Patent application number | Description | Published |
20100101827 | POLYBUTYLENE NAPHTHALATE-BASED RESIN COMPOSITION AND ELECTRIC WIRE USING THE POLYBUTYLENE NAPHTHALATE-BASED RESIN COMPOSITION - There are provided a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide; and an electric wire using a polybutylene naphthalate-based resin composition, with an insulated coating layer formed on a conductor, by using a polybutylene naphthalate-based resin composition containing polybutylene naphthalate resin, a polyester block copolymer, and magnesium hydroxide as an insulating material. | 04-29-2010 |
20100139943 | COAXIAL CABLE AND MANUFACTURING METHOD OF THE SAME - A coaxial cable includes an internal insulating layer formed on an outer periphery of an electric conductor, and a conductive layer formed on an outer periphery of the internal insulating layer, wherein the conductive layer is made of a metal nanoparticle paste sintered body obtained by sintering metal nanopraticles by irradiation of light toward a metal nanoparticle paste, and an external insulating layer is formed on an outer periphery of the conductive layer. | 06-10-2010 |
20110031001 | COMPOSITE METAL FINE PARTICLE MATERIAL, METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND PRINTED WIRING BOARD AND CABLE - A composite metal fine particle material is provided, in which spherical silver nanoparticles synthesized from a silver compound, a solvent, a reducing agent, and a dispersant, and conductive fillers compose of non-spherical metal fine particles, are mixed. For example, the conductive fillers composed of the non-spherical metal fine particles are formed into slender columnar shapes, plate shapes, or ellipsoidal shapes. | 02-10-2011 |
20110233480 | PRODUCING METHOD OF METAL FINE PARTICLES OR METAL OXIDE FINE PARTICLES, METAL FINE PARTICLES OR METAL OXIDE FINE PARTICLES, AND METAL-CONTAINING PASTE, AND METAL FILM OR METAL OXIDE FILM - There is provided a producing method of metal fine particles or metal oxide fine particles for producing metal fine particles or metal oxide fine particles by atomizing raw materials by performing processes including an oxidizing process and a reducing process to the raw materials composed of metal or a metal compound. | 09-29-2011 |
20130074728 | METAL MICROPARTICLES AND METHOD FOR PRODUCING THE SAME, METAL PASTE CONTAINING THE METAL MICROPARTICLES, AND METAL COAT MADE OF THE METAL PASTE - To provide metal microparticles, with less content of alkali metal, halogen, sulfur, and phosphorus as impurities, wherein surfaces thereof are coated with a protective agent, and the protective agent is selected from at least one type of an amine compound and a calboxylic acid compound, and a total content of the alkali metal, halogen, sulfur, and phosphorus contained in the metal microparticles is less than 0.1 mass % relative to a mass of the metal microparticles. | 03-28-2013 |
20130220674 | Adhesive Composition, Varnish, Adhesive Film and Wiring Film - Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. | 08-29-2013 |
20130220677 | Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same - Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film. | 08-29-2013 |
20130233590 | ADHESIVE FILM AND FLAT CABLE USING THE SAME - There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts.wt. or more and 250 pts.wt. or less with respect to 100 pts.wt. of the mixed resin composition. | 09-12-2013 |