| Class / Patent application number | Description | Number of patent applications / Date published |
|---|
| 205118000 |
Coating selected area
| 317 |
| 205261000 |
Depositing predominantly single metal coating
| 138 |
| 205081000 |
Involving measuring, analyzing, or testing
| 109 |
| 205238000 |
Depositing predominantly alloy coating
| 89 |
| 205316000 |
Forming nonmetal coating
| 65 |
| 205170000 |
Forming multiple superposed electrolytic coatings
| 61 |
| 205205000 |
Treating substrate prior to coating
| 56 |
| 205098000 |
Treating process fluid by means other than agitation or heating or cooling
| 55 |
| 205137000 |
Coating moving substrate
| 50 |
| 205109000 |
Coating contains embedded solid material (e.g., particles, etc.)
| 43 |
| 205096000 |
Controlling current distribution within bath
| 43 |
| 205159000 |
Coating predominantly nonmetal substrate
| 37 |
| 205157000 |
Coating predominantly semiconductor substrate (e.g., silicon, compound semiconductor, etc.)
| 37 |
| 205220000 |
Treating electrolytic or nonelectrolytic coating after it is formed
| 33 |
| 205183000 |
Forming nonelectrolytic coating before depositing predominantly single metal or alloy electrolytic coating
| 31 |
| 205102000 |
Depositing predominantly single metal or alloy coating on single metal or alloy using specified waveform other than pure DC
| 31 |
| 205198000 |
Forming nonelectrolytic coating after forming nonmetal electrolytic coating
| 24 |
| 205091000 |
Utilizing electromagnetic wave energy during coating (e.g., visible light, etc.)
| 24 |
| 205112000 |
Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.)
| 20 |
| 205149000 |
Coating predominantly single metal or alloy substrate of specified shape
| 18 |
| 205106000 |
Forming nonmetal coating using specified waveform other than pure DC or 60 Hz sine wave AC (e.g., anodic oxide coating, etc.)
| 15 |
| 205095000 |
Coating has specified thickness variation
| 15 |
| 205191000 |
Forming nonelectrolytic coating after depositing predominantly single metal or alloy electrolytic coating
| 14 |
| 205148000 |
Agitating or moving electrolyte during coating
| 13 |
| 205188000 |
Forming nonelectrolytic coating before forming nonmetal electrolytic coating
| 11 |
| 205089000 |
Utilizing magnet or magnetic field during coating
| 11 |
| 205234000 |
Utilizing nonaqueous bath
| 9 |
| 205093000 |
Contacting coating as it forms with solid member or material other than electrode
| 9 |
| 205230000 |
Utilizing fused bath
| 9 |
| 205147000 |
Applying current to substrate without mechanical contact (e.g., liquid contact, bipolar electrode, etc.)
| 8 |
| 205115000 |
Repairing
| 7 |
| 205114000 |
Uniting two separate solid materials
| 7 |
| 205158000 |
Coating a substrate predominantly comprised of nonconductive material to which conductive material or material which can be converted into conductive material has been added (e.g., nonconductive polymer substrate containing carbon or copper oxide particles, etc.)
| 6 |
| 205088000 |
Utilizing subatmospheric or superatmospheric pressure during coating
| 6 |
| 205105000 |
Depositing predominantly single metal or alloy coating on nonmetal using specified waveform other than pure DC or 60 Hz sine wave AC (e.g., single metal or alloy coating within or above pores of anodic oxide layer, etc.) | 5 |
| 20140183048 | METHOD FOR THE TREAMENT, BY PERCOLATION, OF A FELT ELEMENT BY MEANS OF ELECTRODE-POSITION - Embodiments of the present disclosure provide for methods for manufacturing a metallized or metallizable felt by percolation of at least one felt element by electrodeposition. | 07-03-2014 |
| 20140216940 | METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES - An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining. | 08-07-2014 |
| 20140238864 | Layer by Layer Electro Chemical Plating (ECP) Process - The present disclosure relates to an electro-chemical plating (ECP) process that provides for an isotropic deposition, and a related apparatus. In some embodiments, the disclosed ECP process is performed by providing a substrate into an electroplating solution comprising a plurality of ions of a material to be deposited. A periodic patterned signal, which alternates between a first value and a different second value, is applied to the substrate. When the periodic patterned signal is at the first value, ions from the electroplating solution affix to the substrate. When the periodic patterned signal is at the second value, ions from the electroplating solution do not affix to the substrate. By using the periodic patterned signal to perform electro-chemical plating, the deposition rate of the plating process is reduced, resulting in an isotropic deposition over the substrate that mitigates gap fill problems (e.g., void formation). | 08-28-2014 |
| 20140262798 | ELECTRODEPOSITION METHODS AND BATHS FOR USE WITH PRINTED CIRCUIT BOARDS AND OTHER ARTICLES - Electrodeposition methods for use with printed circuit boards and other articles are provided. | 09-18-2014 |
| 20160053397 | METHOD OF FORMING A COMPOSITE MATERIAL AND APPARATUS FOR FORMING A COMPOSITE MATERIAL - A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension may comprise an electrolyte and a plurality of particles of a first component of the composite material; causing the particles of the first component of the composite material to sediment on the carrier, wherein a plurality of spaces may be formed between the sedimented particles; and forming by electroplating a second component of the composite material from the electrolyte in at least a fraction of the plurality of spaces. | 02-25-2016 |
| 205086000 |
Employing internal battery action during coating | 5 |
| 20090045065 | STABILIZING AQUEOUS ANIONIC RESINOUS DISPERSIONS WITH CHELATING AGENTS - Stabilization of aqueous resinous dispersions containing a pigment of a divalent metal such as strontium chromate is disclosed. Stabilization is achieved by incorporating a chelating agent in the dispersion. | 02-19-2009 |
| 20090071835 | ALLEVIATION OF VOLTAGE DELAY IN LITHIUM-LIQUID DEPOLARIZER/ELECTROLYTE SOLVENT BATTERY CELLS - Voltage delay in an active metal anode/liquid cathode battery cell can be significantly reduced or completely alleviated by coating the active metal anode (e.g., Li) surface with a thin layer of an inorganic compound with Li-ion conductivity using chemical treatment of Li surface. Particularly, preferred examples of such compounds include lithium phosphate, lithium metaphosphate, and/or their mixtures or solid solutions with lithium sulphate. These compounds can be formed on the Li surface by treatment with diluted solutions of the following individual acids: H | 03-19-2009 |
| 20130319870 | Rechargeable dual electroplating cell - A dual electroplating cell comprising: (a) an electrolyte component containing therein ions of a first metal; (b) a porous cathode current collector having surface areas to capture and store metal ions directly thereon, wherein the cathode current collector has a specific surface area greater than 100 m | 12-05-2013 |
| 20130319871 | METHOD OF PRODUCING DISPLACEMENT PLATING PRECURSOR - A method of producing a displacement plating precursor, including a deposition step of depositing a Cu layer on a surface of a core particle formed of Pt or a Pt alloy by contacting a Cu ion-containing acidic aqueous solution with at least a portion of a Cu electrode, and contacting the Cu electrode with the core particle or with a composite, in which the core particle is supported on an electroconductive support, within the acidic aqueous solution or outside the acidic aqueous solution, and moreover contacting the core particle with the acidic aqueous solution under an inert gas atmosphere. | 12-05-2013 |
| 20140353160 | METHOD AND COMPOSITION FOR ELECTROLESS NICKEL AND COBALT DEPOSITION - An electroless plating bath composition of matter and corresponding method are described. The plating bath is an aqueous solution including an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, and having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater, a nickel-containing or a cobalt-containing salt, and a boron-containing reducing agent. The composition of matter is used in a method of electroless nickle-boron and cobalt-boron coating of substrates. | 12-04-2014 |
| 205085000 |
Displacement or replacement coating | 4 |
| 20090120797 | Process and Apparatus for Cleaning and/or Coating Conductive Metal Surfaces Using Electro-Plasma Processing - An improved process for treating an electrically conductive surface of a workpiece by cleaning or coating the surface is provided, comprising the steps of deploying the electrically conducting surface of the workpiece to form a cathode in an electrolytic cell; establishing a DC voltage between the cathode and an anode; forming a working gap between the anode and the cathode, and establishing a seal around the working gap to form a sealed treatment zone; delivering into the working gap an electrically conductive medium selected from the group consisting of: (A) an aqueous electrolyte from which a foam is created; (B) a foam; and a mixture of components (A) and (B), so that electrically conductive medium consisting of a foam comprising a gas/vapor phase and a liquid phase fills the working gap, wherein said electrically conductive medium enters the electrolytic cell through tubes having discharge ends oriented at approximately ten degrees from parallel to the workpiece, and wherein turbulence is created within the electrolytic cell; adjusting the operating parameters so that an electro-plasma discharge is created between the cathode and positive ions in the electrically conductive medium which are concentrated near the electrically conducting surface of the workpiece, thereby causing micro-zonal melting of the surface; and removing foam from the working gap. | 05-14-2009 |
| 20090218230 | METHOD OF PRODUCING ELECTRONIC COMPONENT - A method of producing an electronic component includes forming a film of a first metal above a substrate; converting partly the film of the first metal into a film containing a second metal by replacement of at least part of the first metal with the second metal; forming a film of a third metal above the film containing the second metal; and removing the film of the first metal other than the film containing the second metal by wet etching using the film of the third metal as a mask. | 09-03-2009 |
| 20110011744 | Novel method to reduce void formation during trapezoidal write pole plating in perpendicular recording - A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (−) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability. | 01-20-2011 |
| 20130056359 | APPARATUS AND METHOD FOR THE SYNTHESIS AND TREATMENT OF METAL MONOLAYER ELECTROCATALYST PARTICLES IN BATCH OR CONTINUOUS FASHION - An apparatus and method for the synthesis and treatment of electrocatalyst particles in batch or continuous fashion is provided. In one embodiment, the apparatus is comprised of a three-electrode cell which includes a reference electrode, a counter electrode, and a working electrode. The working electrode is preferably a cylindrical vessel having an electrically conductive region. The electrode assembly is introduced into a slurry containing metal ions and a plurality of particles. During operation an electrical potential is applied and the working electrode is rotated at a predetermined speed. When particles in the slurry collide with the electrically conductive region the transferred charge facilitates deposition of an ad-layer of the desired metal. In this manner film growth can commence on a large number of particles simultaneously. This process is especially suitable as a commercial thin film deposition process for forming catalytically active layers on nanoparticles for use in energy conversion devices. | 03-07-2013 |
| 205117000 |
Utilizing brush or absorbent applicator | 3 |
| 20090266715 | ANODIZATION PROCESS FOR COATING OF MAGNESIUM SURFACES - A composition that includes at least one alkali metal hydroxide, at least one alkali metal silicate, at least one alkali metal fluoride, and hydrogen peroxide. The invention also includes a method of applying an anodic coating on at least a portion of a surface of a magnesium-containing article that includes the steps of electrically connecting the article with a power source, absorbing a composition with an absorbent applicator, which is in contact with a cathode, supplying a voltage from the power source, and contacting the absorbent applicator with the article, wherein the composition comprises at least one alkali metal hydroxide, at least one alkali metal silicate, at least one alkali metal fluoride and hydrogen peroxide. | 10-29-2009 |
| 20160108534 | ALUMINUM DEPOSITION DEVICES AND THEIR USE IN SPOT ELECTROPLATING OF ALUMINUM - A method for spot electroplating aluminum onto a metallic substrate without submersion or dipping of the metallic substrate in an electroplating bath, the method comprising: (i) spot coating said metallic substrate with an aluminum ion-containing electrolyte contained within a protective structure possessing at least one aperture, and releasing said electrolyte from said at least one aperture onto said metallic substrate to form a coating of said electrolyte thereon, wherein said electrolyte is in contact with an anode; and (ii) applying a voltage potential between the anode and metallic substrate polarized as cathode when the aluminum ion-containing electrolyte is released from said aperture and forms a coating on the metallic substrate, to produce a coating of aluminum on the substrate. Devices, such as brush and ball pen plating devices, for achieving the above-described method are also described. | 04-21-2016 |
| 20160145758 | IN-SITU BALANCING OF PLATED POLYMERS - A method for balancing a rotatable component is disclosed This method comprises and then plating the component to deposit a metal layer onto the component until the component is balanced. In addition, and alternative method for balancing a rotatable component is disclosed. This method comprises attaching a balancing weight to the rotatable component and rotating the component. This is followed by plating the component and the balancing weight to deposit a metal layer onto the balancing weight and the component until the component is balanced. | 05-26-2016 |
| 205116000 |
Mirror or reflector produced | 3 |
| 20090127120 | Method of Forming Mirrors on a Conducting Substrate - The invention provides a method of producing a mirror under a layer of hydrophilic colloid ( | 05-21-2009 |
| 20120097546 | ELECTROCURTAIN COATING PROCESS FOR COATING SOLAR MIRRORS - An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. The cation and the anion containing liquids are spaced from, and preferably out of contact with one another on the surface of the reflective coating as an electric current is moved through the anion containing liquid, the conductive surface between the liquids and the cation containing liquid to coat the conductive surface with the electrically conductive coating. | 04-26-2012 |
| 20160177465 | ALUMINUM-MATERIAL ANODIZATION METHOD | 06-23-2016 |
| 205111000 |
Coating is dendritic or nodular | 3 |
| 20100193365 | POROUS THREE DIMENSIONAL COPPER, TIN, COPPER-TIN, COPPER-TIN-COBALT, AND COPPER-TIN-COBALT-TITANIUM ELECTRODES FOR BATTERIES AND ULTRA CAPACITORS - A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density. | 08-05-2010 |
| 20110162971 | Sputtering Target and Process for Producing Same - A sputtering target with low generation of particles in which oxides, carbides, nitrides, borides, intermetallic compounds, carbonitrides, and other substances without ductility exist in a matrix phase made of a highly ductile substance at a volume ratio of 1 to 50%, wherein a highly ductile and conductive metal coating layer is formed on an outermost surface of the target. Provided are a sputtering target capable of improving the target surface in which numerous substances without ductility exist and preventing or inhibiting the generation of nodules and particles during sputtering, and a method of producing such a sputtering | 07-07-2011 |
| 20140144782 | METHOD FOR PRODUCING ELECTRICALLY-CONDUCTING MATERIAL WITH MODIFIED SURFACE - A method to inexpensively and efficiently produce conductive materials on the surface of which a nano-level fine structure is formed includes surface modification including immersing a stable anode electrode and a workpiece as a cathode electrode, the workpiece including a conductive material with a work surface, in an electrolytic solution, then applying a voltage not less than a first voltage and less than a second voltage between the stable anode electrode and the workpiece as the cathode electrode immersed in the electrolytic solution, thereby modifying the work surface, the first voltage being a voltage corresponding to a current value that is ½ of the sum of a first maximum current value appearing first in a positive voltage region and a first minimum current value appearing first in the positive voltage region with respect to voltage-current characteristics of a surface modification treatment system, the second voltage exhibiting a complete-state plasma. | 05-29-2014 |
| 205087000 |
Simultaneous deplating and plating | 2 |
| 20100314255 | STAINLESS STEEL ELECTROLYTIC PLATES - There is provided a substantially permanent stainless steel cathode plate suitable for use in electrorefining of metal cathodes, the cathode being composed of a low-nickel duplex steel or a lower grade “304” steel, wherein operational adherence of an electrodeposition thereon is enabled by altering various qualities of the cathode surface. | 12-16-2010 |
| 20130075265 | APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS - Methods for electrochemically processing microfeature wafers using at least one counter electrode in a vessel, a supplementary electrode and a supplementary virtual electrode. The supplementary electrode is configured to operate independently from the counter electrode in the vessel, and it can be a thief electrode and/or a de-plating electrode depending. The supplementary electrode can further be used as another counter electrode during a portion of a plating cycle or polishing cycle. The supplementary virtual electrode is located in the processing zone, and it is configured to counteract an electric field offset relative to the wafer associated with an offset between the wafer and the counter electrode. | 03-28-2013 |
| 205094000 |
Utilizing mist prevention | 1 |
| 20120125777 | SULFONATE- OR SULFATE-CAPPED ANTI-MISTING AGENTS - Sulfonate- or sulfate-capped, alkoxylated anti-misting agents having the structures: R((AO) | 05-24-2012 |
| Entries |
| Document | Title | Date |
|---|
| 20080197020 | Method for Producing Painted, Flat Metallic Moulded Bodies - Flat shaped bodies which comprise at least one metallic layer, a conversion coat applied thereto, and at least one paint coat, and methods for producing such bodies starting from flat, metallic, semifinished products. | 08-21-2008 |
| 20080210561 | STABLE AQUEOUS DISPERSIONS OF ETHYLENE-AMINOALKYL METHACRYLATE COPOLYMERS - Aqueous, cationic polyelectrolyte dispersions of improved stability are provided in which copolymers of ethylene and selected aminoalkyl acrylates and methacrylates are self dispersed in water with a mixture of phosphoric acid and at least one additional acid selected from alkylsulfonic acids and gallic acid. | 09-04-2008 |
| 20080210562 | Plating method and plating apparatus - A plating method, despite employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated, thereby enabling uniform plating, and can easily regulate the temperature of the plating solution. The plating method for carrying out plating of a downwardly-facing surface to be plated of a substrate by applying a voltage between the surface to be plated and an anode disposed below the substrate in the presence of a plating solution between the surface to be plated and the anode, comprises disposing a resistor body above the anode and immersing the resistor body in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body, thereby creating a raised portion of the plating solution in the center of the upper surface of the resistor body, and then lowering the substrate with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution. | 09-04-2008 |
| 20080277284 | Consolidated amorphous carbon materials, their manufacture and use - A carbon based material produced from the consolidation of amorphous carbon by elevated temperature compression. The material having unique chemical and physical characteristics that lend themselves to a broad range of applications such as in electrical, electrochemical and structural fields. | 11-13-2008 |
| 20080283403 | Heat exchange enhancement - A heat exchange device that includes a structural section and a thin layer of material attached to a surface of the structural section. The thin layer of material has a thickness less than 100 microns. The combination of the structural section and the thin layer of material has a higher thermal transfer coefficient than the structural section alone, the thermal transfer coefficient representing an ability to exchange thermal energy with an ambient gas. | 11-20-2008 |
| 20080296164 | Reinforcement Element for a Vehicle Hollow Body - The present invention relates to one-piece reinforcement elements consisting of an elongate shell-shaped basic body, the inner space of which has reinforcement ribs which are fixedly connected to the basic body, the reinforcement ribs consisting of plastic injection-molded on and their connection to the basic body taking place at discrete connection points via perforations in the basic body through which the plastic passes and extends over the surfaces of the perforations, and of a rigid structure reinforcement which is appended from the same plastic, by means of the same injection-molded operation, at at least one end of the basic body and which corresponds essentially to the form of the cross section of the hollow profile to be reinforced at this point of a body, an expandable adhesive material being applied over a portion of the surface of the rigid structure reinforcement and of the elongate shell-shaped basic body, the form of the rigid structure reinforcement and of the elongate basic body and also the quantity and distribution of the expandable adhesive being selected such that the adhesive material, during expansion, does not touch the inner surface of the outer panel of the body cavity to be reinforced and touches and adheres to at least part of the other inner walls of the body cavity to be reinforced, to the production of these and to their use. | 12-04-2008 |
| 20090020432 | Write element modification control using a galvanic couple - A modification rate at a surface of an anode formed on a substrate is controlled. The anode is connected to a cathode comprised of a material having a higher nobility than the anode. An electrically conductive path is established between the anode and the cathode through an electrolyte to induce formation of an oxide layer at the anode surface that is more resistive to modification than the anode. | 01-22-2009 |
| 20090065361 | Electrolyte and Method of Producing the Same - An electrolyte and method of producing the same. In one embodiment, the electrolyte includes water, ascorbic acid, a phosphorous donor, ammonium perchlorate, ferrous perchlorate, cobalt perchlorate, and a buffering agent. | 03-12-2009 |
| 20090090631 | Substrate holder and electroplating system - In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder. | 04-09-2009 |
| 20090090632 | ELECTROPLATING SYSTEM INCLUDING INTERCHANGEABLE CARRIERS FOR SUPPORTING AND PROVIDING CATHODE POTENTIAL TO ARTICLES - A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles. | 04-09-2009 |
| 20090090633 | ELECTROPLATING SYSTEM WITH MOVABLE SUPPORT STRUCTURE PROVIDING CATHODE POTENTIAL - A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles. | 04-09-2009 |
| 20090114542 | PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING DEPOSITING A CONDUCTIVE LAYER OVER A SEED LAYER - A process of forming an electronic device can include placing a seed layer into an electroplating solution within an electroplating tool. The electroplating tool can include a first electrode and a second electrode, wherein the first electrode is electrically connected to the seed layer. The process can also include depositing a first portion of a conductive layer using a first signal of a first type (e.g., direct current) between the first electrode and a second electrode, and depositing a second portion of the conductive layer over the first portion of the conductive layer, using a second signal of a second type (e.g., alternating current) between the first electrode and the second electrode of the electroplating tool. | 05-07-2009 |
| 20090152118 | Electrolyzer and electrodes - An the electrode for electrolysis of an electrolytic solution comprises an electrode core serving as a base and a plurality of prominences formed on a surface of the electrode core, the prominences have each a leaf-shaped form and rises from the electrode core surface. | 06-18-2009 |
| 20090159450 | Method And Apparatus For Anodizing Objects - A method and apparatus of anodizing a component, preferably aluminum, is disclosed. The component is placed in an electrolyte solution. A number of pulses are applied to the solution and component. Each pulse is formed by a pattern including having three magnitudes. The third magnitude is less, preferably substantially less, than the first and second magnitudes, and all three magnitudes are of the same polarity. The pulse pattern may include alternations between the first and second magnitudes, and following the alternations, the third magnitude. Other patterns may be provided. The solution is in a reaction chamber, along with at least a portion of the component. The fluid enters the reaction chamber from a transport chamber through a plurality of inlets directed toward the component, preferably at an angle of between 60 and 70 degrees. The inlet is preferably the cathode, and the component is the anode, whereby current flows between the cathode and the anode in another embodiment. The inlets are in a side wall such that the fluid enters the reaction chamber substantially horizontally. The reaction chamber has at least one outlet beneath the inlets. The outlet may be in a bottom wall. The fluid follows a return path, such that the fluid returns from the reaction chamber to the transport chamber. The component is held in a mounted position mechanically or pneumatically in various alternatives. | 06-25-2009 |
| 20090178930 | ELECTROPLATING DEVICE AND METHOD - The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks ( | 07-16-2009 |
| 20090194422 | Method and apparatus for plating metal parts - A method and apparatus for plating parts like lug nuts or other metal parts that have both an easily plated outside surface as well as a recessed cavity. The invention works in combination with a standard multi-station plating process. Also, a method and apparatus for preventing areas of electrode contact on a part from being non-plated. The present invention drains and plates a part containing a cavity by moving the part from a position where the cavity is facing around 45 degrees down to a position where the cavity is facing around 45 degrees up and then back down at various times during the process. The moving is generally initiated when the rack moving along a track above the fluid tanks encounters a roller. The roller causes a depression bar to activate a mechanical mechanism that shifts the position of the part. Other embodiments of the present invention can also rotate the part on an electrode finger as a roller on the track is encountered by the rack to avoid non-plated regions on the part. | 08-06-2009 |
| 20090194423 | WATER FILTERS AND METHODS INCORPORATING ACTIVATED CARBON PARTICLES AND SURFACE CARBON NANOFILAMENTS - A method of making a filter material for producing potable water comprises providing activated carbon particles, depositing one or more nanofilament precursors at least partially onto the surface of the activated carbon particles, agitating the activated carbon particles and deposited nanofilament precursors in the presence of carbonaceous vapor, and heating the activated carbon particles and the deposited nanofilament precursors in the presence of carbonaceous vapor at a temperature and time sufficient to produce the filter material comprising activated carbon particles having carbon nanofilaments on the surface of the particles. | 08-06-2009 |
| 20090218228 | Composition for Metal Surface Treatment, Metal Surface Treatment Method And Metal Material - An easily handleable composition for metal surface treatment is provided which achieves foundation surface concealment, coating adhesion and corrosion resistance equal to or higher than those obtained by the conventional metal surface treatment compositions. This composition for metal surface treatment places no burden on the environment. A method for treating the surface of a metal material in which such a composition for metal surface treatment is used, and a metal material treated by such a metal surface treatment method, are also provided. Specifically disclosed is a metal surface treatment composition used for a treatment of a metal surface, which composition contains a zirconium compound and/or titanium compound substantially not containing fluorine, and an inorganic acid and/or a salt thereof. This metal surface treatment composition has a pH of not less than 1.5 but not more than 6.5. | 09-03-2009 |
| 20090218229 | COATING PROCESS AND APPARATUS WITH IMPROVED RESISTANCE TO BACTERIA - A coating process using an aqueous coating or aqueous rinse includes a step in which at least a part of the aqueous coating, aqueous rinse, and/or an aqueous component added to the aqueous coating or aqueous rinse is pasteurized. The pasteurization may be carried out continuously in a circulation loop of a tank containing the material or in a line carrying the material to a sprayhead. | 09-03-2009 |
| 20090236227 | METHOD TO ELECTRODEPOSIT METALS USING IONIC LIQUIDS - The present invention relates to a method to electroplate or electropolish a metal on a substrate wherein an ionic liquid selected from the group of N | 09-24-2009 |
| 20100038250 | CHEMICAL CONVERSION COATING AGENT AND SURFACE-TREATED METAL - It is an object of the present invention to provide a chemical conversion coating agent containing no chromium and capable of applying good chemical conversion treatment which is equal to or more than chemical conversion treatment by zinc phosphate to all metals such as iron, zinc and aluminum. | 02-18-2010 |
| 20100044236 | METHOD AND APPARATUS FOR ELECTROPLATING - An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect. | 02-25-2010 |
| 20100163420 | METAL EFFECT PIGMENTS FOR USE IN THE CATHODIC ELECTRODEPOSITION PAINTING, METHOD FOR THE PRODUCTION AND USE OF THE SAME, AND ELECTRODEPOSITION PAINT - The invention relates to electrocoat material pigments, said electrocoat material pigments comprising metal effect pigment platelets coated with at least one coating material, said coating material comprising one or more functional groups for adhesion or attachment to the pigment surface and at least one amino-functional group, said amino-functional group being protonatable or positively charged. The invention further relates to a process for producing these electrocoat material pigments and to the use thereof, and to a cathodic electrocoat material which comprises the inventive pigments. | 07-01-2010 |
| 20100200410 | VERTICAL SYSTEM FOR THE PLATING TREATMENT OF A WORK PIECE AND METHOD FOR CONVEYING THE WORK PIECE - The present invention relates to a vertical system for the plating treatment of a work piece (W), the said system including at least two treatment modules ( | 08-12-2010 |
| 20100206735 | Anode Assembly For Electroplating - The invention relates to an anode assembly for electroplating comprising (a) an anode body comprising soluble anode material and (b) a shielding covering at least part of the anode body and comprising a self-passivating metal electrically connected to the anode body and allowing electrolyte transport therethrough. The shielding comprises at least one layer of self-passivating metal having no openings larger than 2 mm, preferably 1 mm, in width or the shielding comprises at least two layers of self-passivating metal wherein the openings of at least one layer are at least partially covered by the metal of another layer. The invention also relates to a shielded anode basket, a method for electroplating and the use of the anode assembly and the shielded anode basket. | 08-19-2010 |
| 20100230288 | SURFACE-TREATED METAL MATERIAL, SURFACE-TREATING METHOD, RESIN-COATED METAL MATERIAL, METAL CAN AND CAN LID - A surface-treated metal material is obtained by forming an inorganic surface-treating layer containing at least Zr, O and F as chief components but without containing phosphoric acid ions on the surfaces of a metal by the cathodic electrolysis or by forming an inorganic surface-treating layer containing at least Zr, O and F as chief components and having an atomic ratio of P and Zr of 0≦P/Zr<0.6 in the uppermost surface on the surfaces of the metal by the cathodic electrolysis at a low cost featuring high productivity, environmental friendliness, scar resistance, adhesion, workability and intimate fitting. By using a metal material obtained by coating the surface-treated metal material with an organic resin and, particularly, with a polyester resin, a metal can or a can lid exhibits excellent adhesion and corrosion resistance even at portions that are worked to a high degree. Further, the can lid exhibits excellent opening performance even after the sterilization by heating. | 09-16-2010 |
| 20100236935 | TUNGSTEN ALLOY SUTURE NEEDLES WITH SURFACE COLORATION - A medical device, particularly a suture needle, comprising a tungsten alloy and having a blue, yellow or black surface coloration. | 09-23-2010 |
| 20100264033 | DIRECTIONAL CONDUCTIVITY NANODEPOSITS - A directional conductivity nanocomposite material, apparatuses and processes for making such material are generally described. A directional conductivity nanocomposite material may comprise a supporting material such as ceramic or polymer, with directionally conductive nanorod structures running through the supporting material. The material may be made by orienting nanorods in an electrophoretic gel using an electrical or magnetic field to align the nanorods, removing the gel, reinforcing the nanorods, and flowing in supporting material. | 10-21-2010 |
| 20100288644 | Coating for metal containers, metalworking lubricant compositions, compositions for electroplating and electrowinning, latex compositions and processes therefor - Coatings for metal containers, metalworking lubricant compositions, compositions for electroplating and electrowinning, and latex compositions comprising a base-catalyzed reaction product of (a) at least one compound of formula I | 11-18-2010 |
| 20110005936 | MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD - There is provided a material for forming electroless plate which shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. | 01-13-2011 |
| 20110068010 | ANODE MEDIA FOR USE IN ELECTROPLATING PROCESSES, AND METHODS OF CLEANING THEREOF - A method for cleaning anode media, the method comprising removing the anode media from an electroplating system, and removing scale coatings from substrates of the anode media by vibrational polishing the anode media with abrasive particles. | 03-24-2011 |
| 20110068011 | POLYMER THICK FILM SILVER ELECTRODE COMPOSITION FOR USE AS A PLATING LINK - The invention is directed to a polymer thick film silver composition comprising: (a) conductive silver flakes and (b) an organic medium comprising (1) acrylic organic polymeric binder; and (2) organic solvent. The composition may be processed at a time and energy sufficient to remove all solvent. | 03-24-2011 |
| 20110120875 | Volatile Group 2 Metal Precursors - A compound comprising one or more polyfunctionalized pyrrolyl anions coordinated to a metal selected from the group consisting of barium, strontium, magnesium, radium or calcium or mixtures thereof. Alternatively, one anion can be substituted with and a second non-pyrrolyl anion. | 05-26-2011 |
| 20110284385 | Method and Apparatus For Anodizing Objects - A method and apparatus for electrolytically treating a surface of a component includes a reaction chamber, a transport chamber and a fluid return path. The reaction chamber is adapted for placing at least a portion of the component therein, and holds a reaction fluid. Fluid enters the reaction chamber through a plurality of inlets. Each inlet directs the fluid toward the component at one or more non-zero vertical angles, and at one or more non-zero horizontal angles. The reaction chamber is a fixture having a cover with an underside shaped to direct the fluid to the surface of the component, such as by having a plurality of slopes. The inlets are through a material that is electrically non-conductive, such as ceramic, plastic, PVC, and fiber reinforced plastic, and/or the fixture further includes a titanium cathode ring that can be vertically adjacent the non-conductive material. | 11-24-2011 |
| 20120067732 | PLATING APPARATUS AND PLATING METHOD - A plating apparatus includes a plating bath configured to perform plating processing of a substrate with a plating solution including an inorganic constituent and an organic constituent introduced into the plating bath, a chemical supplying unit configured to supply each chemical of the inorganic constituent and the organic constituent, an electrode configured to dispose in the plating solution and the electrode configured to selectively adsorb a by-product produced from the organic constituent, and an electric current applying unit configured to apply a predetermined electric current to the electrode. | 03-22-2012 |
| 20120073974 | Non-Permeable Substrate Carrier For Electroplating - One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed. | 03-29-2012 |
| 20120073975 | Sealed substrate carrier for electroplating - One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed. | 03-29-2012 |
| 20120073976 | Maintainable substrate carrier for electroplating - One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The carrier includes a non-conductive carrier body on which the substrates are placed and conductive lines embedded within the carrier body. A plurality of conductive clip attachment parts are attached in a permanent manner to the conductive lines embedded within the carrier body. A plurality of contact clips are attached in a removable manner to the clip attachment parts. The contact clips hold the substrates in place and conductively connecting the substrates with the conductive lines. Other embodiments, aspects and features are also disclosed. | 03-29-2012 |
| 20120091007 | ANODE FOR OXYGEN GENERATION - In an insoluble anode for use in an electrolysis step accompanied by oxygen generation, by making the anode exert sufficient durability even in electrolysis accompanied by cathodic polarization besides anodic polarization, a service life of an electrode is prolonged and works of electrode repair, replacement, and the like are reduced. In order to realize this, an active material supporting member made of a porous metal sheet such as an expanded metal, a punching metal, or a bamboo blind-like or net-shaped metal is bonded to a conductive metal as an electrode structure, to configure an electrode substrate. The electrode substrate is coated, on the side to which the supporting member is bonded, with an electrode active material consisting mainly of iridium oxide. Thus, the anode for oxygen generation, which is highly resistant to a cathodization phenomenon, is obtained. | 04-19-2012 |
| 20120241325 | DEVICE AND METHOD FOR ELECTRICALLY CONTACTING TREATMENT MATERIAL IN ELECTROPLATING SYSTEMS - The subject matter is directed to electrical contacting of band- or plate-shaped materials ( | 09-27-2012 |
| 20130001087 | SURFACE TREATING APPARATUS AND PLATING TANK - To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank | 01-03-2013 |
| 20130087462 | CONTINUOUSLY CHEMICALLY RESISTANT SPACER TEXTILE - The invention relates to a spacer textile ( | 04-11-2013 |
| 20130299354 | ELECTROCHEMICAL PROCESSOR - An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively. | 11-14-2013 |
| 20140284216 | ELECTROCHEMICAL DEPOSITION CHAMBER - According to the invention an electrochemical deposition or polishing clamber including:
| 09-25-2014 |
| 20150108001 | LIQUID PROCESSING JIG AND LIQUID PROCESSING METHOD - Disclosed is a liquid processing jig for performing a predetermined processing on a workpiece using a processing liquid. The liquid processing jig includes: a liquid processing unit formed on a surface of the liquid processing jig and configured to perform a predetermined processing on the workpiece by the processing liquid; a liquid supplying unit configured to supply the processing liquid to the liquid processing unit; a liquid supplying channel configured to connect the liquid supplying unit and the liquid processing unit and supply the processing liquid from the liquid supplying unit to the liquid processing unit; and a liquid discharging channel configured to discharge the processing liquid from the liquid processing unit. The liquid supplying unit, the liquid supplying channel, the liquid processing unit, and the liquid discharging channel are provided to cause the processing liquid to flow by a capillary phenomenon. | 04-23-2015 |
| 20150122658 | MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS - Certain embodiments disclosed herein pertain to methods and apparatus for electrodepositing material on a substrate. More particularly, a novel membrane for separating the anode from the cathode/substrate, and a method of using such a membrane are presented. The membrane includes at least an ion exchange layer and a charge separation layer. The disclosed embodiments are beneficial for maintaining relatively constant concentrations of species in the electrolyte over time, especially during idle (i.e., non-electroplating) times. | 05-07-2015 |
| 20160068987 | ELECTRIC PLATING HANGING ROD ASSEMBLY FOR SUPPORTING A WORK PIECE TO BE PLATED AND THE METHOD USING THE SAME - An electric plating hanging rod assembly for supporting a work piece to be plated, comprises a hanging rod having an upper retaining bar and a lower retaining bar; a distal end of the upper retaining bar far away from the hanging rod being pointed upwards; and a distal end of the lower retaining bar far away from the hanging rod being pointed downwards. The hanging rod extended with at least one upper supporting rod and at least one lower supporting rod which are alternatively arranged; at a distal end of the upper supporting rod far away from the hanging rod is fixed with an upper retaining bar and at a distal end of the lower supporting rod far away from the hanging rod is fixed with a lower retaining bar. A distal end of each of the upper and lower retaining is formed as a tapered reduced end. | 03-10-2016 |
