Patent application number | Description | Published |
20090154096 | APPARATUS AND METHOD FOR FACILITATING COOLING OF AN ELECTRONICS SYSTEM - Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough. | 06-18-2009 |
20100017151 | Detecting A Fouled Air Filter In A Computer Equipment Enclosure - Detecting a fouled air filter in a computer equipment enclosure that includes an air filter, a supply plenum connecting the air filter and the computer equipment enclosure, a fan operating at a current fan speed, and a filter monitoring module connected for data communications to a management module. Detecting a fouled air filter according to embodiments of the present invention includes calculating, by the filter monitoring module, a pressure differential across the air filter; determining, for the current fan speed by the filter monitoring module in dependence upon a pressure differential profile for the air filter, whether the calculated pressure differential across the air filter exceeds a predetermined threshold value; and if the calculated pressure differential across the air filter exceeds the predetermined threshold value, reporting, by the filter monitoring module to the management module, that the calculated pressure differential across the air filter exceeds the predetermined threshold value. | 01-21-2010 |
20110132071 | AIRFLOW BENCH WITH LAMINAR FLOW ELEMENT - A testing system includes a single air collection box and a laminar flow system for obtain an airflow measurement. The single airflow box has air inlet and outlet ports at opposite ends. The laminar flow element has a laminar flow element inlet in fluid communication with the air collection box and a laminar flow element outlet sealed with the air outlet port of the air collection box. A blower in fluid communication with the laminar flow element outlet draws airflow into the air collection box through a unit under test and out of the air collection box through the laminar flow element. A pressure transducer senses the differential air pressure across the laminar flow element and enables a determination of the airflow rate. | 06-09-2011 |
20110232889 | COMPUTER RACK COOLING USING INDEPENDENTLY-CONTROLLED FLOW OF COOLANTS THROUGH A DUAL-SECTION HEAT EXCHANGER - Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to one embodiment, a first liquid coolant is supplied to a first section of an air-to-liquid heat exchanger. A second liquid coolant is supplied to a second section of the air-to-liquid heat exchanger at a different temperature than the first liquid coolant. Airflow is generated through rack-mounted computer components to the first and second sections of the air-to-liquid heat exchanger. The flow rates of the first and second liquid coolants are independently controlled to enforce a target cooling parameter. The independent operation of the first and second fin tube sections allows for the increased use of un-chilled water without sacrificing heat removal objectives. | 09-29-2011 |
20110286175 | LIQUID COOLANT CONDUIT SECURED IN AN UNUSED SOCKET FOR MEMORY MODULE COOLING - An apparatus for cooling a memory module installed in a computer system includes a liquid coolant conduit that is connected to a conduit support structure having a form factor selectively securable within a first preconfigured memory module socket of the computer system in order to position the liquid coolant conduit above the first socket. A heat pipe provides direct thermal contact between the liquid conduit and a heat spreader assembly in direct thermal contact with a face of the memory module. The apparatus may include a second heat pipe and second heat spreader assembly for similarly cooling a second memory module. In alternative configurations, the apparatus may cool memory modules on opposing sides of the conduit or memory modules that are both on the same side of the conduit. | 11-24-2011 |
20110286179 | MEMORY MODULE CONNECTOR HAVING MEMORY MODULE COOLING STRUCTURES - One embodiment of the present invention provides a computer memory system that includes at least one DIMM connector having a DIMM socket for releasably receiving a terminal edge of a DIMM. A metallic or otherwise highly heat-conductive base is secured to the DIMM connector. A pair of heat spreaders is secured to the base on opposing sides of the DIMM socket. Each heat spreader includes a DIMM-engagement portion spaced from the base. The heat spreaders are nondestructively moveable between an open position spaced apart for receiving the DIMM between the heat spreaders and a closed position for thermally engaging opposing faces of the DIMM. The heat spreaders provide a continuous thermally-conductive pathway between the DIMM-engagement portion and the base. Heatsink fins extend laterally from the base to provide cooling. | 11-24-2011 |
20110292593 | INDEPENDENTLY OPERABLE IONIC AIR MOVING DEVICES FOR ZONAL CONTROL OF AIR FLOW THROUGH A CHASSIS - Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones. | 12-01-2011 |
20110316706 | FILTER FOULING DETECTION USING COMPARATIVE TEMPERATURE RISE ANALYSIS - One embodiment involves detecting the fouling of an air filter used to filter airflow entering a computer system. An expected airflow rate is obtained from a current fan speed. An expected temperature rise between two positions is computed as a function of the expected airflow rate and the power consumption of heat-generating components, such as servers. An actual temperature rise is obtained from temperature sensors. An electronic alert is automatically generated in response to the actual temperature rise exceeding the expected temperature rise by a setpoint. Different setpoints may be used to trigger distinct electronic alerts. | 12-29-2011 |
20120036998 | ELECTROSTATIC CONTROL OF AIR FLOW TO THE INLET OPENING OF AN AXIAL FAN - An air moving apparatus comprises an axial fan and an electrostatic device. The axial fan has a rotatable shaft defining a central axis of the axial fan, a plurality of blades secured to the shaft, and an air inlet opening. The electrostatic device is disposed immediately upstream of the air inlet opening of the axial fan, and includes a collector and an emitter. In one embodiment, the electrostatic device comprises a cylindrical collector coupled to ground and has a central axis aligned with the central axis of the axial fan, wherein the cylindrical collector has an inner diameter that is substantially the same as the diameter of an air inlet opening to the axial fan. The electrostatic device further comprises a plurality of emitter wires coupled to a terminal of a direct current source and extending lengthwise within the cylindrical collector. The axial fan moves air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, the application of an electrical potential between an emitter and a collector causes ionic air movement radially outwardly away from a central axis of the axial fan. | 02-16-2012 |
20120079314 | MULTI-LEVEL DIMM ERROR REDUCTION - Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold. | 03-29-2012 |
20120279047 | METHOD OF FABRICATING A COOLED ELECTRONIC SYSTEM - A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader. | 11-08-2012 |
20120279233 | THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated. | 11-08-2012 |
20120279686 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 11-08-2012 |
20120281358 | COOLED ELECTRONIC SYSTEM WITH THERMAL SPREADERS COUPLING ELECTRONICS CARDS TO COLD RAILS - Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader. | 11-08-2012 |
20130074339 | Overmolded Dual In-Line Memory Module Cooling Structure - Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph. | 03-28-2013 |
20130107453 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE | 05-02-2013 |
20130120926 | USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM - A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates. | 05-16-2013 |
20130126145 | HEAT SINK WITH ORIENTABLE FINS - A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis. | 05-23-2013 |
20130135812 | LIQUID-COOLING MEMORY MODULES WITH LIQUID FLOW PIPES BETWEEN MEMORY MODULE SOCKETS - A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes. | 05-30-2013 |
20130147503 | Liquid Cooled Planer - A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer. | 06-13-2013 |
20130153199 | PERFORMANCE AND NOISE CONTROL FOR A HEAT SINK AIR MOVER - A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode. | 06-20-2013 |
20130168068 | THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS - A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region. | 07-04-2013 |
20130174421 | DIRECTLY CONNECTED HEAT EXCHANGER TUBE SECTION AND COOLANT-COOLED STRUCTURE - A method is provided for fabricating a cooling apparatus for cooling an electronics rack, which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures, and a tube. The heat exchanger is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of coolant-carrying tube sections, each tube section having a coolant inlet and outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure. | 07-11-2013 |
20130177391 | ELECTROSTATIC CONTROL OF AIR FLOW TO THE INLET OPENING OF AN AXIAL FAN - A method of modifying the airflow to the inlet of an axial fan comprises operating an axial fan to move air longitudinally through an air inlet opening of the axial fan, and, during operation of the axial fan, applying an electrical potential between an emitter and a collector to cause ionic air movement radially outwardly away from a central axis of the axial fan, wherein the radially outward air movement is caused upstream of the axial fan before the air reaches the air inlet opening. | 07-11-2013 |
20130192794 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 08-01-2013 |
20130194745 | LIQUID-COOLED MEMORY SYSTEM HAVING ONE COOLING PIPE PER PAIR OF DIMMS - Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate. | 08-01-2013 |
20130343005 | THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) - Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure. | 12-26-2013 |
20140078674 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140078675 | COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT - Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 03-20-2014 |
20140101933 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 04-17-2014 |
20140104787 | INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD - Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices. | 04-17-2014 |
20140230234 | ELECTROHYDRODYNAMIC AIRFLOW ACROSS A HEAT SINK USING A NON-PLANAR ION EMITTER ARRAY - A method of cooling a heat generating device includes positioning a base of an electronically conductive heat sink in thermal communication with a heat generating device, wherein the heat sink includes a plurality of fins extending in a longitudinal direction from a first end to a second end, and coupling the heat sink to ground. The method further includes emitting ions from a plurality of ion emitter elements disposed in a non-planar pattern along the first ends of the plurality of fins, wherein at least three ion emitter elements are equidistant from the first end of the nearest fin and are positioned in an arc having an axis that extends along the first end of the nearest fin. | 08-21-2014 |
20150033550 | OVERMOLDED DUAL IN-LINE MEMORY MODULE COOLING STRUCTURE - Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph. | 02-05-2015 |
20150114601 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
20150114602 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
20150116941 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 04-30-2015 |
20150131223 | LIQUID COOLING OF MULTIPLE COMPONENTS ON A CIRCUIT BOARD - An apparatus includes a primary cold plate, a secondary cold plate, and spring biased retainers moveably securing the primary cold plate to the secondary cold plate. The secondary cold plate is securable to a circuit board for thermal engagement with heat-generating components on the circuit board. The primary cold plate is aligned for thermal engagement with a processor on the circuit board and includes an internal liquid cooling channel. The apparatus further comprises compressible thermal interface material disposed between the primary cold plate and the secondary cold plate to conduct heat from the secondary cold plate to the primary cold plate and remove the heat in a liquid flowing through the liquid cooling channel. The apparatus provides thermal engagement and cooling of multiple components having different heights. | 05-14-2015 |
20150131224 | LIQUID COOLING OF MULTIPLE COMPONENTS ON A CIRCUIT BOARD - A method includes securing a primary cold plate to a secondary cold plate, wherein the primary cold plate is biased away from the secondary cold plate. The secondary cold plate is aligned with a circuit board having heat-generating components, wherein the primary cold plate is aligned with a processor. The method secures the aligned secondary cold plate to the circuit board with a first surface in thermal engagement with the heat-generating components, wherein the primary cold plate is pressed against the processor to overcome the bias, move the primary cold plate toward the secondary cold plate, position the primary cold plate in thermal engagement with the processor, and compress a thermal interface material between the primary and secondary cold plates. A cooling liquid is passed through a liquid cooling channel within the primary cold plate to draw heat from the processor and from the secondary cold plate. | 05-14-2015 |
20150138715 | THERMOELECTRIC-ENHANCED, LIQUID-BASED COOLING OF A MULTI-COMPONENT ELECTRONIC SYSTEM - Methods are provided for facilitating cooling of an electronic component. The methods include providing: a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated. | 05-21-2015 |
20150377274 | FASTENING DEVICE - A fastening device is disclosed. The fastening device has a vertical protrusion for fastening. A horizontal portion and an indicator are used for seating. The horizontal portion extends from the vertical protrusion for providing a clue to indicate that the fastening device is seated correctly. In embodiments, the clue is a color or a texture. In embodiments, a bellow is used with elastomeric properties. When the right load and torque are applied, the bellow covers the horizontal portion such that the color and/or texture of a perspective directed at the horizontal portion appear to be changed. | 12-31-2015 |
Patent application number | Description | Published |
20080216962 | Bead alignment clip and system for its use for locating and maintaining a tire bead positioning onto a tire core build man-drel in forming a core for manufacturing an elastomeric tire - The invention provides tire bead alignment clips for mounting onto each of a pair of tire beads have a U shape to fit over and clamp onto the tire bead that has received a plies sleeve end folded thereover and each tire clip is for magnetic attachment to each of a like number of spaced permanent magnets that are individually secured, at equal spaced locations, to points along radial arcs taken from a center of each of the sides of a cavity mold that are secured to opposite sides of a tire core build mandrel, and the permanent magnets are like horseshoe magnets having a pair of legs that each have north and south pole ends, and each bead clip side is magnetically attractive to couple to which permanent magnet ends, providing for attaching the plies sleeve ends and tire beads to optimum locations on opposite side of the cavity mold side inner surface and spaced apart from the tire core build mandrel that is for use in building a tire core to receive an elastomeric material directed therearound in a tire formation process. | 09-11-2008 |
20080230170 | Method for vacuum forming an elastomeric tire - A vacuum forming process for manufacturing a transport tire from an elastomeric material that include steps of: in a mold having a cavity or annular area, positioning a transport tire core of plies, belt and beads that has been laid-up on a mandrel. Fitting a cover in sealing engagement over the mold top and fitting a cylindrical canister, that is open at a top end, through the center of the cover and into the mold center and pouring an elastomeric material mixture into the canister that includes a needle valve in its lower end that exhausts into one end of the mold annular area. The cylindrical canister includes a port for connection to a deep vacuum source and the cover includes a port that is for connection to a low level vacuum source, where the deep vacuum is to remove air from the elastomeric material mixture, and, after filling, is open to atmosphere, and the needle valve is opened to the mold annular chamber allowing the mixture to be pulled by the low level vacuum through the mold annular cavity, impregnating the transport tire core maintained therein. | 09-25-2008 |
20080245482 | Belt for use in forming a core of plies, beads and belts of a urethane tire - A belt for incorporation into a core of plies and beads formed on a tire core build mandrel where the core is for encapsulating in an elastomeric material, preferably a polyurethane, in a tire formation process, and which belt is formed from like belt sections laid over one another where the one belt section is rotated approximately one hundred eighty degrees around its longitudinal axis with respect to the other, and the belt sections are individually mounted around a tire core build mandrel top whereover a plies has been fitted and with the pair of belt sections ends off-set from one another and are fitted together into a continuous belt. Each belt section is a weave of lateral and longitudinal cotton cords or filaments containing straight, spaced, parallel, taut, Rayon warp cords where the Rayon warp cords or filaments have a crossing angle of forty to sixth degrees respectively, with the stack of a two belt sections forming a tire belt. | 10-09-2008 |
20090071606 | Alignment system for positioning tire beads onto a tire core side wall - A combination of a plurality of equal spaced permanent magnets that are each fitted into a magnet cup formed into a cavity mold side outer surface that is immediately opposite to a slot formed around an outer edge of the inner surface of the cavity mold side, leaving a thin section of the cavity mold side material that separates the respective bottoms of the magnet cups from the bottom of the slot. The slot receives a tire bead whereover a tire plies is folded and is held in that slot by the attractive force provided by the permanent magnets, and pins are fitted at spaced intervals into, to extend outwardly from, the slot bottom surface to engage and center the tire bead in the slot. | 03-19-2009 |
20110041984 | Method and apparatus for retreading a heavy duty tire with a polyurethane tread - A method and apparatus for retreading a heavy duty tire with a polyurethane tread where, after a tire carcass is inspected for utility and is cleaned, the worn tire tread is removed and the carcass is reinspected to insure its suitability for retreading. The tire carcass, with a tube fitted therein, is installed on its side in a mold cavity, between top and bottom rings, that each include spaced segments extending from opposing top and bottom ring surface, and the segments inter-digitate and form the equal spaced tread voids in a finished recapped tire, and the bottom ring inner edge top includes a continuous lug for sealing against the tire side wall, and the top ring is open to pass a flow of polyurethane materials from a lower edge of a cone shaped spreader that is positioned onto the tire carcass top side wall and receives the flow of polyurethane materials directed onto the cone surface, the materials sliding as a sheet therefrom into the mold, filling the mold cavity from bottom to top, forcing air from the mold ahead of the fill, forming the recapped tire tread. | 02-24-2011 |
20120006470 | Method of Making a Bicycle Rim - A method of manufacturing a rim for a bicycle wheel includes wrapping plys of fibers in a resin matrix around a mandrel; curing the plys to form the rim; and reducing a size of the mandrel to allow the mandrel to be removed from the rim. | 01-12-2012 |
20130112333 | METHOD FOR RETREADING A HEAVY DUTY TIRE WITH A POLYURETHANE TREAD - A process and method for retreading a heavy duty tire with a polyurethane tread where, after a tire carcass is inspected, cleaned and the worn tire tread is removed, the tire carcass receives a tube fitted therein and is installed in a mold cavity, between top and bottom mold rings. The mold rings each include spaced segments that inter-digitate and will form equal spaced tread voids in a finished recapped tire. The bottom mold ring inner edge top includes a continuous sealing lug, and the top ring is open to pass a flow of polyurethane materials, that is received off of a lower edge of a cone shaped spreader positioned onto the tire carcass top side wall and slides, as a sheet, into the mold, filling the mold cavity from bottom to top, forcing air from the mold ahead of the fill and forming the recapped tire tread. | 05-09-2013 |
20150118051 | WIND SAIL RECEPTOR - An improved wind sail receptor for turning in a wind flow to turn an axle that operates a generator to produce an electrical power output for performing work. With the improved wind sail receptor blade design and the inclusion of a unique shape of nose cone fitted over a forward end of a housing that the wind sail receptor is journaled to, the wind sail receptor provides for a nearly one hundred percent utilization of the entering wind flow energy to turn the wind sail receptor blades. This near perfect wind energy utilization is provided by the structure of the blades leading and trailing edges along with the blades uniform curvature between leading and trailing edges that is from seventy to seventy eight degrees of arc and the nose cone configuration, whereby a turbulence free wind flow passed off of the blades trailing edge is at a approximately a forty five degree angle to the entering wind flow. | 04-30-2015 |