Takenaka, Kyoto
Hiroshi Takenaka, Kyoto JP
Patent application number | Description | Published |
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20100138937 | Method for diagnosis of severity and prediction of recurrence in eosinophilic inflammatory disease - A method for diagnosis of the severity of a condition in an eosinophilic inflammatory disease such as nasal polyp or for prediction of the recurrence of the disease, the method comprising detecting H-PGDS induced by eosinophilic leukocytes accumulated in a lesion or determining pGD | 06-03-2010 |
20120026419 | APPARATUS CONCEALING MEMBER, APPARATUS USING THE SAME, AND METHOD FOR CONCEALING PORTION TO BE CONCEALED OF APPARATUS - An apparatus concealing member capable of augmenting the concealing ability of a functional liquid crystal film and also realizing a necessary concealing ability for designs of various types of products without inducing radio-wave disturbances and the like. In an apparatus concealing member according to the present invention, a film-type information input device is placed under a film-type transparent base member, a functional liquid crystal film is placed under the information input device at a position where the functional liquid crystal film covers a portion to be concealed of an apparatus and can be electrically changed over between being transparent and being non-transparent, and a non-metal and film-type glossy layer is placed under the functional liquid crystal film and exhibits transparency and a gloss due to reflection. | 02-02-2012 |
20130011624 | In-Mold Decorated Fibrous Molded Object and Method for Manufacturing the Same - An in-mold decorated fibrous molded object is provided, which is capable of being beautifully decorated, and a method for manufacturing the same. A method for manufacturing an in-mold decorated fibrous molded object includes the steps of forming a pictorial pattern | 01-10-2013 |
Kiichiro Takenaka, Kyoto JP
Patent application number | Description | Published |
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20150035607 | POWER AMPLIFIER MODULE - Improvement in linearity is achieved at low costs in a power amplifier module employing an envelope tracking system. The power amplifier module includes a first power amplifier circuit that amplifies a radio frequency signal and that outputs a first amplified signal, a second power amplifier circuit that amplifies the first amplified signal on the basis of a source voltage varying depending on amplitude of the radio frequency signal and that outputs a second amplified signal, and a matching circuit that includes first and second capacitors connected in series between the first and second power amplifier circuit and an inductor connected between a node between the first and second capacitors and a ground and that decreases a gain of the first power amplifier circuit as the source voltage of the second power amplifier circuit increases. | 02-05-2015 |
20150084698 | POWER AMPLIFIER CIRCUIT - Linearity and power efficiency in a power amplifier circuit are enhanced. The power amplifier circuit includes a first transistor that amplifies a signal input to the base and that outputs the amplified signal from the collector and a first capacitor that is disposed between the base and the collector of the first transistor and that has voltage dependency of a capacitance value lower than that of a base-collector parasitic capacitance value of the first transistor. | 03-26-2015 |
Mikihito Takenaka, Kyoto JP
Patent application number | Description | Published |
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20080233435 | Polymer Thin Film, Patterned Substrate, Patterned Medium for Magnetic Recording, and Method of Manufacturing these Articles - A polymer thin film in which cylindrical phases are distributed in a continuous phase and are oriented in a pass-through-direction of the film includes at least: a first block copolymer including at least a block chain A | 09-25-2008 |
20080290067 | MICROSTRUCTURE, PATTERN MEDIUM AND PROCESS FOR PRODUCING SAME - It is an object to provide a microstructure having cylindrical microdomains oriented in the film thickness direction and arranged in a regular pattern, for which a microphase separation phenomenon of a block copolymer is utilized. The process for producing the microstructure includes 2 steps; the first step for arranging, on a substrate ( | 11-27-2008 |
20090239103 | POLYMER THIN-FILM, PROCESS FOR PRODUCING PATTERNED SUBSTRATE, MATTER WITH PATTERN TRANSFERRED, AND PATTERNING MEDIUM FOR MAGNETIC RECORDING - A polymer thin film | 09-24-2009 |
20100159214 | HIGH-MOLECULAR THIN FILM, PATTERN MEDIUM AND MANUFACTURING METHOD THEREOF - The present invention provides a method of manufacturing a high-molecular thin film having a fine structure from a block-copolymer compound containing a block copolymer A as a main constituent composed of at least a block chain A | 06-24-2010 |
Toshiaki Takenaka, Kyoto JP
Patent application number | Description | Published |
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20080251193 | Method of Manufacturing Multi-Layer Circuit Board - A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance. | 10-16-2008 |
20090114338 | INTERMEDIATE MATERIAL FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING SUCH INTERMEDIATE MATERIAL - An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t | 05-07-2009 |
20090178839 | RECOGNITION MARK AND METHOD FOR MANUFACTURING CIRCUIT BOARD - Through hole ( | 07-16-2009 |
20090229762 | MANUFACTURING METHOD OF BOARDS, MOLD-RELEASING SHEET, MANUFACTURING APPARATUS FOR BOARD - A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches ( | 09-17-2009 |