Patent application number | Description | Published |
20130212024 | TOKENIZATION IN DISTRIBUTED PAYMENT ENVIRONMENTS - Data can be protected in mobile and payment environments through various tokenization operations. A mobile device can tokenize communication data based on device information and session information associated with the mobile device. A payment terminal can tokenize payment information received at the payment terminal during a transaction based on transaction information associated with the transaction. Payment data tokenized first a first set of token tables and according to a first set of tokenization parameters by a first payment entity can be detokenized or re-tokenized with a second set of token tables and according to a second set of tokenization parameters. Payment information can be tokenized and sent to a mobile device as a token card based on one or more selected use rules, and a user can request a transaction based on the token card. The transaction can be authorized if the transaction satisfies the selected use rules. | 08-15-2013 |
20150095252 | Table-Connected Tokenization - A tokenization system tokenizes sensitive data to prevent unauthorized entities from accessing the sensitive data. The tokenization system accesses sensitive data, and retrieves an initialization vector (IV) from an IV table using a first portion of the sensitive data. A second portion of the sensitive data is modified using the accessed initialization vector. A token table is selected from a set of token tables using a third portion of the sensitive data. The modified second portion of data is used to query the selected token table, and a token associated with the value of the modified second portion of data is accessed. The second portion of the sensitive data is replaced with the accessed token to form tokenized data. | 04-02-2015 |
20150095367 | Mapping Between Tokenization Domains - A tokenization environment includes a first tokenization system in a first token domain and a second tokenization system in a second token domain. A token mapper accesses a first token from the first tokenization system and maps it to a second token from the second tokenization system. The first token can be a single-use or SLT token mapped to a clear text value within a single-use token table in the first tokenization system. The token mapper can identify the clear text value, and can query a multi-use token table in the second tokenization system with the clear text value to identify a multi-use token (the second token) mapped to the same clear text value. The token mapper can store the association between the first token and the second token in a token map. | 04-02-2015 |
20150096040 | Tokenization Column Replacement - A tokenization system includes a vector table and one or more token tables. The tokenization system accesses sensitive data and a vector from a vector table column, and modifies the sensitive data based on the accessed vector. The tokenization system then queries the one or more token tables using a portion of the modified data to identify a token mapped to the portion of the modified data. The portion of the modified data is replaced with the token to create tokenized data. The vector table can be updated by replacing a vector table column with an updated vector table column. The tokenization system can modify subsequent data using the updated vector column prior to tokenization. | 04-02-2015 |
20150096046 | Verifiable Tokenization - Use rules are included within tokenized data either before or after tokenization. The use rules can be appended to the data before or after tokenization, can be used to modify the data before or after tokenization, and can be used to select or generate token tables for use in tokenizing the data. The use rules limit how, where, and when the tokenized data can be used, who can use the tokenized data, and the like. In addition, data can be tokenized such that the tokenized data can be identified as tokenized based on the tokenized data failing a validation test. The data is tokenized using one or more token tables, and the validation test is applied to the tokenized data. If the tokenized data passes the validation test, the data is modified with formatting rules or re-tokenized with additional token tables until the tokenized data fails the validation test. | 04-02-2015 |
20150365398 | Verifiable Tokenization - Use rules are included within tokenized data either before or after tokenization. The use rules can be appended to the data before or after tokenization, can be used to modify the data before or after tokenization, and can be used to select or generate token tables for use in tokenizing the data. The use rules limit how, where, and when the tokenized data can be used, who can use the tokenized data, and the like. In addition, data can be tokenized such that the tokenized data can be identified as tokenized based on the tokenized data failing a validation test. The data is tokenized using one or more token tables, and the validation test is applied to the tokenized data. If the tokenized data passes the validation test, the data is modified with formatting rules or re-tokenized with additional token tables until the tokenized data fails the validation test. | 12-17-2015 |
Patent application number | Description | Published |
20090017617 | METHOD FOR FORMATION OF HIGH QUALITY BACK CONTACT WITH SCREEN-PRINTED LOCAL BACK SURFACE FIELD - A thin silicon solar cell having a back dielectric passivation and rear contact with local back surface field is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A barrier layer and a dielectric layer are applied at least to the back surface of the silicon wafer to protect the silicon wafer from deformation when the rear contact is formed. At least one opening is made to the dielectric layer. An aluminum contact that provides a back surface field is formed in the opening and on the dielectric layer. The aluminum contact may be applied by screen printing an aluminum paste having from one to 12 atomic percent silicon and then applying a heat treatment at 750 degrees Celsius. | 01-15-2009 |
20090025786 | SOLAR CELL HAVING HIGH QUALITY BACK CONTACT WITH SCREEN-PRINTED LOCAL BACK SURFACE FIELD - A thin silicon solar cell having a back dielectric passivation and rear contact with local back surface field is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A barrier layer and a dielectric layer are applied at least to the back surface of the silicon wafer to protect the silicon wafer from deformation when the rear contact is formed. At least one opening is made to the dielectric layer. An aluminum contact that provides a back surface field is formed in the opening and on the dielectric layer. The aluminum contact may be applied by screen printing an aluminum paste having from one to 12 atomic percent silicon and then applying a heat treatment at 750 degrees Celsius. | 01-29-2009 |
20090286349 | SOLAR CELL SPIN-ON BASED PROCESS FOR SIMULTANEOUS DIFFUSION AND PASSIVATION - A thin silicon solar cell having a high quality spin-on dielectric layer is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A first dielectric layer is applied to the rear surface of the silicon wafer using a spin-on process. A high temperature furnace operation provides simultaneous emitter diffusion and front and rear surface passivation. During this high temperature operation, the front emitter is formed, the rear spin-on dielectric layer is cured, and the front dielectric layer is thermally grown. Barrier layers are formed on the dielectric layers. Openings are made in the barrier layers. Contacts are formed in the openings and on the back surface barrier layer. | 11-19-2009 |
20090301559 | SOLAR CELL HAVING A HIGH QUALITY REAR SURFACE SPIN-ON DIELECTRIC LAYER - A thin silicon solar cell having a high quality spin-on dielectric layer is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A first dielectric layer is applied to the rear surface of the silicon wafer using a spin-on process. A high temperature furnace operation provides simultaneous emitter diffusion and front and rear surface passivation. During this high temperature operation, the front emitter is formed, the rear spin-on dielectric layer is cured, and the front dielectric layer is thermally grown. Barrier layers are formed on the dielectric layers. Openings are made in the barrier layers. Contacts are formed in the openings and on the back surface barrier layer. | 12-10-2009 |
20090325327 | METHOD FOR CLEANING A SOLAR CELL SURFACE OPENING MADE WITH A SOLAR ETCH PASTE - A thin silicon solar cell having a back dielectric passivation and rear contact with local back surface field is described. Specifically, the solar cell may be fabricated from a crystalline silicon wafer having a thickness from 50 to 500 micrometers. A barrier layer and a dielectric layer are applied at least to the back surface of the silicon wafer to protect the silicon wafer from deformation when the rear contact is formed. At least one opening is made to the dielectric layer. An aluminum contact that provides a back surface field is formed in the opening and on the dielectric layer. The aluminum contact may be applied by screen printing an aluminum paste having from one to 12 atomic percent silicon and then applying a heat treatment at 750 degrees Celsius. | 12-31-2009 |