a difference between a CTE of the bond material and a CTE of the abrasive particles. | 07-03-2014 |
20140187123 | BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING - An abrasive article configured to grind a workpiece having a fracture toughness of less than about 6 MPa·m ½ includes a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of V | 07-03-2014 |
20140187124 | BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING - An abrasive article configured to grind a workpiece having a fracture toughness at least about 7 MPa·m | 07-03-2014 |
20140187125 | BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING - An abrasive article comprising: a first body comprising a first bond material having abrasive particles contained within the first bond material, wherein the first body comprising the first bond material comprises a ratio of V | 07-03-2014 |
20140187129 | ABRASIVE ARTICLE HAVING A CORE OF AN ORGANIC MATERIAL AND A BONDED ABRASIVE BODY COMPRISING A BOND MATERIAL - An abrasive article includes a core comprising an organic material and a first bonded abrasive body integrally bonded directly to the core, wherein the bonded abrasive body includes a bond material, and abrasive particles contained within the bond material. | 07-03-2014 |
20140202085 | BONDED ABRASIVE ARTICLE AND METHOD OF FORMING - An abrasive article includes a body having abrasive grains contained within a bond material comprising a metal or metal alloy, wherein the body comprises a ratio of V | 07-24-2014 |
20140298729 | BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING - An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa·m | 10-09-2014 |
20140323020 | GRINDING AND POLISHING TOOL - A grinding tool includes a shank having an axis, and at least two abrasive portions mounted directly to and in contact with the shank without a hub therebetween. Each of the abrasive portions has a substantially identical profile formed therein. | 10-30-2014 |
20140366457 | ABRASIVE TOOLS AND METHODS OF FORMING THE SAME - An abrasive tool is provided that may include a body, which may include abrasive particles contained within a bond material. The abrasive particles may be a super abrasive material. The body may further include at least one of a ratio of tungsten to cast iron (W/CI) of not greater than about 1, a ratio of copper-containing compositions to cast iron (CCC/CI) of not greater than about 1, a ratio of titanium-containing compositions to cast-iron (TiCC/CI) of not greater than about 1, a ratio of tungsten carbide to cast iron (WC/CI) of not greater than about 1, a ratio of tungsten carbide to copper-containing compositions (WC/CCC) of not greater than about 1, a ratio of copper-containing compositions and titanium-containing compositions to cast iron ((CCC+TiC)/CI) of not greater than about 1.5 or a combination thereof. | 12-18-2014 |
20140366458 | ABRASIVE TOOLS AND METHODS OF FORMING THE SAME - An abrasive tool is provided that may include a body, which may include abrasive particles contained within a bond material. The abrasive particles may be a super abrasive material. The body may further include at least one of a break-in length of not greater than about 1000 linear meters, a maximum initial speed character of at least about 10 m/min, a life span of at least about 1000 linear meters, a dressing frequency of at least about 25 parts/dress, an edge quality of at least about 25% of a workpiece free from defects and a combination thereof. | 12-18-2014 |
20150027062 | ABRASIVE ARTICLE AND METHOD OF MAKING - An abrasive article includes a bonded abrasive having a body made of abrasive grains contained within a composite bond material. The composite bond material can include an organic material and a metal material. The body can also include a filler material made of a superabrasive material. In an embodiment, the filler material can have an average particle size at least about 10 times less than an average particle size of the abrasive grains. | 01-29-2015 |
20150052821 | ABRASIVE SLICING TOOL FOR ELECTRONICS INDUSTRY - A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations. | 02-26-2015 |
20150059256 | ABRASIVE ARTICLE AND METHOD OF FORMING - An abrasive article including a bonded abrasive body including a bond material having a metal, abrasive particles contained within the bond material, and a filler blend including fine filler particles and coarse filler particles and defining a filler particle size ratio (Ff/Fc) of not greater than about 0.97, where Ff represents the average particle of the fine filler particles and Fc represents the average particle size of the coarse filler particles. | 03-05-2015 |
20150079883 | Abrasive Tool and a Method for Finishing Complex Shapes in Workpieces - An abrasive tool includes a bonded abrasive body having abrasive grains contained within a bonding material, wherein the bonded abrasive body comprises a complex shape having a form depth (FD) of at least about 0.3. The form depth is described by the equation [(R1−Rs)/R1], wherein Rs is a smallest radius (Rs) at a point along the longitudinal axis of the bonded abrasive body and R1 is a largest radius (R1) at a point along the longitudinal axis of the bonded abrasive body. The abrasive tool can be used to finish complex shapes in workpieces. | 03-19-2015 |