Patent application number | Description | Published |
20140041206 | METHOD FOR REPAIRING VIA OF CIRCUIT BOARD - Disclosed herein is a method for repairing a via in which a dimple phenomenon occurs, in the case in which a dimple error occurs at the time of a process of forming the via used for electrically connecting between layers of a multi-layers circuit board. The method for repairing a via according to an exemplary embodiment of the present invention includes judging whether or not a dimple error occurs in a via; and repairing the via in which the dimple error occurs. | 02-13-2014 |
20140104417 | SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE - Disclosed herein are a system of measuring a warpage and a method of measuring a warpage. The system of measuring a warpage of a sample by analyzing an image photographed by the camera using light that is diffused from a light source and reflected on a surface of a sample and is arrived at the camera through a reference grating part, the system includes: an intake part that removes a fume generated from the sample. By this configuration, it is possible to measure the warpage while effectively removing the fume generated from the sample according to the increase in the temperature of the sample at the time of measuring the warpage, thereby improving the accuracy of the warpage measurement. | 04-17-2014 |
20140145323 | LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE - Disclosed herein is a lamination layer type semiconductor package, and more particularly, a lamination layer type semiconductor package capable of maintaining a thickness of a package on package structure at a minimum and minimizing a warpage defect by mounting two chips so as to correspond to each other. The lamination layer type semiconductor package includes: an upper package having an upper flip chip mounted on an upper substrate; a lower package having a lower flip chip mounted on a lower substrate and disposed so as to closely adhere the upper flip chip and the lower flip chip to each other; a heat dissipation adhesive member adhesively fixing the upper flip chip and the lower flip chip and dissipating heat generated from the upper flip chip and the lower flip chip; and a molding member molding between the upper substrate and the lower substrate. | 05-29-2014 |
20140184782 | SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE - Disclosed herein are a system for measuring a warpage and a method for measuring a warpage. The system for measuring a warpage includes: a heating plate portion heating the sample; and a reference gating portion disposed between the sample and the camera so as to be spaced apart from the sample by a predetermined distance, wherein the reference grating portion includes a plurality of wires that are each spaced apart from each other by a predetermined interval, thereby accurately measuring the warpage without being affected by the fume generated from the sample. | 07-03-2014 |
20140352413 | MOISTURE TRANSMISSION TESTING INSTRUMENT - Disclosed herein is a moisture transmission testing instrument of measuring moisture transmission of an electronic material, the moisture transmission testing instrument including: a moisture supplying part having an opened upper portion and having water stored therein; a sample support part stacked on the moisture supplying part so as to be communicated with the moisture supplying part and having a sample seated on an upper side thereof; and a moisture collecting part stacked on the sample support part so as to be communicated with the sample support part and having a dehumidifying agent installed therein. | 12-04-2014 |
20140354797 | CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATUS USING THE SAME, AND METHOD THEREOF - Disclosed herein are a calibration block for measuring warpage, a warpage measuring apparatus using the same, and a method thereof. The calibration block includes a substrate having one planar surface; and a stepped part forming a step at the center of the other surface of the substrate. | 12-04-2014 |
20140374870 | IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an image sensor module and a method of manufacturing the same. The image sensor includes: a base substrate having an image sensor mounted groove including a first groove and a second groove having a stepped shape; and an image sensor mounted in a groove of the base substrate. | 12-25-2014 |
20150114131 | BONDING FORCE TEST DEVICE - Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested. | 04-30-2015 |