Patent application number | Description | Published |
20140079188 | Photo Emitter X-Ray Source Array (PeXSA) - A photo-emitter x-ray source is provided that includes a photocathode electron source, a laser light source, where the laser light source illuminates the photocathode electron source to emit electrons, and an X-ray target, where the emitted electrons are focused on the X-ray target, where the X-ray target emits X-rays. The photocathode electron source can include alkali halides (such as CsBr and CsI), semiconductors (such as GaAs, InP), and theses materials modified with rare Earth element (such as Eu) doping, electron beam bombardment, and X-ray irradiation, and has a form factor that includes planar, patterned, of optically patterned. The X-ray target includes a material such as tungsten, copper, rhodium or molybdenum. The laser light source is pulsed or steered according to light modulators that can include acousto-optics, mode-locking, micro-mirror array, and liquid crystals, and includes a nano-aperture or nano-particle arrays, where the nano-aperture is a C-aperture or a circular aperture. | 03-20-2014 |
20140265828 | Enhanced photoelectron sources using electron bombardment - A method of achieving heightened quantum efficiencies and extended photocathode lifetimes is provided that includes using an electron beam bombardment to activate color centers in a CsBr film of a photocathode, and using a laser source for pumping electrons in the color centers of the photocathode. | 09-18-2014 |
Patent application number | Description | Published |
20120149152 | METHOD TO PREVENT METAL PAD DAMAGE IN WAFER LEVEL PACKAGE - The present disclosure provide a method of manufacturing a microelectronic device. The method includes forming a bonding pad on a first substrate; forming wiring pads on the first substrate; forming a protection material layer on the first substrate, on sidewalls and top surfaces of the wiring pads, and on sidewalls of the bonding pad, such that a top surface of the bonding pad is at least partially exposed; bonding the first substrate to a second substrate through the bonding pad; opening the second substrate to expose the wiring pads; and removing the protection material layer. | 06-14-2012 |
20120161582 | MEMS KINETIC ENERGY CONVERSION - The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, and a piezoelectric element over the MEMS movable structure. Frontside and backside capping wafers are bonded to the MEMS structure, with the frontside and backside capping wafers encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element. The device further includes a magnet disposed on the frontside capping wafer over the plurality of metal loops. | 06-28-2012 |
20120235647 | SENSOR WITH ENERGY-HARVESTING DEVICE - In some embodiments of the present disclosure, a sensor comprises a substrate, a sensor element and an energy-harvesting device. The sensor element comprises a plate, and the plate is moveable with respect to the substrate. The energy-harvesting device is formed on the plate of the sensor element. | 09-20-2012 |
20130037891 | MEMS DEVICE AND METHOD OF FORMATION THEREOF - The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate. | 02-14-2013 |
20130147317 | MEMS KINETIC ENERGY CONVERSION - The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The MEMS movable structure, the plurality of metal loops, and the piezoelectric element are encapsulated. | 06-13-2013 |
20140208580 | SENSOR WITH ENERGY-HARVESTING DEVICE - A method of fabricating a device includes forming a moveable plate over a substrate, and forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the energy harvesting coil, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes forming electrodes around the moveable plate, the electrodes adapted to sense motion of the moveable plate. | 07-31-2014 |
20140231967 | SYSTEMS AND METHODS FOR POST-BONDING WAFER EDGE SEAL - A method for fabricating a semiconductor device is disclosed. A first substrate is arranged over a second substrate. A wafer bonding process is performed on the semiconductor device. First regions of the device are enclosed by the bonding process. Second regions of the device remain exposed. One or more processes are performed on the exposed second regions, after performing the wafer bonding process. The one or more processes include a fill process that forms a fill material within the exposed second regions. An edge seal material is applied on the first and second substrates after performing the one or more processes. | 08-21-2014 |
20140248730 | MEMS Device and Method of Formation Thereof - The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate. | 09-04-2014 |
20140270272 | Structure and Method for Integrated Microphone - The present disclosure provides one embodiment of an integrated microphone structure. The integrated microphone structure includes a first silicon substrate patterned as a first plate; a silicon oxide layer formed on one side of the first silicon substrate; a second silicon substrate bonded to the first substrate through the silicon oxide layer such that the silicon oxide layer is sandwiched between the first and second silicon substrates; and a diaphragm secured on the silicon oxide layer and disposed between the first and second silicon substrates, wherein the first plate and the diaphragm are configured to form a capacitive microphone. | 09-18-2014 |
20150091636 | ENERGY-HARVESTING DEVICE AND METHOD OF FORMING THE SAME - A method of fabricating a device includes forming a moveable plate over a substrate. The method further includes forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes enclosing the movable plate using a capping wafer. | 04-02-2015 |
20150123129 | WAFER LEVEL PACKAGING TECHNIQUES - In a wafer level chip scale packaging technique for MEMS devices, a deep trench is etched on a scribe line area between two CMOS devices of a CMOS substrate at first. After bonding of the CMOS substrate with a MEMS substrate, the deep trench is opened by thin-down process so that CMOS substrate is singulated while MEMS substrate is not (partial singulation). Electrical test pad on MEMS substrate is exposed and protection material can be filled through the deep trench around bonding layers. After filling the protection material, the wafer is diced to form packaged individual chips with protection from environment outside bonding layer. | 05-07-2015 |
20160126819 | ENERGY-HARVESTING DEVICE - A semiconductor device includes a moveable element over a substrate, wherein the moveable element is moveable relative to the substrate. The semiconductor device further includes a first anchor portion connected to the substrate; and a second anchor portion connected to the substrate on an opposite side of the moveable element from the first anchor portion. The semiconductor device further includes a first connector configured to connect the moveable element to the first anchor portion. The semiconductor device further includes a second connector configured to connect the moveable element to the second anchor portion. The semiconductor device further includes a conductive wire loop on the moveable element; and a connection wire electrically connected to a first end of the conductive wire loop, wherein the connection wire extends across the first connector to the first anchor portion. | 05-05-2016 |
Patent application number | Description | Published |
20130149901 | REINFORCED CONNECTOR WITH A CROSSTALK PREVENTION FEATURE - A connector includes terminal elements each having a base, multiple terminals securely received in the base with first ends and second ends, positioning blocks formed on one side face of the base and cutouts defined in a top portion of the base, a casing having receiving spaces defined in the casing for receiving the second ends of the terminals, positioning holes each defined to communicate with a corresponding one of the receiving spaces to position therein the second end of the terminals and ribs formed inside the casing to isolate each of the terminals from influence from the other terminals and an insert having receiving holes defined to receive therein the terminal elements and transverse columns corresponding to the cutouts of the terminal elements such that with the transverse columns received in the corresponding cutouts, connection between the insert and the terminal elements is secured. | 06-13-2013 |
20130149909 | CONNECTOR MODULE WITH A CONNECTING DEVICE - A connector includes a receptacle and terminal modules each inserted into the receptacle and having a base and a plurality of terminals securely extended through the base. A block is formed on a side of the base and a cutout is defined on the side of the base to structurally correspond to the block so that two adjacent bases are connected together. | 06-13-2013 |
20140242850 | SURFACE MOUNT CONNECTOR - An electrical connector includes a housing and a terminal module assembly. The terminal module assembly includes pairs of first terminal assemblies and second terminal assemblies. Each first terminal assembly comprises a first terminal block with at least one first protrusion and at least one first recess, and a plurality of first terminals securely extending through the first terminal block. Each second terminal assembly comprises a second terminal block with at least one second protrusion and at least one second recess and a plurality of second terminals securely extending through the second terminal block. The first protrusion is engaged with the second recess, the second protrusion is engaged with the first recess, and bottom surfaces of the first and second protrusions are secured in notches on the top surface of a interior wall when the terminal module assembly is received in the housing. | 08-28-2014 |
20140295705 | CROSSTALK-PROOF RECEPTACLE CONNECTOR - A crosstalk-proof receptacle connector has multiple insulative boards, multiple sets of terminals, multiple sets of shielding plates and an outer casing. The insulative boards are arranged abreast. The sets of the terminals are mounted respectively in the insulative boards. The terminals of each set are classified into signal terminals and grounding terminals. Each set of the shielding plates is mounted on one of two opposite sides of a corresponding insulative board. The shielding plates of each set are spaced apart without contacting one another. Each shielding plate has multiple folding sections capable of interrupting signal noise. The outer casing covers the insulative boards to combine the insulative boards. The sets of the shielding plates decrease signal interference of the receptacle connector and improve signal transmission efficiency and stability. | 10-02-2014 |
20140342607 | CROSSTALK-PROOF RECEPTACLE CONNECTOR - A crosstalk-proof receptacle connector includes: multiple insulative boards arranged abreast; multiple sets of terminals mounted respectively in and corresponding to the insulative boards, and each set including signal terminals and grounding terminals; multiple shielding plates corresponding to the insulative boards and corresponding to the sets of the terminals, each shielding plate mounted on one of two opposite sides of a corresponding insulative board and having multiple current-path-interrupting holes defined through the shielding plate and kept hollow without being inserted by objects, and each shielding plate connected to the grounding terminals of a corresponding set of the terminals; and an outer casing covering the insulative boards to combine the insulative boards. The crosstalk-proof receptacle connector suppresses crosstalk and improves efficiency and stability of signal transmission. | 11-20-2014 |
20150079844 | Electrical Connector Capable of Suppressing Crosstalk - An electrical connector includes insulating portions arranged side by side, terminal sets, shield sets, and a casing. Each terminal set includes signal terminals and ground terminals. Each signal/ground terminal includes a fixing section disposed in the insulating portion, an assembling section downwardly stretching from the fixing section to protrude from the insulating portion, and a contacting section forwardly stretching from the fixing section to protrude from the insulating portion. Each shield set including shields is disposed on a lateral surface of the insulating portion. Each shield is spacedly arranged and connected to the ground terminal. Each shield includes a body section having at least one bending section, and a protrusion section protruding from the body section. The body section and the protrusion section shield the assembling section and the contacting section of the signal terminal respectively. It can effectively suppress crosstalk between the signal terminals by the shield sets. | 03-19-2015 |
Patent application number | Description | Published |
20150090999 | WHITE LED - A white LED is provided. The white LED includes a P-type layer, a tunneling structure, an N-type layer, an N-type electrode, and a P-type electrode. The tunneling structure is disposed over the P-type layer. The tunneling structure includes a first barrier layer, an active layer and a second barrier layer. The first barrier layer includes a first metal oxide layer. The active layer includes a second metal oxide layer. The second barrier layer includes a third metal oxide layer. The N-type layer is disposed over the tunneling structure. The N-type electrode and the P-type electrode are respectively contacted with the N-type layer and the P-type layer. An energy gap of the second metal oxide layer is lower than an energy gap of the first metal oxide layer and is lower than an energy gap of the third metal oxide layer. | 04-02-2015 |
20150091019 | WHITE LED CHIP AND WHITE LED PACKAGING DEVICE - A white LED chip includes a P-type layer, a tunneling structure, an N-type layer, an N-type electrode, and a P-type electrode. The tunneling structure is disposed over the P-type layer. The tunneling structure includes a first barrier layer, an active layer and a second barrier layer. The first barrier layer includes a first material layer, the active layer includes a second material layer, and the second barrier layer includes a third material layer. The N-type layer is disposed over the tunneling structure. An energy gap of the second material layer is lower than an energy gap of the first material layer and an energy gap of the third material layer. Each of the first material layer, the second material layer and the third material layer is a metal oxide layer, a metal nitride layer or a metal oxynitride layer. | 04-02-2015 |