Tatemichi
Atsushi Tatemichi, Hamura-Shi JP
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20130057776 | TELEVISION AND ELECTRONIC APPARATUS - According to one embodiment, a television includes: a display part; a tuner part; an electronic component; a casing including: a first wall provided with an opening part and configured to cover the electronic component; a second wall provided with a second opening part and configured to cover the electronic component; and a third wall provided with a third opening part over the first wall and the second wall; a stand part configured to support the casing; a fan accommodated within the casing; and a radiating member including regions facing the first opening part, the second opening part and the third opening part, and positioned between the fan and the third wall, wherein the second wall includes a recessed part and a projection projected toward the outside of the casing; and a part of the fan faces the recessed part from the inside of the casing. | 03-07-2013 |
Atsushi Tatemichi, Tokyo JP
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20130057780 | TELEVISION RECEIVER AND ELECTRONIC DEVICE - In one embodiment, a television receiver includes a housing having a first surface, a second surface located on an opposite side of the first surface, and a third surface connecting the first and second surfaces. The receiver further includes a circuit board accommodated in the housing, having a first board surface facing toward the first surface side, and a second board surface facing toward the second surface side. The receiver further includes a light source disposed on the first board surface of the circuit board, and at least one lens to adjust an optical path of light emitted from the light source. The receiver further includes a first indicator provided on the first surface of the housing to transmit the light from the light source, and a second indicator provided on the third surface of the housing to transmit the light from the light source through the lens. | 03-07-2013 |
20160066450 | ELECTRONIC DEVICE, MOUNTING MEMBER, AND MOUNTING METHOD - According to one embodiment, device includes first wall, first base, mount, module, and first and second combining portions. First base protrudes from first wall in thickness direction. First base includes first opening. Mount includes second base and second wall. Second base includes second opening toward first wall. Second wall extends from one side of second base located farther from first wall in the direction to one side of first base located farther from first wall in the direction. Second wall includes third opening which overlaps first opening. Module includes third wall and body. Third wall is located at another side of second base. Third wall includes fourth opening which overlaps second opening. Body is apart from second base. First combining portion penetrates through fourth opening and is inserted into second opening. Second combining portion penetrates through third opening and is inserted into first opening. | 03-03-2016 |
Atsushi Tatemichi, Ota Tokyo JP
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20160062416 | HINGE APPARATUS AND ELECTRONIC DEVICE - According to one embodiment, a hinge apparatus includes a first hinge and a second hinge. The first hinge includes a rotation axis portion and a fastening portion fastened to a first component. The second hinge is fastened to a second component and rotatably connected to the rotation axis portion. The fastening portion includes an arm, a first wall, a second wall. The arm is fixed to and intersecting the rotation axis portion. The first wall is provided with a first mounting portion and projecting from the arm at a position apart from the rotation axis portion in a direction intersecting the arm. The second wall is provided with a second mounting portion and projecting from the arm in a direction intersecting the arm at a position apart from the rotation axis portion and apart from the first wall in a thickness direction. | 03-03-2016 |
20160066437 | ELECTRONIC DEVICE, MOUNTING MEMBER, AND MOUNTING METHOD - According to one embodiment, device includes housing, first wall in the housing, first base, second base, mount, module, and combining portion. First base protrudes from first wall in thickness direction of first wall. First base includes first opening. Second base is at one side of first wall at which first base protrudes, and located nearer to one side of first base than to other side of first base in the direction. One side of first base is located nearer to first wall. Mount extends from one side of second base located farther from first wall in the direction to the other side of first base, and includes second wall including second opening which overlaps with first opening. Module includes third wall and body. Third wall is sandwiched between second base and second wall. Combining portion penetrates through second opening and inserted into first opening, and combines mount and first base. | 03-03-2016 |
Junichi Tatemichi, Kyoto JP
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20100314552 | ION IMPLANTER - An ion implanter includes an implantation chamber into which an ion beam is introduced, a holder for holding substrates on two columns of a first column and a second column in an X-direction, and a holder driving unit having a function of setting the holder in a horizontal state and then positioning the holder in a substrate exchange position and a function of setting the holder in a standing state and then driving reciprocally and linearly the holder along the X-direction in an irradiation area of the ion beam. Also, the ion implanter includes two load lock mechanisms, and two substrate carrying units equipped with arms, which carry the substrates between the load lock mechanisms and a substrate exchange position respectively, every two arms. | 12-16-2010 |
Mayuko Tatemichi, Settsu-Shi, Osaka JP
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20150332855 | MULTILAYER FILM - The present invention aims to provide a multilayer film which can increase the capacitance. The present invention relates to a multilayer film including a first electrode layer, a resin substrate, a second electrode layer, and a dielectric layer stacked in the order set forth. The dielectric layer includes a vinylidene fluoride/tetrafluoroethylene copolymer (A). The copolymer (A) satisfies a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 97/3 to 60/40. | 11-19-2015 |
20150368413 | HIGH DIELECTRIC FILM - The present invention aims to provide a film having a high dielectric constant and a low dissipation factor. The high dielectric film of the present invention includes a vinylidene fluoride/tetrafluoroethylene copolymer (A) with a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 95/5 to 80/20. The film includes an β-crystal structure and a β-crystal structure. The ratio of the β-crystal structure is 50% or more. | 12-24-2015 |
Shuhei Tatemichi, Matsumoto-City JP
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20140110797 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A MOS semiconductor device has a MOS structure, including a p | 04-24-2014 |
20150056776 | METHOD OF MANUFACTURING MOS-TYPE SEMICONDUCTOR DEVICE - A method of manufacturing a MOS-type semiconductor device capable of increasing the thickness of a gate oxide film and obtaining high gate withstanding power and reduced switching loss without increasing a gate threshold voltage Vth is provided. A p-type well region is selectively formed on one principle surface of a semiconductor substrate having an n-type low impurity concentration layer by using an oxide film as a mask. Subsequently, a resist mask is formed on the surface of the p-type well region so as to be separated from the oxide film mask, and an n | 02-26-2015 |