Patent application number | Description | Published |
20090014094 | Methods for Reducing Hexavalent Chromium in Trivalent Chromate Conversion Coatings - The present invention is directed to trivalent chromate conversion coatings for plated metals, and more particularly, to methods for reducing hexavalent chromium in trivalent chromate conversion coatings. In one embodiment, such method includes placing a metal article having a trivalent chromate conversion coating in a reducing solution. The trivalent chromate conversion coating includes hexavalent chromium and the reducing solution including a reducing agent, which reduces the hexavalent chromium so as to reduce or eliminate the hexavalent chromium on the plated metal article. | 01-15-2009 |
20090090281 | Anti-Tilt Pallet and Method for Shipping and Installing a Computer Rack Therewith - An anti-tilt pallet includes a first sub-frame and a second sub-frame. The first sub-frame has a first vertical support member, a first extension member and a second extension member. The second sub-frame has a second vertical support member, a third extension member and a fourth extension member. The first through fourth extension members each have an alignment hole therethrough. A plurality of first alignment members are disposed in the alignment holes of the first extension member and the third extension member to align the first extension member with the third extension member, and a plurality of second alignment members are disposed in the alignment holes of the second extension member and the fourth extension member to align the second extension member with the fourth extension member. A slot is configured to removably receive a weight in at least one of the first sub-frame and the second sub-frame. | 04-09-2009 |
20090205694 | Thermoelectric Generation Device for Energy Recovery - A thermoelectric generation device is configured for mounting on cooling tubes of a heat exchanger of a computer room air conditioning unit in a data center. A first type of Seebeck material and a second type of Seebeck material are arranged in a matrix and connected in series. An electrically insulating, but thermally conducting plate is located on either side of the device. The device is mounted physically on cooling tubes of the heat exchanger and exposed on the other side to the warm air environment. As a result of the temperature difference a voltage is generated that may be used to power an electrical load connected thereto. | 08-20-2009 |
20100243716 | Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers - A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selectively enables only the connector leads to reach reflow temperature levels. The cradle aligns and securely connects the circuit board to the connector via a comb structure of the cradle to form a single connector unit. Heat is applied to the single connector unit to initiate bond formation. The cradle selectively minimizes the heat to the circuit board and other board components by enabling the circulation of de-ionized water through the cooling component during the heating process. As a result, the cradle restricts reflow temperature levels to the connector leads. The cradle mechanism is removed from the board after the connector is securely bonded to the board. | 09-30-2010 |
20110063796 | ENDOTHERMIC REACTION APPARATUS FOR REMOVING EXCESS HEAT IN A DATACENTER - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 03-17-2011 |
20120018666 | METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE - The exemplary embodiments of the present invention provide a method and system for aligning graphite nanofibers in a thermal interface material to enhance the thermal interface material performance. The method includes preparing the graphite nanofibers in a herringbone configuration, and dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The method further includes applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. The system includes the graphite nanofibers configured in a herringbone configuration and a means for dispersing the graphite nanofibers in the herringbone configuration into the thermal interface material. The system further includes a means for applying a magnetic field of sufficient intensity to align the graphite nanofibers in the thermal interface material. | 01-26-2012 |
20120074968 | METHOD FOR SULFUR-BASED CORROSION TESTING - A method for performing corrosion testing is provided. The method includes applying a thin film of silicone to an electrical device to be tested, positioning the device in a chamber, connecting the device to electrical testing equipment for determining any change in electrical resistance of the device, and disposing a gaseous compound of sulfur in the chamber. The method also comprises monitoring the device for any change in electrical resistance for indicating failure of the device. | 03-29-2012 |
20120111660 | IMPLEMENTING DYNAMIC NOISE ELIMINATION WITH ACOUSTIC FRAME DESIGN - A method, system and computer program product are provided for implementing dynamic noise elimination. A system frame includes a plurality of acoustical sensory devices monitoring the system for problem frequencies. The system frame includes a plurality of tubes. When the tube is open, airflow is allowed. When identified tubes are closed, quarter-wavelength attenuation is provided for a frequency in a range of frequencies, based upon a length of the tube when closed. Each of the plurality of tubes is selectively controlled to be operable open or closed at a particular length, responsive to identified problem frequencies. | 05-10-2012 |
20120187046 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 07-26-2012 |
20120312589 | Laser Resin Activation to Provide Selective Via Plating for Via Stub Elimination - An enhanced mechanism for via stub elimination in printed wiring boards (PWBs) and other substrates employs laser resin activation to provide selective via plating. In one embodiment, the resin used in insulator layers of the PWB contains spinel-based non-conductive metal oxide. Preferably, only insulator layers through which vias will pass contain the metal oxide. Those layers are registered and laser irradiated at via formation locations to break down the metal oxide and release metal nuclei. Once these layers are irradiated, all layers of the PWB or subcomposite are laid up and laminated. The resulting composite or subcomposite is subsequently drilled through and subjected to conventional PWB fabrication processes prior to electroless copper plating and subsequent copper electroplating. Because metal nuclei were released only in the via formation locations of the appropriate layers, plating occurs in the via barrels only along those layers and partially plated vias are created without stubs. | 12-13-2012 |
20120327612 | CARD CONNECTOR WITH A SERVOMECHANICAL DEVICE FOR REPOSITIONING AN EXPANSION CARD - A card connector having a housing with a receiving slot and connector pins are provided. An expansion card having docking well regions, contact pads, and backup contact pads is inserted in the receiving slot. The connector pins are connected to the docking well regions on the expansion card. The expansion card is coupled to a servomechanical device that can slide the expansion card to connect the connector pins with the contact pads. Connector pins and contact pads are coated with an interface material that is subject to wearing. Worn interface material can cause weak electrical connections between connector pins and contact pads. Thus, a card connector with a servomechanical device is provided to slide an expansion card within a receiving slot of the card connector for an improved electrical connection between connector pins and contact pads. | 12-27-2012 |
20130003295 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130003296 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-03-2013 |
20130008183 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130010422 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a holding container with highly thermally conductive surfaces installed in the warmest area(s) of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-10-2013 |
20130016472 | Endothermic Reaction Apparatus for Removing Excess Heat in a Datacenter - Embodiments of the present invention generally provide for a system that removes excess thermal energy from a datacenter. In one embodiment, the system includes a modular holding container with highly thermally conductive surfaces capable of installation in any of multiple receiving points of the datacenter. Two substances are released into the holding container and are mixed creating a liquid solution and causing an endothermic reaction. The resulting reaction transfers thermal energy from the datacenter air to the new solution. The liquid solution is then pumped out of the datacenter, where it can be passed through a dialyzing membrane or an evaporation chamber, which separates the liquid solution into its two original substances. | 01-17-2013 |
20130020716 | SYSTEM AND METHOD TO PROCESS HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN A THERMAL INTERFACE MATERIAL USED IN 3D CHIP STACKS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip. | 01-24-2013 |
20130045612 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 02-21-2013 |
20130052409 | PREVENTING CONDUCTIVE ANODIC FILAMENT (CAF) FORMATION BY SEALING DISCONTINUITIES IN GLASS FIBER BUNDLES - An enhanced substrate for making a printed circuit board (PCB) includes a silane applied to the ends of glass fibers in via holes. In one embodiment, during a plated through-hole (PTH) via fabrication process, glass fiber bundles exposed in a drilled through-hole are selectively sealed. For example, after the through-hole is drilled in a substrate, the substrate may be subjected to an aqueous silane bath (e.g., an organo trialkoxysilane in an aqueous solution of an acid that acts as a catalyst) to deposit a layer of silane on the exposed glass fiber bundle ends. For example, trialkoxy groups of the silane may react with exposed silanols on the glass to form a siloxane, which is further polymerized to form a silane polymer barrier layer on the exposed glass fiber ends. The barrier layer effectively seals the glass fiber bundles and eliminates the conductive anodic filament (CAF) pathway between PTH vias. | 02-28-2013 |
20130130515 | CONNECTOR WITH COMPLIANT SECTION - An apparatus, method and computing device including a card edge contact system is provided. A card edge connector housing for receiving a card is provided. A substrate is provided and spaced a distance away from a housing base portion of the card edge connector housing to form a space therebetween. Contact pins collectively defining an upper contact section, a lower contact section and a compliant section connecting the upper and lower contact sections are disposed within the card edge connector housing and the substrate. The upper contact section has an open end with a restricted contact portion for contacting the card. The resilient, compliant section is disposed within the space and is configured to compress to absorb a force from the substrate that would otherwise be transmitted to the upper contact section via the lower contact section. | 05-23-2013 |
20130154058 | HIGH SURFACE AREA FILLER FOR USE IN CONFORMAL COATING COMPOSITIONS - A high surface area filler, a conformal coating composition, and an apparatus. The high surface area filler comprises an amorphous silicon dioxide powder and a phosphine compound bonded to the amorphous silicon dioxide powder. The conformal coating composition comprises a conformal coating and the high surface area filler. The apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. The conformal coating composition overlies the metal conductors and comprises a conformal coating and the high surface area filler. Accordingly, the conformal coating composition is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. | 06-20-2013 |
20130192739 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 08-01-2013 |
20130240250 | CIRCUIT APPARATUS HAVING A ROUNDED DIFFERENTIAL PAIR TRACE - A first artwork layer having a first adaptable-mask section allows a graded amount of light to pass into an underlying first photoresist layer. Subsequent to developing the first photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least a lower portion of a rounded trace. A dielectric layer is laminated upon the lower portion and a second artwork layer having an second adaptable-mask section allows a graded amount of light to pass into a second photoresist layer. Subsequent to developing the second photoresist layer, the graded amount of light creates a rounded geometric void used as a mold or sidewall for the creation of at least an upper portion of a rounded trace. The photoresist and dielectric layers are removed resulting in a circuit apparatus having a rounded differential pair trace. | 09-19-2013 |
20130252456 | Securing a Field Replaceable Unit - An assembly may have first and second components. The first component may include a first electrical connector and a guide member. The second component may include a second electrical connector to couple with the first electrical connector, and a receptacle to receive the guide member in a mated position. An adhesive may be provided between the guide member and the receptacle to form a bond between the guide member and the receptacle. The bond may be reversed when the adhesive is heated above a threshold temperature. A heating element to heat the adhesive may be provided. | 09-26-2013 |
20130263736 | SILICONE-BASED CHEMICAL FILTER AND SILICONE-BASED CHEMICAL BATH FOR REMOVING SULFUR CONTAMINANTS - Sulfur contaminants, such as elemental sulfur (S | 10-10-2013 |
20140070393 | HORIZONTALLY AND VERTICALLY ALIGNED GRAPHITE NANOFIBERS THERMAL INTERFACE MATERIAL FOR USE IN CHIP STACKS - The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip | 03-13-2014 |
20140205232 | IMPLEMENTING EMBEDDED HYBRID ELECTRICAL-OPTICAL PCB CONSTRUCT - Methods and structures are provided for implementing embedded hybrid electrical-optical printed circuit board (PCB) constructs. The embedded hybrid electrical-optical PCB construct includes electrical channels and optical channels within a single physical PCB layer. The embedded hybrid electrical-optical PCB construct includes an electrically conductive sheet or a copper sheet, and a reflective mesh adhesive layer provided with the electrical channels and optical channels within the single physical PCB layer. | 07-24-2014 |
20140273614 | ELECTRICAL CONNECTORS WITH ENCAPSULATED CORROSION INHIBITOR - According to embodiments of the invention, an electrical connector structure with an encapsulated corrosion inhibitor may be provided. The structure may include a first electrical connector having a first contact surface. The structure may also include an encapsulated corrosion inhibitor applied to at least a portion of the first contact surface. | 09-18-2014 |
Patent application number | Description | Published |
20080264563 | Apparatus and Method to Enable Easy Removal of One Substrate from Another for Enhanced Reworkability and Recyclability - A method and apparatus enables easy removal of a first substrate (e.g., a label, EMC gasket, etc.) from a second substrate (e.g., a cover of a computer enclosure) for enhanced reworkability or recyclability. An adhesive layer affixes the substrates to each other. A coating that includes a dewetting agent (DA) is interposed between the second substrate and the adhesive layer. Removal is facilitated by applying heat and/or pressure to activate the DA. Preferably, the DA thermally decomposes to form gaseous products at a predefined temperature. Heat may be applied through one or more of the substrates to drive the DA to decomposition, which forms bubbles that lift the first substrate relative to the second substrate. Optionally, the DA may be encapsulated in microspheres. For example, the DA may be silicone oil and/or an adhesive solvent encapsulated in microspheres and may be activated by applying pressure sufficient to crush the microspheres. | 10-30-2008 |
20100044095 | Via Stub Elimination - An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. This advantageously eliminates the costly and time consuming process of via stub backdrilling. | 02-25-2010 |
20100044096 | Horizontally Split Vias - A mechanism is disclosed for providing horizontally split vias are provided in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first/second ones and third/fourth ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first/second conductive vias are plated onto the first through-hole and before third/fourth conductive vias are plated onto the second through-hole. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the conductive vias from extending substantially beyond their respective internal conductive traces, thereby horizontally spitting the two conductive vias plated onto each of the through-holes. This advantageously increases wiring density up to 2×. | 02-25-2010 |
20110189381 | Anti-Corrosion Conformal Coating for Metal Conductors Electrically Connecting an Electronic Component - An apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. A conformal coating overlies the metal conductors and comprises a polymer into which a phosphine compound is impregnated and/or covalently bonded. Accordingly, the conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the phosphine compound in the polymer reacts with any corrosion inducing sulfur component in the air and prevents the sulfur component from reacting with the underlying metal conductors. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide) which would otherwise deplete its availability for the target reaction. The phosphine compound may be rendered completely non-volatile by covalently bonding it directly into the polymer backbone. | 08-04-2011 |
20120122342 | IMPLEMENTING IMPEDANCE GRADIENT CONNECTOR FOR BOARD-TO-BOARD APPLICATIONS - A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs. | 05-17-2012 |
20120211273 | VIA STUB ELIMINATION - An enhanced mechanism is disclosed for via stub elimination in printed wiring boards (PWBs) and other substrates. In one embodiment, the substrate includes a plurality of insulator layers and internal conductive traces. First and second through-holes extend completely through the substrate and respectively pass through first and second ones of the internal conductive traces, which are at different depths within the substrate. Photolithographic techniques are used to generate plated-through-hole (PTH) plugs of controlled, variable depth in the through-holes before first and second conductive vias are respectively plated onto the first and second through-holes. The depth of these PTH plugs is controlled (e.g., using a photomask and/or variable laser power) to prevent the first and second conductive vias from extending substantially beyond the first and second internal conductive traces, respectively, and thereby prevent via stubs from being formed in the first place. | 08-23-2012 |
20140242349 | METHOD AND SYSTEM FOR ALLIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE - The exemplary embodiments of the present invention provide an apparatus and a thermal interface material with aligned graphite nanofibers in the thermal interface material to enhance the thermal interface material performance. The thermal interface material having a thickness between a first surface and a second surface opposite the first surface. The comprising thermal interface material includes a plurality of carbon nanofibers (CNFs), wherein a majority of the CNFs are oriented orthogonal to a plane of the first surface. The apparatus includes the thermal interface material, and a first object having a third surface; and a second object having a fourth surface; wherein the thermal interface material is sandwiched between the third surface and the fourth surface. | 08-28-2014 |