Patent application number | Description | Published |
20080309708 | MIXING APPARATUS, DISPERSION MANUFACTURING APPARATUS AND DISPERSION MANUFACTURING METHOD - A mixing apparatus including a plurality of nozzle groups each formed of nozzles for ejecting the same fluid arranged in group, the nozzles being provided with openings for ejecting fluid, to cause the plurality of nozzle groups to separately eject a plurality of fluids to mix the fluids in areas on the extending lines of the nozzles, wherein the openings of the nozzles forming the nozzle groups are arranged along annular loci and the plurality of nozzle groups are arranged coaxially to each other, a plurality of supplying channels for supplying the plurality of fluids to the nozzle groups corresponding to the plurality of nozzle groups are annular in cross section in the direction perpendicular to the direction in which fluid supplied to the supplying channels flows and arranged coaxially to each other. | 12-18-2008 |
20090020043 | METHOD FOR MANUFACTURING DISPERSION OF QUINOLINE DERIVATIVE - A method for manufacturing a dispersion of a quinoline derivative that is dispersed at a high concentration and has a small particle size. The method includes the steps of preparing a solution by dissolving an N-arylanthranilic acid derivative in an organosulfonic acid, heating the solution and obtaining a reaction liquid in which a quinoline derivative has been produced by a condensation ring-closing reaction, and obtaining a dispersion of the quinoline derivative by mixing the reaction liquid with an aqueous solution. The step of mixing the reaction liquid with an aqueous solution may be performed in a mixing field having a micro-channel. | 01-22-2009 |
20090025603 | PIGMENT INK COMPOSITION AND COATING MATERIAL - A pigment ink composition has high transparency and good color characteristics such as a high OD that are not inferior to those of dyes, even though pigment particles are used, and also has good weatherability and remaining ability on the coating and printing medium surface that are inherent to pigment particles. The pigment ink composition contains pigment particles including at least needle pigment particles, a dispersant, and a solvent. The needle pigment particles have a needle shape with an aspect ratio of at least 3, an average aspect ratio of at least 5 and at most 7, an average short dimension of at least 20 nm and at most 30 nm, and a distribution of short dimension with a standard deviation of 2.0 nm or less. The needle pigment particles are covered with the dispersant. | 01-29-2009 |
20090031923 | FLUID-PROCESSING DEVICE AND FLUID-PROCESSING METHOD - A fluid-processing device is provided for bringing two kinds of fluids into contact to mix or react with each other. The device comprises a first supply path connected to a first feed inlet for feeding a first fluid for supplying the first fluid, and plural second supply paths connected to a second feed inlet for feeding a second fluid for supplying the second fluid; the second supply paths being arranged along supply direction of the first fluid, the second supply paths being surrounded by the first fluid, the second fluid discharged from fluid outlets of the second supply paths being brought into contact with the first fluid in the first supply path. | 02-05-2009 |
20090101044 | METHOD FOR MANUFACTURING PIGMENT DISPERSION - A method is provided for pigment dispersion. The method includes preparing a solution in which the pigment is dissolved in an organic acid, preparing a reaction liquid capable of decreasing the solubility of the pigment in the solution, and mixing the solution and the reaction liquid in the presence of an additive represented by a General Formula (1) below, | 04-23-2009 |
20090139430 | METHOD FOR MANUFACTURING PIGMENT DISPERSION - A method for manufacturing a pigment dispersion includes mixing a solution in which a pigment is dissolved in an acid, and a reaction liquid that decreases a solubility of the pigment in the solution, in the presence of a dispersant for the pigment, and causing the pigment to precipitate. The solution and reaction liquid are mixed in the presence of the dispersant and a cyclic carbonate. | 06-04-2009 |
20090318586 | METHOD FOR MANUFACTURING DISPERSION AND LIQUID MIXING DEVICE - In a method for manufacturing a dispersion which includes a dispersion medium and particles dispersed therein, the method includes bringing at least two types of liquids into contact with each other to form a reaction product comprising the particles, wherein the liquids are ejected from respective nozzles to be brought into contact with each other and then to flow in an integrated manner while forming a spiral flow. | 12-24-2009 |
20110146533 | METHOD FOR PRODUCING LIQUID COMPOSITION AND PIGMENT PARTICLES AND INK COMPOSITION FOR INK JET RECORDING - A method for producing a liquid composition containing pigment particles is provided including (1) maintaining a mixture of a solvent and pigments of at least two types including a pigment A insoluble in the solvent at a normal temperature and a normal pressure, and a pigment B soluble in the solvent at the normal temperature and the normal pressure, at a temperature exceeding the normal temperature and a pressure exceeding the normal pressure, thereby obtaining a pigment solution in which the pigment A and the pigment B are dissolved; and (2) cooling the pigment solution to a temperature precipitating a deposition of the pigment A or lower, thereby precipitating pigment particles containing the pigment A and the pigment B. | 06-23-2011 |
20110168908 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 07-14-2011 |
20110194673 | MICROSTRUCTURE MANUFACTURING METHOD AND MICROSTRUCTURE - A microstructure manufacturing method includes: preparing a mold having on a front side thereof a plurality of fine structures, with conductivity being imparted to a bottom portion between the plurality of fine structures; forming a first plating layer between the plurality of fine structures by plating the bottom portion; and forming a second plating layer of larger stress than the first plating layer on the first plating layer between the plurality of fine structures, wherein the stress of the second plating layer is used to curve a back side surface of the mold. | 08-11-2011 |
20120207275 | STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND IMAGING APPARATUS - A method of manufacturing a structure includes a step of preparing a substrate including a silicon section, recessed sections and protruding sections formed by etching the silicon section, and a first insulating layer disposed on top portions of the protruding sections; a step of forming second insulating layers on sidewalls and bottom portions of the recessed sections; a step of forming seed layers containing metal above the bottom portions of the recessed sections; and a step of forming plating layers in such a manner that the recessed sections are filled with metal by electroplating. The second insulating layers contain an organopolysiloxane having at least one of a partial structure represented by the following formula (1) and a partial structure represented by the following formula (2): | 08-16-2012 |
20120219916 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity, forming a structure of the photosensitive resin by exposing the layer of the photosensitive resin to light and developing the layer of the photosensitive resin to expose a part of the substrate surface, forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution, curing the structure of the photosensitive resin after forming the first plated layer, removing at least part of the first plated layer after curing the structure of the photosensitive resin, and forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution. | 08-30-2012 |
20130118793 | METHOD FOR FILLING THROUGH HOLE OF SUBSTRATE WITH METAL AND SUBSTRATE - The present invention relates to a method for filling a through hole of a substrate with a metal. The method includes a step of preparing a bonded substrate including a first substrate having conductivity in at least a surface thereof and a second substrate having a through hole, both substrates being bonded to each other through a nonionic surfactant; a step of exposing, in the bonded surface of the bonded substrate, the conductive surface of the first substrate, which is positioned at the bottom of the through hole, by removing the nonionic surfactant positioned at the bottom of the through hole of the second substrate; and a step of filling the through hole with a metal by applying an electric field to the conductive surface of the first substrate. | 05-16-2013 |
20130234343 | THROUGH-HOLE SUBSTRATE AND METHOD OF PRODUCING THE SAME - A substrate ( | 09-12-2013 |
20130343524 | METHOD FOR PRODUCING STRUCTURE - A method for producing a structure includes the steps of etching a first substrate of an integrated member including, in sequence, the first substrate, an etching stop layer, and a seed layer, from a surface of the first substrate opposite the surface adjacent to the etching stop layer to form a hole or a plurality of gaps in the first substrate in such a manner that part of a surface of the etching stop layer is exposed, partially etching the etching stop layer from the surface of the etching stop layer exposed to expose part of a surface of the seed layer, and forming a metal member by plating using the seed layer as a seed to charge a metal into at least part of the hole or the gaps. | 12-26-2013 |
20140145080 | STRUCTURE, METHOD FOR MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS INCLUDING THE STRUCTURE - The present invention relates to a method for manufacturing a structure, including the steps of forming a recessed section in a first surface of a substrate; filling the recessed section with metal to form a metal structure; exposing the metal structure from the substrate; and applying resin onto the exposed metal structure and solidifying the resin to form a resin layer. | 05-29-2014 |
20140185779 | STRUCTURE AND RESIN STRUCTURE MANUFACTURING METHOD, STRUCTURE, AND X-RAY IMAGING APPARATUS INCLUDING STRUCTURE - A resin structure manufacturing method includes filling a mold with a resin, fixing a first supporting substrate onto the resin filled in the mold, hardening the resin filled in the mold, fixing a second supporting substrate onto the first supporting substrate, demolding the resin from the mold using the second supporting substrate, and separating the first supporting substrate and the second supporting substrate after demolding. | 07-03-2014 |
20140211920 | STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a structure by using a silicon mold, in which disturbances in arrangement due to charges are reduced, can be provided. | 07-31-2014 |
20140334604 | MICROSTRUCTURE, AND IMAGING APPARATUS HAVING THE MICROSTRUCTURE - A microstructure includes a substrate, and a grating provided in the substrate and made of metal. The grating is provided with a plurality of holes. The plurality of holes are arranged in a first direction. In a plane containing the first direction, the maximum value of the distance between the center of gravity of a grating region composed of the grating and the plurality of holes and the outer edge of the grating region is less than 1.39 times the minimum value of the distance between the center of gravity of the grating region and the outer edge of the grating region. | 11-13-2014 |
20150060405 | METHOD FOR MANUFACTURING MICROSTRUCTURE - A method is provided for producing a microstructure. The method includes the first step of forming a supporting layer on a base substrate including a silicon substrate provided with recessed sections at a first surface thereof and a metal structure filling the recessed sections so as to come in contact with the metal structure at the first surface, the second step of forming a structure including the metal structure and the supporting layer by selectively etching the silicon substrate to expose at least the surface of the metal structure opposite the surface in contact with the supporting layer from the silicon substrate, and the third step of selectively etching the supporting layer of the metal structure. | 03-05-2015 |
20150072521 | MICROSTRUCTURE MANUFACTURING METHOD - A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating. | 03-12-2015 |