Yi-Hsiung
Yi-Hsiung Chen, Dashi TW
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20090206362 | Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diode - The main objective of present invention is to provide a manufacturing method of light emitting diode that utilizes metal diffusion bonding technology. AlInGaP light emitting diode epitaxial structure on a temporary substrate is bonded to a permanent substrate having a thermal expansion coefficient similar to that of the epitaxial structure, and then the temporary substrate is removed to produce an LED having a vertical structure and better performance. The other objective of the present invention is to provide a high performance LED that uses metal diffusion technology and wet chemical etching technology to roughen the LED surface in order to improve light extraction efficiency. | 08-20-2009 |
Yi-Hsiung Chou, New Taipei City TW
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20160105040 | CHARGING DEVICE - A charging device includes a plurality of DC charging ports, a detecting circuit and a current output unit. The DC charging ports includes at least one first charging port and at least one second charging port. The output currents provided by the first charging port and the second charging port are lower than or equal to a first current limit and a second current limit, respectively. The detecting circuit is coupled to the DC charging ports to detect the output currents from the DC charging ports. When the current required by the first charging port is lower than the first current limit, the current output unit correspondingly supplies a requested current to the first charging port and distributes a surplus current to the second charging port. A total current limit of the DC charging ports is higher than a supply current limit. | 04-14-2016 |
Yi-Hsiung Huang, Tainan City TW
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20120158773 | METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR ACTIVATING INFORMATION OF OBJECT COMPUTER SYSTEM - An object association system for activating associated information is provided. The system includes an environment recognition and monitor module, a feature analyzer and builder module, a feature repository, a feature matching module, and an actuator module. The environment recognition and monitor module is configured for detecting an object that is opened and extracting digital environment information and physical environment sensor information corresponding to the object. The feature analyzer and builder module is configured for generating a digital environment feature and a physical environment feature corresponding to the object, building an environment feature association model according to the digital environment feature, the physical environment feature and a text feature corresponding to the object and storing the environment feature association model in the feature repository. When the object is re-opened, the feature matching module identifies other objects related to the object, and the actuator module displays information related to the other objects. | 06-21-2012 |
20120330600 | ELECTRONIC DEVICE, POSITIONING METHOD, POSITIONING SYSTEM, COMPUTER PROGRAM PRODUCT, AND COMPUTER-READABLE RECORDING MEDIUM - An electronic device, a positioning method, a positioning system, a computer program product, and a computer-readable recording medium are provided. The electronic device includes at least one wireless transceiver, at least one measurement unit (MU), and a processor. The processor is coupled with the wireless transceiver and the MU. The processor obtains distances between a plurality of participant devices through the wireless transceiver, wherein the participant devices include the electronic device. The processor obtains a displacement of each of the participant devices through the wireless transceiver and the MU and determines the spatial location of each of the participant devices according to the distances and the displacements. | 12-27-2012 |
Yi-Hsiung Huang, Taichung City TW
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20160057118 | COMMUNICATION SECURITY SYSTEM AND METHOD - A communication security system includes a secure communication application module and a chip module. The communication security system is installed in a mobile device. Accordingly, the communication security system of the present invention allows mobile devices of users to encrypt and decrypt communication data between the users. A communication security method includes the steps of generating keys, requesting a key exchange by a first mobile device, receiving a key exchange by a second mobile device, receiving a key exchange by the first mobile device, activating a key by the second mobile device, activating a key by the first mobile device, and starting secure communication between the first and second devices. Thus, the encrypted communication can avoid theft and unauthorized falsification. | 02-25-2016 |
20160099752 | COMMUNICATION SYSTEM AND METHOD FOR NEAR FIELD COMMUNICATION - A communication system includes an HCE application module and a security module. The HCE application module can carry out NFC and transmit an NFC signal in software format. The security module can provide a secure storage for storing at least one NFC applet, receive the NFC signal from the HCE application module, and carry out a process corresponding to the NFC signal. A communication method includes the steps of activating the HCE application module; enabling connection between the HCE application module and the security module; waiting for an NFC signal from an NFC reader; receiving the signal; processing and transmitting the signal to the security module; storing at least one transaction-related key and transaction-related data of the | 04-07-2016 |
Yi-Hsiung Lin, Taipei TW
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20090035588 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME - A semiconductor structure and method of manufacturing the semiconductor structure, and more particularly to a semiconductor structure having reduced metal line resistance and a method of manufacturing the same in back end of line (BEOL) processes. The method includes forming a first trench extending to a lower metal layer Mx+1 and forming a second trench remote from the first trench. The method further includes filling the first trench and the second trench with conductive material. The conductive material in the second trench forms a vertical wiring line extending orthogonally and in electrical contact with an upper wiring layer and electrically isolated from lower metal layers including the lower metal layer Mx+1. The vertical wiring line decreases a resistance of a structure. | 02-05-2009 |
20110183491 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME - A semiconductor structure and method of manufacturing the semiconductor structure, and more particularly to a semiconductor structure having reduced metal line resistance and a method of manufacturing the same in back end of line (BEOL) processes. The method includes forming a first trench extending to a lower metal layer Mx+ | 07-28-2011 |