Yim, Seongnam-Si
Choong Bin Yim, Seongnam-Si KR
Patent application number | Description | Published |
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20090026597 | STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM - A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe. | 01-29-2009 |
20090065949 | Semiconductor package and semiconductor module having the same - A semiconductor package can include a semiconductor chip, an insulating substrate, first bond fingers, and pads. The insulating substrate can be attached to edge portions of the semiconductor chip. The first bond fingers can be arranged on edge portions of an upper surface of the insulating substrate. Further, the first bond fingers can be electrically connected to the semiconductor chip. The pads can be arranged on a central portion of the upper surface of the insulating substrate. Further, the pads can be electrically connected to the first bond fingers. Thus, types of stackable devices that can be mounted on or in the semiconductor package need not be restricted. | 03-12-2009 |
20090134509 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed. | 05-28-2009 |
20100230796 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD FOR MAKING THEREOF - A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface. | 09-16-2010 |
20110260313 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a carrier; mounting an integrated circuit die on a top side of the carrier; connecting the integrated circuit die with the carrier; forming an encapsulation having a multi-sloped side over the integrated circuit die for reducing ejection stress; and forming a first external interconnect on the top side of the carrier adjacent to and separated from the encapsulation including forming a second external interconnect on a bottom side of the carrier opposite the first external interconnect. | 10-27-2011 |
Dong-Kil Yim, Seongnam-Si KR
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20090064934 | SOURCE GAS FLOW PATH CONTROL IN PECVD SYSTEM TO CONTROL A BY-PRODUCT FILM DEPOSITION ON INSIDE CHAMBER - The present invention generally comprises a method and an apparatus for guiding the flow of processing gases away from chamber walls and slit valve opening. By controlling the flow path of the process gases within a processing chamber, undesirable deposition upon chamber walls and within slit valve openings may be reduced. By reducing deposition in slit valve openings, flaking may be reduced. By reducing deposition on chamber walls, the time between chamber cleaning may be increased. Thus, guiding the flow of processing gases within the processing chamber may increase substrate throughput. | 03-12-2009 |
20090200551 | MICROCRYSTALLINE SILICON THIN FILM TRANSISTOR - Methods for forming a microcrystalline silicon layer in a thin film transistor structure are provided. In one embodiment, a method for forming a microcrystalline silicon layer includes providing a substrate in a processing chamber, supplying a first gas mixture having a hydrogen containing gas to a silicon containing gas flow rate ratio greater than about 200:1 into the processing chamber, maintaining a first process pressure greater than about 6 Torr in the processing chamber to deposit a first microcrystalline silicon containing layer in presence of a plasma formed from the first gas mixture, supplying a second gas mixture into the processing chamber, and maintaining a second process pressure less than about 5 Torr in the processing chamber to deposit a second microcrystalline silicon containing layer in presence of a plasma formed from the second gas mixture. | 08-13-2009 |
Jin-Woo Yim, Seongnam-Si KR
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20130308841 | METHOD AND APPARATUS FOR IMAGE PROCESSING - An image processing method and apparatus includes receiving a transmission image as an input image, obtaining a threshold which is applied to noise removal, based on at least one image information from among information related to a pixel intensity of the input image and an edge map, and removes noise in the input image by using the threshold. | 11-21-2013 |
20140276045 | METHOD AND APPARATUS FOR PROCESSING ULTRASOUND DATA USING SCAN LINE INFORMATION - A method of and apparatus for processing ultrasound data acquired from an object is provided. With the methods and apparatuses of the exemplary embodiments, speckles in an ultrasound image are reduced by using scan line information of an ultrasound signal applied to the object prior to scan conversion of the ultrasound image. | 09-18-2014 |
Joung Han Yim, Seongnam-Si KR
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20110262374 | NOVEL COMPOUND RAMALIN AND USE THEREOF - The present invention relates to a novel compound having excellent antioxidant activity, isolated from | 10-27-2011 |
Jung-Gil Yim, Seongnam-Si KR
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20090198726 | METHOD AND APPARATUS FOR ORGANIZING CONTENTS - A method and apparatus to organize content, which can systematically and efficiently organize and manage contents. The method includes creating a content list and providing the content list to a user; providing a user interface to the user to organize content included in the content list in units of time periods; storing organization schedule information organization schedule information obtained by the user interface as extensible Markup Language (XML) information; and transmitting the organization schedule information and enabling the content to be provided to the user according to the organization schedule information. | 08-06-2009 |
Yong-Sik Yim, Seongnam-Si KR
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20090286404 | Method of forming minute patterns in semiconductor device using double patterning - A method of forming minute patterns in a semiconductor device, and more particularly, a method of forming minute patterns in a semiconductor device having an even number of insert patterns between basic patterns by double patterning including insert patterns between a first basic pattern and a second basic pattern which are transversely separated from each other on a semiconductor substrate, wherein a first insert pattern and a second insert pattern are alternately repeated to form the insert patterns, the method includes the operation of performing a partial etching toward the second insert pattern adjacent to the second basic pattern, or the operation of forming a shielding layer pattern, thereby forming the even number of insert patterns. | 11-19-2009 |
20110034030 | METHOD OF FORMING MINUTE PATTERNS IN SEMICONDUCTOR DEVICE USING DOUBLE PATTERNING - A method of forming minute patterns in a semiconductor device, and more particularly, a method of forming minute patterns in a semiconductor device having an even number of insert patterns between basic patterns by double patterning including insert patterns between a first basic pattern and a second basic pattern which are transversely separated from each other on a semiconductor substrate, wherein a first insert pattern and a second insert pattern are alternately repeated to form the insert patterns, the method includes the operation of performing a partial etching toward the second insert pattern adjacent to the second basic pattern, or the operation of forming a shielding layer pattern, thereby forming the even number of insert patterns. | 02-10-2011 |
Yu Ik Yim, Seongnam-Si KR
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20140011592 | APPARATUS, METHOD AND COMPUTER READABLE RECORDING MEDIUM FOR INTERWORKING ACCOUNT BASED ON MOBILE TERMINAL AND ACCOUNT BASED ON GAME - An apparatus for interworking a mobile terminal account and a gaming account by interworking game record information in the mobile terminal and a game integration account used in multiple games. The method includes: storing information, on a storage device, on a game integration ID used to manage games for the gaming account; receiving, from a mobile terminal, unique terminal identification information of the mobile terminal; confirming whether a mobile ID is mapped to the terminal identification information; creating a mobile ID mapped to the terminal identification information when the confirming determines that a mobile ID is not mapped to the terminal identification information; and mapping, one-to-one, the created mobile ID and the game integration ID. | 01-09-2014 |
20150067788 | CONNECTION MANAGEMENT METHOD AND SYSTEM FOR RELAYING CLIENT AND BACKEND OF SERVER ON SERVER SIDE - Provided is a connection management method and system for relaying a client and a backend module of a server on a server side. A connection management method performed by a connection management system may include receiving a request message from a client device, adding an authentication tag and a service tag for a connection to the request message, verifying a right of the authentication tag and a right of the service tag using a uniform resource identifier (URI) of the request message, searching for a service corresponding to the request message using the URI, and transferring the request message to the found service. | 03-05-2015 |