Patent application number | Description | Published |
20120197119 | Treatment instrument - A treatment instrument that is inserted in a freely advancing and retracting manner into the channel of an ultrasonic endoscope, includes a treatment member that has a distal end and a proximal end and an outer surface that is a circular cylindrical shape in which a plurality of dimples are formed indenting into the outer surface. The length component that is measured in the direction of the center axis of the treatment member and which is the distance between the rear edge, which is positioned closest to the proximal end, and the deepest part of the dimple is shorter than the length component that is measured in the direction of the center axis and which is the distance between the front edge which is closest to the distal end and the deepest part. | 08-02-2012 |
20130237879 | TREATMENT TOOL FOR BIOPSY AND TISSUE COLLECTING METHOD - This treatment tool for biopsy includes a needle tube, which having a first aperture and a second aperture. The first aperture and the second aperture communicate with the tubular space. The second aperture is provided in a side surface of the needle tube at more proximal end side than the first aperture. In a cross-section of the second aperture, a distal end circular arc portion of an end surface of the second aperture has a distal end side inclined surface that is inclined so as to be positioned gradually outwards of a radial direction of the needle tube towards the distal end side, and a proximal end circular arc portion of the end surface of the second aperture has a proximal end inclined surface that is inclined so as to be positioned gradually outwards of the radial direction of the needle tube towards the proximal end side. | 09-12-2013 |
20130310684 | TREATMENT INSTRUMENT - A treatment instrument that is inserted in a freely advancing and retracting manner into the a channel of an ultrasonic endoscope that includes an ultrasonic scanning mechanism emitting and receiving ultrasound waves, the first dimple includes a first area which has a reflecting surface that reflects the ultrasound waves emitted from the ultrasonic scanning mechanism to the ultrasonic scanning mechanism; and a second area which is arranged contiguously to the first area at a proximal end side of the first area and which includes a wall surface on which the ultrasound waves that is emitted toward the first area in a direction to travel directly from the ultrasonic scanning mechanism cannot be incident. | 11-21-2013 |
Patent application number | Description | Published |
20120205766 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC APPARATUS - A solid-state imaging device includes: an optical filter in which a filter layer is formed on a transparent substrate; a solid-state imaging component that is arranged to be opposed to the optical filter and in which plural pixels that receive light made incident via the filter layer are arrayed in a pixel area of a semiconductor substrate; and a bonding layer that is provided between the optical filter and the solid-state imaging component and sticks the optical filter and the solid-state imaging component together. | 08-16-2012 |
20120256284 | IMAGING DEVICE AND CAMERA MODULE - An imaging device includes: an optical sensor including a light receiving unit capable of forming an object image; a seal material for protecting the light receiving unit of the optical sensor; an intermediate layer formed at least between the light receiving unit and an opposite surface of the seal material facing the light receiving unit; and a control film arranged between the intermediate layer and the opposite surface of the seal material, wherein, in the control film, a cutoff wavelength is shifted to a shortwave side in accordance with an incident angle of light which is obliquely incident on the film. | 10-11-2012 |
20130038764 | IMAGE PICKUP APPARATUS AND CAMERA MODULE - An image pickup apparatus includes an optical sensor including a light receiving unit, a sealing material configured to protect the optical sensor on a side of the light receiving unit, an intermediate layer formed at least between the light receiving unit and a first surface of the sealing material, the first surface being an opposed surface to the light receiving unit, and a control film configured to cause a cutoff wavelength to shift to a short wave side in accordance with an incident angle of light that is incident thereon obliquely, in which the control film includes a first control film formed on the first surface of the sealing material, the first surface being the opposed surface to the light receiving unit, and a second control film formed on a second surface of the sealing material, the second surface being opposite to the first surface. | 02-14-2013 |
20130181313 | IMAGE PICKUP UNIT AND METHOD OF MANUFACTURING THE SAME - An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal member including a concave portion, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. By way of a second example, the image pickup device includes a seal member having a first surface, the first surface being a polished surface, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. | 07-18-2013 |
20140061865 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a semiconductor device including a semiconductor layer, a protective layer including a transparent material, and a transparent resin layer that seals a gap between the semiconductor layer and the protective layer. A chip prevention member with a higher Young's modulus than the transparent resin layer is formed to come into contact with the semiconductor layer in a dicing portion of a layer structure before fragmentation, and dicing is performed in the dicing portion for the fragmentation. | 03-06-2014 |
20140252526 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, AND ELECTRONIC APPARATUS - A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device. | 09-11-2014 |