Yu-Chou
Yu-Chou Chiang, Changhua TW
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20140348446 | Stand-up paper bag - A stand-up paper bag is provided with a bottom panel; two major panels joined one ends wherein one major panel includes a first fold line formed with the bottom panel; and two minor panels each joined the major panels, each minor panel including a crease. The bottom panel includes a first sub-panel adjacent to the first fold line, an extension distal the first fold line, a second sub-panel between the first sub-panel and the extension, a second fold line between the first sub-panel and the second sub-panel, a third fold line between the extension and the second sub-panel, a first triangular incision on one ends of the first and second sub-panels, and a second triangular incision on other ends of the first and second sub-panels. | 11-27-2014 |
Yu-Chou Hu, Taoyuan TW
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20140252947 | ILLUMINANT DEVICE WITH OVER-TEMPERATURE PROTECTING FUNCTION - An illuminant device with over-temperature protection is electrically connected to a power source and includes a housing, a illuminant element, a resistor, and an over-temperature protective element. The housing includes an upper portion, a lower portion opposite to the upper portion, and two accommodating spaces communicating with the upper end and the lower end respectively. The illuminant element is placed on the upper portion. The resistor is located within one of the accommodating space and electrically connected to the illuminant element. The over-temperature protective element is located within the other accommodating space and electrically connected to the illuminant element. The over-temperature protective element senses temperatures of the illuminant element and selectively breaks the power source, such that the illuminant element is switched between conductive and non-conductive. | 09-11-2014 |
Yu-Chou Hu, Taoyuang TW
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20150285441 | ILLUMINANT DEVICE - An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer. | 10-08-2015 |
Yu-Chou Hu, Nantou County TW
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20090171510 | METHOD AND SYSTEM FOR CONTROLLING LED WITH POWER LINE CARRIER - A method and a system for controlling LED with power line carrier are disclosed. The system contains a host controller, an electric power conductor, and at least a luminous device, and the luminous device further containing an environmental data collection module. The method comprises the steps of providing a power line carrier module to both the host controller and the luminous devices; the luminous devices detecting a set of environmental data by the environmental data collection module; the luminous devices transmitting the set of environmental data to the host controller; the host controller recording and analyzing the set of environmental data; and the host controller sending a control signal to the luminous devices according to the analysis. Therein the control signal and the set of environmental data are transmitted by the power line carrier module through the electric power conductor. | 07-02-2009 |
Yu-Chou Hu, Yangmei TW
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20130002155 | LIGHT-EMITTING DIODE MODULE AND METHOD FOR OPERATING THE SAME - A light-emitting diode (LED) module and a method for operating the same are disclosed. The LED module is supplied through an external voltage source. The LED module includes a bridge rectifying unit, a LED unit, and an integrated circuit (IC) unit. The bridge rectifying unit rectifies the external voltage source into an inner DC voltage source. The LED unit is electrically connected to the bridge rectifying unit and driven through the DC voltage source. The IC unit is electrically connected to the bridge rectifying unit and the LED unit and is supplied through the DC voltage source, thus providing a piecewise constant-current control or a piecewise variant-current control to the LED unit. | 01-03-2013 |
20130301261 | ILLUMINANT DEVICE - An illuminant device includes a housing, a circuit board, a plurality of LED dies, a light-transmitting layer, a controlling and driving module and a conductive connector. One end of the housing has a carrying part. The circuit board is disposed on the carrying part and has a circuit layer. The LED dies are placed on the circuit board and electrically connected to the circuit layer. The light-transmitting layer is circularly disposed on the circuit board and covering the LED dies. The controlling and driving module is placed on the circuit board and electrically connected to the circuit layer. The conductive connector is assembled with the other end of the housing and electrically connected to the circuit layer. | 11-14-2013 |
Yu-Chou Tai, Zhonghe TW
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20110004991 | Flush toilet with a urine funnel - A flush toilet with an additional urine funnel comprises a bowl, a urine funnel, a toilet seat and a delivery tube. A concave portion is provided at frontal side of the bowl sized for receiving said urine funnel. Said toilet seat is coupled to the bowl pivotally and covers the urine funnel. The delivery tube is connecting with the urine funnel and said urine funnel can be ascended to a predetermined height as the toilet seat is lifted. | 01-13-2011 |
Yu-Chou Tseng, Chiayi City TW
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20130307128 | SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION STRUCTURES AND EMI SHIELDING - Semiconductor packages and related methods. The semiconductor package includes a substrate, a semiconductor chip, a package body, a recess and a conductive layer. The substrate includes a grounding element. The semiconductor chip is disposed on the substrate and has a lateral surface and an upper surface. The package body encapsulates the lateral surface of the semiconductor chip. The recess is formed in the package body and exposes the upper surface of the semiconductor chip. The conductive layer covers an outer surface of the package body, the grounding element and the upper surface of the semiconductor chip exposed by the recess to provide both thermal dissipation and EMI shielding for the semiconductor chip. | 11-21-2013 |
Yu-Chou Tseng, Columbus, OH US
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20150150832 | METHODS FOR SUPPRESSING CANCER-RELATED CACHEXIA - Methods of suppressing cachexia in a mammal with cancer comprising administering HDAC inhibitors are provided. Aspects include methods of administering an HDAC class 1 and 2b inhibitor in an amount effective to substantially maintain the mammal's weight compared to a mammal that does receive the HDAC class 1 and 2b inhibitor. | 06-04-2015 |
Yu-Chou Wu, Taipei TW
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20100003078 | ANTI-TERROR CAR-ATTACK DEFENDING APPARATUS - A car-attack defending apparatus includes a pressure-sensitive reaction module, an emergent airbag-inflation module, a crash barrier module, and an integral exterior unit module, wherein the pressure-sensitive reaction module has a pressure-sensitive setting and triggering mechanism, the emergent inflation airbag module has an emergent airbag expansion mechanism, and the crash barrier module has a crash-resistant steel plate. The car-attack defending apparatus can be disposed at entrances of specific buildings or restricted areas, so that at the moment a suspected car ignores warning and attempts to access the site, the emergent airbag expansion mechanism will be triggered, by the weight of the car, so as to expand the airbag simultaneously, and to stretch the crash-resistant steel plate to form a barrier. As such, the suspected car can be prevented from moving further, allowing checkpoint personnel a safe standoff distance from car bombs. | 01-07-2010 |