Patent application number | Description | Published |
20130057334 | METHOD FOR PROVIDING A SYSTEM ON CHIP WITH POWER AND BODY BIAS VOLTAGES - Embodiments described in the present disclosure relate to a method for providing power for an integrated system, including acts of: providing the system with power, ground and body bias voltages, the body bias voltages comprising a body bias voltage of p-channel MOS transistors, greater or lower than the supply voltage, and a body bias voltage of n-channel MOS transistors, lower or greater than the ground voltage, selecting by means of the system out of the voltages provided, depending on whether a processing unit of the system is in a period of activity or inactivity, voltages to be supplied to bias the bodies of the MOS transistors of the processing unit, and providing the bodies of the MOS transistors of the processing unit with the voltages selected. | 03-07-2013 |
20130075870 | METHOD FOR PROTECTION OF A LAYER OF A VERTICAL STACK AND CORRESPONDING DEVICE - A device and corresponding fabrication method includes a vertical stack having an intermediate layer between a lower region and an upper region. The intermediate layer is extended by a protection layer. The vertical stack has a free lateral face on which the lower region, the upper region and the protection layer are exposed. | 03-28-2013 |
20130113017 | ELECTRONIC DEVICE FOR PROTECTING FROM ELECTROSTATIC DISCHARGE - A protection device includes a triac and triggering units. Each triggering unit is formed by a MOS transistor configured to operate at least temporarily in a hybrid operating mode and a field-effect diode. The field-effect diode has a controlled gate that is connected to the gate of the MOS transistor. | 05-09-2013 |
20130120049 | Power Switch - A power switch includes first and second MOS transistors in series between first and second nodes. Both the first and second transistors have a gate coupled to its substrate. First and second resistive elements are coupled between the gate of the first transistor and the first node, and between the gate of the second transistor and the second node, respectively. A triac is coupled between the first and second nodes. The gate of the triac is coupled to a third node common to the first and second transistors. A third MOS transistor has a first conduction electrode coupled to the gate of the first transistor and a second conduction electrode coupled to the gate of the second transistor. | 05-16-2013 |
20130120087 | COPLANAR WAVEGUIDE - An embodiment relates to a coplanar waveguide electronic device comprising a substrate whereon is mounted a signal ribbon and at least a ground plane. The signal ribbon comprises a plurality of signal lines of a same level of metallization electrically connected together, and the ground plane is made of an electrically conducting material and comprises a plurality of holes. | 05-16-2013 |
20130138975 | PROTECTION OF MEMORY AREAS - A method for loading a program, contained in at least a first memory, into a second memory accessible by an execution unit, in which the program is in a cyphered form in the first memory, a circuit for controlling the access to the second memory is configured from program initialization data, instructions of the program, and at least initialization data being decyphered to be transferred into the second memory after configuration of the circuit. | 05-30-2013 |
20130140693 | METHOD FOR FORMING AN INTEGRATED CIRCUIT - A method for forming an integrated circuit including the steps of: a) forming openings in a front surface of a first semiconductor wafer, the depth of the openings being smaller than 10 μm, and filling them with a conductive material; b) forming doped areas of components in active areas of the front surface, forming interconnection levels on the front surface and leveling the surface supporting the interconnection levels; c) covering with an insulating layer a front surface of a second semiconductor wafer, and leveling the surface coated with an insulator; d) applying the front surface of the second wafer coated with insulator on the front surface of the first wafer supporting interconnection levels, to obtain a bonding between the two wafers; e) forming vias from the rear surface of the second wafer, to reach the interconnection levels of the first wafer; and f) thinning the first wafer to reach the openings filled with conductive material. | 06-06-2013 |
20130142227 | COMMUNICATIONS ARRANGEMENT FOR A SYSTEM IN PACKAGE - A circuit includes a first n-bit communications block and a second m-bit communications block. A controller is configured to control mode of operation for the first and second communications blocks. In a first mode, the first and second communications blocks function as a single communications block for n+m bit communications. In a second mode, the first and second communications blocks operate as substantially independent communications block for n bit communications and m bit communications. | 06-06-2013 |
20130155283 | HARDENED PHOTODIODE IMAGE SENSOR - An image sensor including a pixel array, each pixel including, in a substrate of a doped semiconductor material of a first conductivity type, a first doped region of a second conductivity type at the surface of the substrate; an insulating trench surrounding the first region; a second doped region of the first conductivity type, more heavily doped than the substrate, at the surface of the substrate and surrounding the trench; a third doped region of the second conductivity type, forming with the substrate a photodiode junction, extending in depth into the substrate under the first and second regions and being connected to the first region; and a fourth region, more lightly doped than the second and third regions, interposed between the second and third regions and in contact with the first region and/or with the third region. | 06-20-2013 |
20130155303 | METHOD OF CAPTURING AN IMAGE WITH AN IMAGE SENSOR - A method may include a cycle of reading a current pixel including connecting the capacitive node of the pixel to a capacitive node of a previous pixel already read, connecting the capacitive node of the current pixel and the capacitive node of a previous pixel to an output line, reading a first voltage of the capacitive node of the pixel through the output line, transferring charges from the accumulation node to the capacitive node of the pixel, reading a second voltage of the capacitive node of the pixel through the output line, and disconnecting the capacitive node from the capacitive node of a previous pixel, and a cycle of reading a next pixel. This cycle may include accumulating charges in the accumulation node of the next pixel while the capacitive node of the current pixel is connected to a capacitive node of a previous pixel. | 06-20-2013 |
20130155558 | COMPACT ELECTRONIC DEVICE FOR PROTECTING FROM ELECTROSTATIC DISCHARGE - A device for protecting a set of N nodes from electrostatic discharges, wherein N is greater than or equal to three, includes a set of N units respectively possessing N first terminals respectively connected to the N nodes and N second terminals connected together to form a common terminal. Each unit includes at least one MOS transistor including a parasitic transistor connected between a pair of the N nodes and configured, in the presence of a current pulse between the pair of nodes, to operate, at least temporarily, in a hybrid mode including MOS-type operation in a sub-threshold mode and operation of the bipolar transistor. | 06-20-2013 |
20130157562 | WIRELESS DEVICE PAIRING - A wireless unit includes a first motion sensitive device; communications circuitry for wirelessly communicating with a further wireless unit; and a processing device configured to compare at least one first motion vector received from the first motion sensitive device with at least one second motion vector received from a second motion sensitive device of the further wireless unit. | 06-20-2013 |
20130157587 | INTEGRATED CIRCUIT COMPRISING AN INTEGRATED TRANSFORMER OF THE "BALUN" TYPE WITH SEVERAL INPUT AND OUTPUT CHANNELS - An integrated circuit includes an integrated transformer of the balanced-to-unbalanced type with N channels, wherein N is greater than 2. The integrated transformer includes, on a substrate, N inductive circuits that are mutually inductively coupled, and respectively associated with N channels. | 06-20-2013 |
20130181784 | VARIABLE CAPACITANCE DEVICE - A variable capacitance device including: first and second transistors coupled in parallel between first and second nodes of the capacitive device, a control node of the first transistor being adapted to receive a control signal, and a control node of the second transistor being adapted to receive the inverse of the control signal, wherein the first and second transistors are formed in a same semiconductor well. | 07-18-2013 |
20130181785 | DEVICE OF VARIABLE CAPACITANCE - A variable capacitance device including: first and second transistors coupled in series by their main current nodes between first and second nodes of the device, a control node of the first transistor being adapted to receive a first control signal, and a control node of the second transistor being adapted to receive a second control signal; and control circuitry adapted to generate the first and second control signals from a selection signal. | 07-18-2013 |
20130182523 | ROBUST SRAM MEMORY CELL CAPACITOR PLATE VOLTAGE GENERATOR - An SRAM having two capacitors connected in series between respective bit storage nodes of each memory cell. The two inverters of the memory cell are powered by a positive voltage and a low voltage. The two capacitors are connected to each other at a common node. A leakage current generator is coupled to the common node. The leakage current generator supplies to the common node a leakage current to maintain a voltage which is approximately halfway between the voltages of the high and low SRAM supplies. | 07-18-2013 |
20130193550 | 3D INTEGRATED CIRCUIT - A method for manufacturing an integrated circuit, including the steps of forming first transistors on a first semiconductor layer; depositing a first insulating layer above the first semiconductor layer and the first transistors, and leveling the first insulating layer; depositing a conductive layer above the first insulating layer, and covering the conductive layer with a second insulating layer; bonding a semiconductor wafer to the second insulating layer; thinning the semiconductor wafer to obtain a second semiconductor layer; and forming second transistors on the second semiconductor layer. | 08-01-2013 |
20130196500 | METHOD FOR FORMING A VIA CONTACTING SEVERAL LEVELS OF SEMICONDUCTOR LAYERS - A method for forming a via connecting a first upper level layer to a second lower level layer, both layers being surrounded with an insulating material, the method including the steps of: a) forming an opening to reach an edge of the first layer, the opening laterally continuing beyond said edge; b) forming a layer of a protection material on said edge only; c) deepening said opening by selectively etching the insulating material to reach the second lower level layer; and d) filling the opening with at least one conductive contact material. | 08-01-2013 |
20130201766 | Volatile Memory with a Decreased Consumption and an Improved Storage Capacity - A volatile memory includes volatile memory cells in which data write and read operations are performed. The memory cells are arranged in rows and in columns and are distributed in first separate groups of memory cells for each column. The memory includes, for each column, a write bit line dedicated to write operations and connected to all the memory cells of the column and read bit lines dedicated to read operations. Each read bit line is connected to all the memory cells of one of the first groups of memory cells. Each memory cell in the column is connected to a single one of the read bit lines. | 08-08-2013 |
20130201771 | Volatile Memory with a Decreased Consumption - A volatile memory including volatile memory cells adapted to the performing of data write and read operations. The memory cells are arranged in rows and in columns and, further, are distributed in separate groups of memory cells for each row. The memory includes a first memory cell selection circuit configured to perform write operations and a second memory cell selection circuit, different from the first circuit, configured to perform read operations. The first circuit is capable of selecting, for each row, memory cells from one of the group of memory cells for a write operation. The second circuit is capable of selecting, for each row, memory cells from one of the groups of memory cells for a read operation. | 08-08-2013 |