Patent application number | Description | Published |
20080225286 | Method And Apparatus For Detecting Defects - A defect inspection method and apparatus that can easily and quickly determine, from among a plurality of inspection conditions, a condition that allows for an inspection with high sensitivity. The inspection apparatus has a variety of optical functions to cover a variety of kinds of defects to be inspected (shape, material, nearby pattern, etc.). For each optical function, grayscale depths of defects that the operator wants detected and of pseudo defects that he or she wants undetected are accumulated for future use, so that conditions conducive to a higher sensitivity and a lower pseudo defect detection rate can be selected efficiently. Conditions that can be selected for optical systems include a bright-field illumination, a dark-field illumination and a bright-/dark-field composite illumination, illumination wavelength bands, polarization filters and spatial filters. | 09-18-2008 |
20090059216 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A defect inspection apparatus comprises: a stage which scans a sample in a horizontal plane; an illumination optical system which illuminates light at an oblique angle with respect to a normal of a sample surface, and illuminates light in a linear form on the sample at an angle inclined to a direction perpendicular to the scanning direction of the stage; a front scattered light detection optical system which is disposed in the same orientation as the scanning direction, positioned at an elevation angle where a specular reflection light from a pattern parallel to the scanning direction is not spatially detected, and detects scattered light from a region illuminated in the linear form; an image sensor detecting an image formed by the front scattered light detection optical system; and an image processing unit performing a comparison operation of the image detected by the image sensor, thereby determining a defect candidate. | 03-05-2009 |
20090141269 | Defect Inspection Method And System - An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably. | 06-04-2009 |
20090213215 | DEFECT INSPECTION APPARATUS AND METHOD - In a defect inspection apparatus for inspecting a wafer provided with a circuit pattern for defects, the illuminating direction of illuminating light rays is selectively determined such that an area containing a defect that scatters light of high intensity coincides with the aperture of a dark-field detecting system, and such that regularly reflected light regularly reflected by a pattern, which is noise to defect detection, does not coincide with the aperture of the dark field detecting system. | 08-27-2009 |
20090257647 | Method and Apparatus for Inspecting Defects - A two-dimensional sensor is installed inclining at a predetermined angle to a moving direction of a stage on which an object to be inspected is mounted and, in synchronism with the movement of the stage, a picked up image is rearranged so that there can be obtained an image in high-density sampling with a picture-element size or less of the two-dimensional sensor with respect to a wafer. Thus, interpolation calculation during position alignment becomes unnecessary, and size calculation and classification of a defect can be performed with high accuracy. | 10-15-2009 |
20090279079 | METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array. | 11-12-2009 |
20100208249 | Apparatus For Inspecting Defects - A defect inspection apparatus and method includes a darkfield illumination optical system which conducts darkfield illumination upon the surface of a sample with irradiation light having at least one of wavelength band, a darkfield detection optical system which includes a reflecting objective lens for converging the light scattered from the surface of the sample that has been darkfield-illuminated with the irradiation light having the at least one wavelength band, and imaging optics for imaging onto a light-receiving surface of an image sensor the scattered light that the reflecting objective lens has converged, and an image processor which, in accordance with an image signal obtained from the image sensor of the darkfield detection optical system, discriminates defects or defect candidates present on the surface of the sample. | 08-19-2010 |
20110075134 | Defect Inspection Method and System - An apparatus for inspecting a specimen includes a first illumination unit having a laser light source and a first optical component for illuminating a specimen on which patterns are formed with a laser from a first elevation angle direction, a second illuminating unit having a light source and a second optical component for illuminating the specimen from a second elevation angle direction which is greater than the first elevation angle, a first detection optical unit which detects light from the specimen illuminated by the first illumination unit, a second detection optical unit which detects light from the specimen illuminated by the second illumination unit, and a signal processing unit which processes signals output from the first detector to detect defects in a first area on the specimen and processes signals output from the second detector to detect defects in a second area on the specimen. | 03-31-2011 |
20110286001 | DARK-FIELD DEFECT INSPECTING METHOD, DARK-FIELD DEFECT INSPECTING APPARATUS, ABERRATION ANALYZING METHOD, AND ABERRATION ANALYZING APPARATUS - By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unit | 11-24-2011 |
20110292390 | Apparatus For Inspecting Defects - A defect inspection apparatus includes an illumination optical system, a detection optical system which includes a reflecting objective lens, and wavelength separation optics for conducting wavelength separation, and after the wavelength separation, branching the scattered light into at least a first detection optical path and a second detection optical path. The detection optical system further includes, on the first detection optical path, a first sensor, and on the second detection optical path, a second sensor. A signal processor is provided which, in accordance with at least one of a first signal obtained from the first sensor and a second signal obtained from the second sensor, discriminates defects or defect candidates present on a surface of a sample. | 12-01-2011 |
20120019816 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - The present invention provides a spatial filtering technology for exposing a defect image independently of polarization properties of defect scattered light, a defect inspection method for increasing a defect capture rate by suppressing the brightness saturation of a normal pattern, and a defect inspection apparatus that uses the defect inspection method. An array of spatial filters is disposed in one or more optical paths, which are obtained by polarizing and splitting a detection optical path, to filter diffracted light and scattered light emitted from the normal pattern. An image whose brightness saturation is suppressed is obtained by controlling an illumination light amount and/or detection efficiency during image detection in accordance with the amount of scattered light from the normal pattern. | 01-26-2012 |
20120092484 | DEFECT INSPECTION METHOD AND APPARATUS THEREFOR - To effectively utilize the polarization property of an inspection subject for obtaining higher inspection sensitivity, for the polarization of lighting, it is necessary to observe differences in the reflection, diffraction, and scattered light from the inspection subject because of polarization by applying light having the same elevation angle and wavelength in the same direction but different polarization. According to conventional techniques, a plurality of measurements by changing polarizations is required to cause a prolonged inspection time period that is an important specification of inspection apparatuses. In this invention, a plurality of polarization states are modulated in micro areas in the lighting beam cross section, images under a plurality of polarized lighting conditions are collectively acquired by separately and simultaneously forming the scattered light from the individual micro areas in the individual pixels of a sensor, whereby inspection sensitivity and sorting and sizing accuracy are improved without reducing throughput. | 04-19-2012 |
20120092657 | METHOD OF DEFECT INSPECTION AND DEVICE OF DEFECT INSPECTION - A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser | 04-19-2012 |
20120236296 | METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array. | 09-20-2012 |
20120296576 | DEFECT INSPECTION METHOD AND DEVICE THEREOF - The present invention relates to a defect inspection device which includes: irradiating means for simultaneously irradiating different regions on a sample with illumination light under different optical conditions, the sample being predesigned to include patterns repeatedly formed thereupon, wherein the patterns are to be formed in the same shape; detection means for detecting, for each of the different regions, a beam of light reflected from each region irradiated with the illumination light; defect candidate extraction means for extracting defect candidates under the different optical conditions for each of the different regions, by processing detection signals corresponding to the reflected light which is detected; defect extraction means for extracting defects by integrating the defect candidates extracted under the different optical conditions; and defect classifying means for calculating feature quantities of the extracted defects and classifies the defects according to the calculated feature quantities. | 11-22-2012 |
20130114078 | DEFECT INSPECTION METHOD AND DEVICE THEREFOR - Disclosed is a defect inspection method which makes it possible to scan the entire surface of a sample and detect minute defects without causing thermal damage to the sample. A defect inspection method in which a pulse laser emitted from a light source is subjected to pulse division and irradiated on the surface of a sample which moves in one direction while the divided-pulse pulse laser is rotated, reflection light from the sample irradiated by the divided-pulse pulse laser is detected, the signal of the detected reflection light is processed to detect defects on the sample, and information regarding a detected defect is output to a display screen, wherein the barycentric position of the light intensity of the divided-pulse pulse laser is monitored and adjusted. | 05-09-2013 |
20130141715 | FAULT INSPECTION DEVICE AND FAULT INSPECTION METHOD - Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed. | 06-06-2013 |
20130155400 | METHOD AND DEVICE FOR INSPECTING FOR DEFECTS - A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects. | 06-20-2013 |
20130188184 | DEFECT INSPECTING APPARATUS AND DEFECT INSPECTING METHOD - A defect inspecting apparatus includes an irradiation optical system having a light source that emits illumination light and a polarization generation part that adjusts polarization state of the illumination light emitted from the light source, a detection optical system having a polarization analysis part that adjusts polarization state of scattered light from a sample irradiated by the irradiation optical system and a detection part that detects the scattered light adjusted by the polarization analysis part, and a signal processing system that processes the scattered light detected by the detection optical system to detect a defect presenting in the sample. The polarization generation part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined illumination conditions and the polarization analysis part adjusts the polarization state of the illumination light emitted from the light source on the basis of predetermined detection conditions. | 07-25-2013 |
20130293879 | DEFECT INSPECTION METHOD AND DEVICE THEREFOR - To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen. | 11-07-2013 |
20130293880 | DEFECT TESTING METHOD AND DEVICE FOR DEFECT TESTING - In a defect inspection method and an apparatus of the same, for enabling to conduct an inspection of fine defects without applying thermal damages on a sample, the following steps are conducted: mounting a sample on a rotatable table to rotate; irradiating a pulse laser emitting from a laser light source upon the sample rotating; detecting a reflected light from the sample, upon which the pulse laser is irradiated; detecting the reflected light from the sample detected; and detecting a defect on the sample through processing of a signal obtained through the detection, wherein irradiation of the pulse laser emitting from the laser light source upon the sample rotating is conducted by dividing the one pulse emitted from the laser light source into plural numbers of pulses, and irradiating each of the divided pulse lasers upon each of separate positions on the sample, respectively. | 11-07-2013 |
20130301042 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect. | 11-14-2013 |
20140009755 | DEFECT INSPECTION METHOD AND DEVICE USING SAME - In order to enable inspections to be conducted at a sampling rate higher than the pulse oscillation frequency of a pulsed laser beam emitted from a laser light source, without damaging samples, a defect inspection method is disclosed, wherein: a single pulse of a pulsed laser beam emitted from the laser light source is split into a plurality of pulses; a sample is irradiated with this pulse-split pulsed laser beam; scattered light produced by the sample due to the irradiation is focused and detected; and defects on the sample are detected by using information obtained by focusing and detecting the scattered light from the sample. Said defect inspection method is configured such that the splitting a single pulse of the pulsed laser beam into a plurality of pulses is controlled in such a manner that the peak values of the split pulses are substantially uniform. | 01-09-2014 |