17th week of 2011 patent applcation highlights part 15 |
Patent application number | Title | Published |
20110095398 | BIPOLAR SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME - A bipolar semiconductor device includes a collector region that is an n-type low-resistance layer formed in one surface of a semiconductor crystal substrate, an n-type first high-resistance region on the collector region, a p-type base region on the first high-resistance region, an n-type low-resistance emitter region that is formed in another surface of the semiconductor crystal substrate, an n-type second high-resistance region between the emitter region and the base region so as to contact the emitter region, an n-type recombination suppressing region around the second high-resistance region so as to adjoin the second high-resistance region, and a p-type low-resistance base contact region which is provided so as to adjoin the recombination suppressing region, and which contacts the base region. Each of doping concentrations of the second high-resistance region and the recombination suppressing region is equal to or lower than 1×10 | 2011-04-28 |
20110095399 | Method For Manufacturing Semiconductor Chips From A Wafer - A method is for manufacturing semiconductor chips from a wafer which includes a plurality of semiconductor chips. Defects in the crystal structure of the chips may be substantially reduced by producing rupture joints in the surface of the wafer after the wafer has been produced, and by breaking the wafer along the rupture joints to separate the semiconductor chips. | 2011-04-28 |
20110095400 | PROCESS FOR OBTAINING A HYBRID SUBSTRATE COMPRISING AT LEAST ONE LAYER OF A NITRIDED MATERIAL - A process for obtaining a hybrid substrate that includes at least one active layer of Group III/N material for applications in the field of electronics, optics, photovoltaics or optoelectronics. The method includes selecting a source substrate of Group III/N material having a hexagonal single crystal crystallographic structure; carrying out an implantation of He | 2011-04-28 |
20110095401 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - In a method for manufacturing a semiconductor device, the method includes the step of growing a nitride-based III-V compound semiconductor layer, which forms a device structure, directly on a substrate without growing a buffer layer, the substrate being made of a material with a hexagonal crystal structure and having a principal surface that is oriented off at an angle of not less than −0.5° and not more than 0° from an R-plane with respect to a direction of a C-axis. | 2011-04-28 |
20110095402 | Gate dielectric film with controlled structural and physical properties over a large surface area substrate | 2011-04-28 |
20110095403 | Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded through the Die TSV - A semiconductor device has an interconnect structure with a cavity formed partially through the interconnect structure. A first semiconductor die is mounted in the cavity. A first TSV is formed through the first semiconductor die. An adhesive layer is deposited over the interconnect structure and first semiconductor die. A shielding layer is mounted over the first semiconductor die. The shielding layer is secured to the first semiconductor die with the adhesive layer and grounded through the first TSV and interconnect structure to block electromagnetic interference. A second semiconductor die is mounted to the shielding layer and electrically connected to the interconnect structure. A second TSV is formed through the second semiconductor die. An encapsulant is deposited over the shielding layer, second semiconductor die, and interconnect structure. A slot is formed through the shielding layer for the encapsulant to flow into the cavity and cover the first semiconductor die. | 2011-04-28 |
20110095404 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A disclosed semiconductor device includes a semiconductor chip having an electrode pad on a circuit forming face of the semiconductor chip, an internal connection terminal formed on the electrode pad, a stepped portion formed along an outer edge portion of the circuit forming face of the semiconductor chip, a first insulating layer formed on the circuit forming face of the semiconductor chip to cover at least the stepped portion, a second insulating layer formed on the circuit forming face of the semiconductor chip to cover the first insulating layer, and an interconnection formed on the second insulating layer and electrically connected to the electrode pad via the internal connection terminal. | 2011-04-28 |
20110095405 | LEAD FRAME AND INTERMEDIATE PRODUCT OF SEMICONDUCTOR DEVICE - In a lead frame used for manufacturing a semiconductor device by forming a circuit pattern group including unit lead frames having plural upper side terminal parts in the periphery of a semiconductor element mounting region in one line or plural lines and an outer frame surrounding the circuit pattern group in a state of having a gap in a lead frame material and then mounting a semiconductor element every the unit lead frame and carrying out necessary wiring and enclosing the entire surface of the circuit pattern group in which the semiconductor element is mounted and a part of the outer frame with a resin from an upper surface side and further etching from a lower surface side and forming lower side terminal parts joined to the upper side terminal parts of the circuit pattern group, the circuit pattern group and the outer frame are had and the inner edge of the outer frame is formed in an uneven portion in plan view and bonding between the resin and the outer frame is enhanced. | 2011-04-28 |
20110095406 | TECHNOLOGY OF REDUCING RADIATION NOISE OF SEMICONDUCTOR DEVICE - A first lead frame group is constituted by a plurality of lead frames that are connected to the first circuit, terminals of the plurality of lead frames being provided on a first side of the semiconductor device. A second lead frame group is constituted by a plurality of lead frames that are connected to the second circuit, terminals of the plurality of lead frames being provided on a second side of the semiconductor device. A suspension lead for suspending a die pad that supports the semiconductor chip, the suspension lead being arranged from a corner portion that is formed by the first side and the second side toward the semiconductor chip. Among a group of the terminals of the first lead frame group that are provided on the first side, a terminal on the corner portion side is a terminal for inputting or outputting a signal with a high frequency. | 2011-04-28 |
20110095407 | STACKABLE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING SUCH ASSEMBLIES - Stacked semiconductor devices and assemblies including attached lead frames are disclosed herein. One embodiment of a method of manufacturing a semiconductor assembly includes forming a plurality of first side trenches to a first intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes forming a plurality of lateral contacts at sidewall portions of the trenches and electrically connecting first side bond-sites of the dies with corresponding lateral contacts of the trenches. The method further includes forming a plurality of second side channels to a second intermediate depth in the molded portion such that the channels intersect the trenches. The method also includes singulating and stacking the first and second dies with the channels associated with the first die aligned with channels associated with the second die. The method further includes attaching a lead frame to the lateral contacts of the stacked first and second dies. | 2011-04-28 |
20110095408 | MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT - A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements. | 2011-04-28 |
20110095409 | Method of Attaching an Interconnection Plate to a Semiconductor Die within a Leadframe Package - A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package. | 2011-04-28 |
20110095410 | WAFER LEVEL SEMICONDUCTOR DEVICE CONNECTOR - This document discusses, among other things, a semiconductor connector including a conductive pad in a recessed pad area on a surface of a dielectric, the dielectric material configured to be activated to conductive plating deposition using laser ablation. | 2011-04-28 |
20110095411 | Wirebond-less Semiconductor Package - A wirebond-less packaged semiconductor device includes a plurality of I/O contacts, at least one semiconductor die, the semiconductor die having a bottom major surface and a top major surface, the top major surface having at least two electrically isolated electrodes, and a conductive clip system disposed over the top major surface, the clip system comprising at least two electrically isolated sections coupling the electrodes to respective I/O contacts. | 2011-04-28 |
20110095412 | SEMICONDUCTOR DEVICE - In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package. | 2011-04-28 |
20110095413 | Method and Apparatus for Semiconductor Device Fabrication Using a Reconstituted Wafer - Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame. | 2011-04-28 |
20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 2011-04-28 |
20110095415 | ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE - A routing layer for a semiconductor die is disclosed. The routing layer includes pads for attaching solder bumps; bond-pads bonded to bump-pads of a die having an integrated circuit, and traces interconnecting bond-pads to pads. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces at least partially surrounding some pads so as to absorb stress from solder bumps attached to the pads. Parts of the traces that surround pads protect parts of the underlying dielectric material proximate the solder bumps, from the stress. | 2011-04-28 |
20110095416 | PACKAGE FOR HIGH POWER INTEGRATED CIRCUITS AND METHOD FOR FORMING - A method for packaging an integrated circuit comprises the steps of: providing a ground plane, the ground plane having a recessed area shaped to receive an integrated circuit die, wherein the integrated circuit die having a first surface with active circuitry, a second surface, and an edge generally orthogonal to the first and second surfaces; attaching the second surface of the integrated circuit die to a bottom of the recessed area with a thermally conductive adhesive; filling a space between the edge of the integrated circuit die and a side of the recessed area with a fill material; forming an insulating layer on the ground plane and the first surface of the integrated circuit die; patterning the insulating layer to expose contacts on the first surface of the integrated circuit die; and plating electrical conductors on the insulating layer and the contacts. | 2011-04-28 |
20110095417 | LEADLESS SEMICONDUCTOR DEVICE TERMINAL - This document discusses, among other things, a semiconductor die having a first conductive bump coupled to a first electrical terminal at a first die surface of a semiconductor die and a dielectric substantially covering the first die surface and substantially surrounding the first conductive bump. A surface of the dielectric can include a recessed terminal area, and a second electrical terminal can be coupled to the first conductive bump in the recessed terminal area. | 2011-04-28 |
20110095418 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME - A semiconductor package includes a semiconductor chip having a first bump group and a second bump group, and a package substrate having a first pattern for data communication with the semiconductor chip and a second pattern for supplying power to the semiconductor chip or grounding the semiconductor chip, wherein the first bump group is disposed on the first pattern and the second bump group is disposed on the second pattern. | 2011-04-28 |
20110095419 | CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions. | 2011-04-28 |
20110095420 | Semiconductor device and method of manufacturing semiconductor device - A semiconductor device includes a protective insulating film, an opening formed in the protective insulating film, an electrode pad located within the opening, a bump formed on the protective insulating film, and an interconnect. The bump includes a bump core and a conductive film. The bump core includes an insulating resin layer and a conductive resin layer located on the insulating resin layer. The conductive film is formed on at least the upper surface of the bump core. The interconnect connects the conductive film of the bump and the electrode pad. | 2011-04-28 |
20110095421 | Flip chip package and method of manufacturing the same - There is provided a flip chip package including an electronic device, a board including a conductive pad disposed inside a mounting region of the board on which the electronic device is mounted, and a connection pad disposed outside the mounting region, a resin layer formed on the board and including a trench formed by removing a part of the resin layer, and a dam member provided on the trench and preventing the leakage of an underfill between the mounting region and the connection pad. Since the dam member, formed on the processed resin layer, can prevent the leakage of the underfill, a package defect rate can be lowered, and connection reliability can be improved. | 2011-04-28 |
20110095422 | ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICE, METHODS OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC INSTRUMENT - An electronic component including an electronic element, an electrode that is formed on a first surface of the electronic element, a first resin layer that is formed over the first surface of the electronic element, a wiring that is electrically connected to the electrode, a first portion of the wiring extending over the first resin layer, a second resin layer that is formed over the first resin layer and the wiring, the second resin layer having an opening, the opening overlapping the first portion of the wiring, an external terminal that is provided above the second resin layer, the external terminal being connected to the first portion of the wiring via the opening, and a third resin layer that is formed over the second resin layer, the third resin layer being provided around the external terminal. | 2011-04-28 |
20110095423 | SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD - A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it. | 2011-04-28 |
20110095424 | SEMICONDUCTOR PACKAGE STRUCTURE - The semiconductor package structure includes first and second packages. The first package has at least one first semiconductor chip disposed on a first printed circuit board, and at least one first pad disposed on the at least one first semiconductor chip. The second package has at least one second pad disposed on the first package, and at least one second semiconductor chip disposed on the at least one second pad. The at least one first semiconductor chip is electrically connected to the first printed circuit board. The at least one second pad is electrically connected to the at least one second semiconductor chip. The at least one second pad faces the at least one first pad. | 2011-04-28 |
20110095425 | Ball grid array substrate, semiconductor chip package and method of manufacturing the same - Provided is a ball grid array substrate, a semiconductor chip package, and a method of manufacturing the same. The ball grid array substrate includes an insulating layer having a first surface providing a mounting region for a semiconductor chip, a second surface opposing the first surface, and an opening connecting the second surface with the mounting region of the semiconductor chip, and a circuit pattern buried in the second surface. Since the ball grid array substrate is manufactured by a method of stacking two insulating layers, existing devices can be used, and the ball grid array substrate can be manufactured as an ultra thin plate. In addition, since the circuit pattern is buried in the insulating layer, a high-density circuit pattern can be formed. | 2011-04-28 |
20110095426 | Hybrid Package - The embodiments described herein provide for a packaging configuration that provides leads or connections for a packaging substrate from opposing surfaces of a package. Through silicon vias (TSV) are provided in order to accommodate additional input/output (I/O) pins that smaller dies are supporting. Various combinations of packages are enabled through the embodiments provided. | 2011-04-28 |
20110095427 | LOW-RESISTANCE INTERCONNECTS AND METHODS OF MAKING SAME - Devices and methods for providing low-resistance interconnects in a semiconductor device are provided. Specifically, one or more embodiments of the present invention relate to disposing a conductive material in a trench without disposing a resistive barrier material between the conductive material and the sidewalls of the trench so that the conductive material takes up the full width of the trench. For example, the trench may be disposed over one or more contacts made of a barrier material such as titanium nitride that also acts as a seed, and the conductive material may be grown on top of the titanium nitride to fill the trench. | 2011-04-28 |
20110095428 | SMALL AREA, ROBUST SILICON VIA STRUCTURE AND PROCESS - A semiconductor structure includes: at least one silicon surface wherein the surface can be a substrate, wafer or other device. The structure further includes at least one electronic circuit formed on each side of the at least one surface; and at least one conductive high aspect ratio through silicon via running through the at least one surface. Each through silicon via is fabricated from at least one etch step and includes: at least one thermal oxide dielectric for coating at least some of a sidewall of the through silicon via for a later etch stop in fabrication of the through silicon via. | 2011-04-28 |
20110095429 | METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE VIAS SO FORMED - Methods for forming conductive vias include foiling one or more via holes in a substrate. The via holes may be formed with a single mask, with protective layers, bond pads, or other features of the substrate acting as hard masks in the event that a photomask is removed during etching processes. The via holes may be configured to facilitate adhesion of a dielectric coating that includes a low-K dielectric material to the surfaces thereof A barrier layer may be fowled over surfaces of each via hole. A base layer, which may comprise a seed material, may be formed to facilitate the subsequent, selective deposition of conductive material over the surfaces of the via hole. The resulting semiconductor devices, intermediate structures, and assemblies and electronic devices that include the semiconductor devices that result from these methods are also disclosed. | 2011-04-28 |
20110095430 | SEMICONDUCTOR DEVICE - A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion. | 2011-04-28 |
20110095431 | THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE - An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad. | 2011-04-28 |
20110095432 | ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE, METHOD OF MAKING THE SAME AND METHOD OF MOUNTING THE SAME, CIRCUIT BOARD AND ELECTRONIC INSTRUMENT - A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin later as a stress relieving layer on the wafer, avoiding the electrodes; a step of forming a chromium layer as wiring from electrodes over the resin layer; and step of forming solder balls as external electrodes on the chromium layer over the resin layer; and a step of cutting the wafer into individual semiconductor chips; in the steps of forming the chromium layer and solder balls, metal thin film fabrication technology is used during the wafer process. | 2011-04-28 |
20110095433 | CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a conductive film. The method includes: (a) providing an anodized layer having a plurality of through holes extending therethrough in its thickness direction; (b) forming a plurality of linear conductors by filling each of the through holes with a conductive material; (c) forming protection layers on both surfaces of the anodized layer; (d) removing the anodized layer to form a plurality of gaps between the linear conductors; (e) forming an organic insulation layer between the protection layers to fill the gaps with the organic insulation layer; and (f) removing the protection layers. | 2011-04-28 |
20110095434 | APPARATUS AND METHODS OF FORMING MEMORY LINES AND STRUCTURES USING DOUBLE SIDEWALL PATTERNING FOR FOUR TIMES HALF PITCH RELIEF PATTERNING - The present invention provides apparatus, methods, and systems for fabricating memory lines and structures using double sidewall patterning for four times half pitch relief patterning. The invention includes forming features from a first template layer disposed above a substrate, forming half-pitch sidewall spacers adjacent the features, forming smaller features in a second template layer by using the half-pitch sidewall spacers as a hardmask, forming quarter-pitch sidewall spacers adjacent the smaller features, and forming conductor features from a conductor layer by using the quarter-pitch sidewall spacers as a hardmask. Numerous additional aspects are disclosed. | 2011-04-28 |
20110095435 | COAXIAL THROUGH-SILICON VIA - A through-silicon via (TSV) structure forming a unique coaxial or triaxial interconnect within the silicon substrate. The TSV structure is provided with two or more independent electrical conductors insulated from another and from the substrate. The electrical conductors can be connected to different voltages or ground, making it possible to operate the TSV structure as a coaxial or triaxial device. Multiple layers using various insulator materials can be used as insulator, wherein the layers are selected based on dielectric properties, fill properties, interfacial adhesion, CTE match, and the like. The TSV structure overcomes defects in the outer insulation layer that may lead to leakage. A method of fabricating such a TSV structure is also described. | 2011-04-28 |
20110095436 | THROUGH SILICON VIA WITH DUMMY STRUCTURE AND METHOD FOR FORMING THE SAME - A through silicon via structure includes a top pad and a vertical conductive post that is connected to the top pad. The top pad covers a wider area than the cross section of the vertical conductive post. An interconnect pad is formed at least partially below the top pad. An under layer is also formed at least partially below the top pad. At least one dummy structure connects the top pad and the under layer to fasten the top pad and the interconnect pad. | 2011-04-28 |
20110095437 | INTERFACE PLATE BETWEEN INTEGRATED CIRCUITS - An interface plate capable of being mounted between first and second surface-mounted electronic chips. The plate includes a plurality of first, second, and third through openings, the first openings being filled with a conductive material and being arranged to be in front of pads of the first and second chips during the assembly, the second openings being filled with a second material, the third openings being filled with a third material, the second and third materials forming two complementary components of a thermoelectric couple. | 2011-04-28 |
20110095438 | METHODS AND APPARATUS FOR LAYOUT OF THREE DIMENSIONAL MATRIX ARRAY MEMORY FOR REDUCED COST PATTERNING - The present invention provides apparatus, methods, and systems for a memory layer layout for a three-dimensional memory. The memory layer includes a plurality of memory array blocks; a plurality of memory lines coupled to the memory array blocks; and a plurality of zia contact areas for coupling the memory layer to other memory layers in a three-dimensional memory. The memory lines extend from the memory array blocks and are formed using a sidewall defined process. The memory lines have a half pitch dimension smaller than the nominal minimum feature size capability of a lithography tool used in forming the memory lines. The zia contact areas have a dimension that is approximately four times the half pitch dimension of the memory lines. The memory lines are arranged in a pattern adapted to allow a single memory line to intersect a single zia contact area and to provide area between other memory lines for other zia contact areas. Numerous additional aspects are disclosed. | 2011-04-28 |
20110095439 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THROUGH SEMICONDUCTOR VIAS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: providing a package substrate; mounting a first integrated circuit die, having through silicon vias, on the package substrate; coupling cylindrical studs to the package substrate adjacent to the first integrated circuit die; and mounting a second integrated circuit die, having through silicon vias, on the first integrated circuit die and the cylindrical studs for forming an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof. | 2011-04-28 |
20110095440 | SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF DIE STACK - A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations. | 2011-04-28 |
20110095441 | MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS - A compliant semiconductor chip package assembly includes a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip. | 2011-04-28 |
20110095442 | THIN LIGHT GUIDING PLATE AND METHODS OF MANUFACTURING - The present invention provides a composite light guiding plate comprising a light guiding layer comprising an incident face for receiving light from at least one light source, a light guiding output surface that is also generally orthogonal to the incident face, a featured surface, opposite the light-guiding output surface and generally orthogonal to the input face for redirecting light through the light guiding output surface. Further, the featured surface comprises a plurality of rows of linear prismatic structures extended in a length direction that is substantially perpendicular to the incident face and having height and width dimensions of 10 to 200 microns and wherein the length-to-width aspect ratio of the linear prismatic structures is greater than 100:1 the thickness of the light guiding layer is less than 1 mm. Further, the plate is formed from polymeric materials comprising polyesters, amorphous polyesters, polyarylates, polycarbonates, polyamides, polyether-amides, polyamide-imides, polyimides, polyetherimides, cyclic olefin polymers, impact-modified polymethacrylates, polyacrylates, polyacrylonitrile, polystyrenes, polyethers, cellulosics, sulfur-containing polymers and blends or alloys of two or more polymers or copolymers thereof. Additionally, the plate comprises a light extraction layer comprising an input surface having a plurality of protruding light extraction features that have tips that are bonded to the light-guiding output surface of the light guiding layer and provide optical contact between the light guiding and light extraction layers and an illumination output surface for providing light output from the composite illumination plate. Further, the thickness of the light extraction layer is less than 1 mm and wherein one or more channels of air or other gas are sandwiched between the light guiding layer and the light extraction layer. | 2011-04-28 |
20110095443 | Method for Producing an Optical Fiber Strip Comprising Several Inidividual Optical Fibers - The invention relates to a method for creating a fibre strip ( | 2011-04-28 |
20110095444 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are water-dispersible fibers derived from sulfopolyesters having a Tg of at least 25° C. The fibers may contain a single sulfopolyester or a blend of a sulfopolyester with a water-dispersible or water-nondispersible polymer. Also disclosed are multicomponent fibers comprising a water dispersible sulfopolyester having a Tg of at least 57° C. and a water non-dispersible polymer. The multicomponent fibers may be used to produce microdenier fibers. Fibrous articles may be produced from the water-dispersible fibers, multicomponent fibers, and microdenier fibers. The fibrous articles include water-dispersible and microdenier nonwoven webs, fabrics, and multilayered articles such as wipes, gauze, tissue, diapers, panty liners, sanitary napkins, bandages, and surgical dressings. Also disclosed is a process for water-dispersible fibers, nonwoven fabrics, and microdenier webs. The fibers and fibrous articles have further applications in flushable personal care and cleaning products, disposable protective outerwear, and laminating binders. | 2011-04-28 |
20110095445 | WATER-DISPERSIBLE AND MULTICOMPONENT FIBERS FROM SULFOPOLYESTERS - Disclosed are multicomponent fibers derived from a blend of a sulfopolyester with a water non-dispersible polymer wherein the as-spun denier is less than about 6 and wherein the water dispersible sulfopolyester exhibits a melt viscosity of less than 12,000 poise measured at 240° C. at a strain rate of 1 rad/sec, and wherein the sulfopolyester comprising less than about 25 mole % of residues of at least one sulfomonomer, based on the total moles of diacid or diol residues. The multicomponent fiber is capable of being drawn at a relatively high fiber speed, particularly at least about 2000 m/min, and may be used to produce microdenier fibers. Fibrous articles may be produced from the multicomponent fibers and microdenier fibers. Also disclosed is a process for multicomponent fibers, nonwoven fabrics, and microdenier webs. | 2011-04-28 |
20110095446 | SILICON-BASED GREEN BODIES - The present invention relates to a sol-gel process for the inexpensively and in large quantities agglomeration of silicon particles in a green body which is more suitable for industrial uses of silicon than the powder itself. | 2011-04-28 |
20110095447 | PROCESS FOR MANUFACTURING POLYOLEFIN FILMS - A process for manufacturing a film of ultra-high molecular weight polyolefin comprising: (a) subjecting a starting ultra-high molecular weight polyolefin with a weight average molecular weight of at least 500 000 gram/mole in powder form to a compacting step using an isobaric press: and (b) subjecting the compacted polyolefin to a rolling step and at least one stretching step under such conditions that at no point during the processing of the polymer its temperature is raised to a value above its melting point. The process allows for the manufacture of ultra-high molecular weight polyolefin films of high quality. | 2011-04-28 |
20110095448 | METHOD AND APPARATUS FOR LONGITUDINAL ORIENTATION OF THERMOPLASTIC FILM MATERIAL - Method and apparatus for longitudinal orientation of thermoplastic film material ( | 2011-04-28 |
20110095449 | Multiple Spider Head - The extrusion head including a conduit with a central mandrel extending within the conduit for supporting an inner die portion of a set of dies that has inner and outer die portions. An upstream spider and a downstream spider are included, and each have webs supporting the central mandrel at axially spaced apart positions. The webs of the upstream and downstream spiders can have web portions that are axially offset from each other to promote mixing of polymer flowing through the conduit. | 2011-04-28 |
20110095450 | Extrusion Head With High Volume Reservoir - An extrusion head for an extrusion apparatus can include a spider for supporting a central mandrel. A high volume reservoir can be mounted to the spider on a downstream side of the spider. The central mandrel can extend longitudinally into the high volume reservoir. The high volume reservoir can have an axially straight annular conduit with a length L and an outer diameter OD. The annular conduit can have an L to OD ratio of about 1:1. A set of dies can be mounted downstream of the high volume reservoir, whereby the high volume reservoir reduces pressure and promotes homogenization of molten polymer flowing therethrough, before reaching the set of dies. | 2011-04-28 |
20110095451 | METHOD OF MAKING A MULTILAYERED DUPLEX MATERIAL ARTICLE - Disclosed is a method for manufacturing a multilayered duplex material article. The method comprises providing a first layer from a non-cast material and a second layer from a cast material wherein the second layer is made from a material with a lower melting point than the first layer. In one embodiment the first layer is a wrought alloy and the second layer is cast onto the first layer. | 2011-04-28 |
20110095452 | METHOD FOR MOLDING A TAPERED FLANGE - A tape reel assembly comprises a reel hub and flanges coaxially secured to, and extending radially outwardly from, opposite axial ends of the reel hub, respectively, each flange being molded by resin injection molding and having a tapered inside surface sloping down at a fixed taper angle from an inside periphery to an outside periphery thereof. The flange is molded by the use of an injection mold having a mold surface which borders at least a part of a mold cavity for configuration of the tapered inside surface of the flange and is convexly curved to the mold cavity. | 2011-04-28 |
20110095453 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION - The present invention is one liquid type cyanate-epoxy composite resin composition that is comprised of cyanate ester resin (A), epoxy resin (B) and latent curing agent (C) and has high thermal resistance as well as excellent fast curing properties and storage stability, characterized in that the above latent curing agent is comprised of a modified amine compound (a) and a phenol resin (b). Where, the modified-amine compound (a) is obtained by the reaction of at least one kind of amine compounds (a-1), selected from amine compounds having one or more tertiary amino groups and one or more primary and/or secondary amino groups, with an epoxy compound (a-2), in particular. It is preferable that one liquid type cyanate-epoxy composite resin composition of the present invention contains 1-10,000 mass parts of the epoxy resin component of the component (B) relative to 100 mass parts of cyanate-ester resin component of the component (A). The using amount of the latent curing agent of the component (C) is preferred to be 1-100 mass parts relative to 100 mass parts of the whole components (A) and (B). | 2011-04-28 |
20110095454 | SYSTEM AND METHOD FOR TREATMENT OF WOODEN MATERIALS - A method for treating a wooden material includes applying steam and vacuum to the wooden material. | 2011-04-28 |
20110095455 | IMPRINT LITHOGRAPHY - An imprint lithography template is provided with an alignment mark, wherein the alignment mark is formed from dielectric material having a refractive index which differs from the refractive index of the imprint lithography template, the dielectric material having a thickness which is such that it provides a phase difference between alignment radiation which has passed through the dielectric material and alignment radiation which has not passed through the dielectric material. | 2011-04-28 |
20110095456 | PAD FOR LEAF SPRING - A curved portion | 2011-04-28 |
20110095457 | Robot Part And A Method For Protecting A Robot Part - A robot part, such as a robot arm or a robot joint, surrounded by an impact absorbing structure is provided. According to the invention, the impact absorbing structure has a shroud surrounding the robot part. The shroud is mounted on two spacing elements such that an interspace is formed between the shroud and the robot part. At least one of the spacing elements mounts the shroud elastically. Also provided is a method of protecting a robot part by providing the robot part with an impact absorbing structure according to the invention. | 2011-04-28 |
20110095458 | ELASTOMERIC SLEEVE MOUNT WITH HYDRAULIC DAMPING - An elastomeric bushing with hydraulic damping in which the swell walls ( | 2011-04-28 |
20110095459 | HYDRAULIC ENGINE MOUNT - A hydraulic engine mount assembly includes a support bracket defining a passageway that communicates between a pair of fluid chambers formed in an elastomeric body. According to one embodiment, the mount includes first and second connection devices for respectively connecting the engine mount to first and second connection surfaces. | 2011-04-28 |
20110095460 | HYDRAULIC DECELERATIOR - The invention concerns a hydraulic decelerator with a fluid tank ( | 2011-04-28 |
20110095461 | ELASTIC ASSEMBLY AND SLIDE MECHANISM USING THE SAME - An elastic assembly for a portable electronic device includes at least two springs and two bushings. Each spring has a different curvature radius and two annular connecting portions at two ends, the connecting portion of each spring having a different diameter relative other connecting portion of other springs. The springs are substantially arranged in a plane, the two connecting portions of each spring are respectively coiled around and secured to another two connecting portion of another spring, the two bushings are respectively secured to the two connecting portion having the smallest diameter. The disclosure also discloses a slide mechanism using the elastic module. | 2011-04-28 |
20110095462 | Fluid pressure shock absorber - A fluid pressure shock absorber comprises a cylinder | 2011-04-28 |
20110095463 | Multiple size-fitting clamp pad pods and clamp assembly - A multiple size fitting clamp pad pod that functions both as a clamp pad and as a support pod, includes: a main vertical wall with a front, a back, a top, sides and a bottom, and a frontal view footprint that includes a central orifice adapted to fit onto and receive a first clamp bar and that includes at least two opposing rest points located on the bottom. The central orifice has a first predetermined shape and open area to fit freely onto and receive the first clamp bar, and a break-away impression surrounding the central orifice to establish a second predetermined shape and open area to fit freely onto and receive a second clamp bar larger than the first clamp bar when the break-away impression is breached; and, a plurality of sidewalls located on and directed away from the main wall front. | 2011-04-28 |
20110095464 | FLEXIBLE PRINTED CIRCUIT BOARD HOLDER - A holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member. | 2011-04-28 |
20110095465 | Cutting board - A cutting board, which includes a pair of substantially planar members, which are separated by at least two support members and forms a slot or space configured to receive a tray. The tray fits between the pair of substantially planar members, the tray having at least one compartment configured to receive food from at least one of the pair of substantially planar members. The tray includes a plurality of compartments. | 2011-04-28 |
20110095466 | Stage Structure for Operation in Vacuum - A method and a stage structure for use in a vacuum environment, the stage structure includes a first low-outgassing plate and first high-outgassing associated components that are encapsulated by first low-outgassing covering elements, wherein the first low-outgassing plate is arranged to be coupled to a first motor that is arranged to move the first low-outgassing plate along a first direction, an outgassing level of each of the first low-outgassing plate and the first low-outgassing covering elements does not exceed a tolerable level of outgassing in the vacuum environment, and an outgassing level of each first high-outgassing associated component is above the tolerable level of outgassing in the vacuum environment. | 2011-04-28 |
20110095467 | Adaptive Clamp Width Adjusting Device - The present invention describes an adaptive clamp width adjusting device ( | 2011-04-28 |
20110095468 | RECONFIGURABLE STITCHER FOR BINDING CONSECUTIVE VARIABLE THICKNESS COLLATIONS - A stitcher for binding variable thickness collations including a means for determining the thickness of a multi-sheet collation, a stitch head operative to drive a stitch through the multi-sheet collation, an anvil operative to clinch the stitch to bind the sheets of the collation and a plurality of actuators operative to displace forming elements of the stitch head to form the stitch, position the stitch head and anvil against opposite surfaces of the multi-sheet collation, drive the stitch through the collation and clinch the ends of the stitch. A processor, responsive to the thickness value signal, controls the actuators to form the stitch and bind the collation. | 2011-04-28 |
20110095469 | STITCHER/STAPLER FOR BINDING MULTI-SHEET COLLATIONS AND METHOD OF OPERATING THE SAME - A system for binding variable thickness multi-sheet collations includes first and second processing stations including a stitcher and stapler, respectively and a means for determining the thickness of a multi-sheet collation. A processor is responsive to a thickness value signal and selects one of the first and second processing stations to bind the multi-sheet collation. A conveyance system then transports the multi-sheet collation to the selected one of the first and second processing stations. A method includes the steps of: stacking sheet material to produce a multi-sheet collation, determining the thickness of the multi-sheet collation, and selecting an apparatus to bind the multi-sheet collation from one of at least two binding apparatus based upon the thickness of the multi-sheet collation. The multi-sheet collation is then conveyed along a feed path to a selected one of the binding apparatus. The method further includes the steps of disposing the multi-sheet collation between a pair of opposed registration members and aligning opposed edges of the multi-sheet collation by oscillating at least one of the registration members into and out of engagement with at least one of the opposed edges based upon the thickness of the multi-sheet collation. | 2011-04-28 |
20110095470 | METHOD AND APPARATUS FOR SELECTING MEDIA TRAYS FOR HOLE PUNCHING IN AN IMAGE PRODUCTION DEVICE - A method and apparatus for selecting media trays for hole punching in an image production device in an image production device is disclosed. The method may include receiving a request to print a print job, the print job having a required number of media sheets, determining if print job requires hole punching, wherein if it is determined that print job requires hole punching, determining the media sheet capacity of one or more media trays, determining if the capacity of one of the one or more media trays is greater or equal to the number of media sheets required for the print job, wherein if it is determined that the capacity of one of the one or more media trays is greater or equal to the number of media sheets required for the print job, selecting one of the one or more media trays having the required number of media sheets for the print job, and printing the print job with media from the selected media tray. | 2011-04-28 |
20110095471 | SHEET FINISHING APPARATUS AND CONTROL METHOD - A sheet finishing apparatus includes: a puncher which moves between a penetrate position and a standby position; a detection unit which detects a lateral edge of a sheet; a standby tray which supports the sheet passed through the puncher, by a pair of tray members; a lateral alignment unit which holds and aligns the sheet falling off the standby tray, by a pair of alignment boards; a moving mechanism which moves the position of the standby tray or the alignment boards in a direction orthogonal to the carrying direction of the sheet; and a control unit which measures a quantity of misalignment of the sheet by using a result of detection of the lateral edge from the detection unit and controls the moving mechanism in accordance with the quantity of misalignment. | 2011-04-28 |
20110095472 | SHEET PROCESSING SYSTEM, APPARATUS CAPABLE OF REDUCING AMOUNT OF POSITIONAL ERROR OF CONVEYED SHEET, AND METHOD OF CONTROLLING SHEET PROCESSING SYSTEM - A sheet processing system capable of performing lateral shift correction of a sheet in an upstream sheet processing apparatus based on an amount of lateral shift to be caused by conveying thereof into a downstream sheet processing apparatus. A side edge sensor of a stacker detects a lateral shift amount of a sheet conveyed into the stacker. A stacker controller corrects lateral shift of the sheet by a shift unit. A side edge sensor of a finisher disposed downstream of the stacker detects a lateral shift amount of a sheet conveyed into the finisher. The finisher sends the detected lateral shift amount to the stacker. The stacker receives the lateral shift amount from the finisher, and the stacker controller corrects lateral shift of subsequent sheets based on both the lateral shift amount detected in the stacker and the lateral shift amount sent from the finisher. | 2011-04-28 |
20110095473 | PAPER FEEDING APPARATUS WITH PAPER SIZE DETECTORS - A paper feeding apparatus includes a cassette main body that stacks a paper therein, a sidewall that moves in a width direction of the cassette main body, an end wall that moves in a longitudinal direction of the cassette main body, a first movable member that is connected at one end to the sidewall and rotates around a shaft axially fixed to the cassette main body in connection with the sidewall, a second movable member that is connected at one end to the end wall and rotates around a shaft axially fixed to the cassette main body in connection with the end wall, a first detection unit that has a plurality of detection members and detects the size of the paper in the width direction, and a second detection unit that has a plurality of detection members and detects the size of the paper in the longitudinal direction. | 2011-04-28 |
20110095474 | DEVICE FOR CONCENTRICALLY TRANSPORTING DOCUMENTS THROUGH PASSAGEWAY - A device is provided for continuously and concentrically transporting documents of different width through a passageway at a high speed. The device comprises a pair of opposed rollers | 2011-04-28 |
20110095475 | THROWER FOR GAME MACHINE - A thrower used in a game machine includes a joystick having a stick and an induction switch spaced below the stick, a thrower holder holding an electromagnetic valve that is controllable by the induction switch to throw an object away from the thrower holder, a tilting bar pivotally coupled between the joystick and the thrower holder and movable by the joystick to bias the thrower holder in Y-axis direction, a swinging bar pivotally coupled between the joystick and a connection frame that is pivotally coupled between the swinging bar and the thrower holder for enabling the swinging bar to bias the thrower holder in X-axis direction according to the control of the joystick. | 2011-04-28 |
20110095476 | Playing card holder for windy conditions - A device for holding one or more stacks of playing cards in windy conditions is disclosed. The device comprises a frame portion and a card-holding portion. The frame comprises a base for contacting a ground surface and a support portion for movably retaining the card-holding portion. In a desired embodiment, the device comprises two card-holding portions for retaining two stacks of playing cards, for instance, a drawing stack and a discard stack. The device can operate via force of gravity or through a spring-loaded mechanism. | 2011-04-28 |
20110095478 | BOARD PUZZLES - A portable puzzle comprising a board containing a recess sized for holding seven regular twelve-sided prisms, one prism centrally located and the other six surrounding the center prism, and also comprising seven regular twelve sided prisms each having an upwardly presented face composed of twelve different colored segments, each segment terminating along one of the respective sides, the color arrangement of each prism's segments being varied from prism to prism but having been prearranged such that when the prisms are placed within the recess of the game board in one particular manner, the contiguous edges of adjacent prisms contain segments of the same color. | 2011-04-28 |
20110095479 | BOARD GAME - The board game requires two or more alternating players to place tiles on a game board while attempting to form a sequential line along a row, column, or diagonal of the board while simultaneously preventing the opponent(s) from doing so. One rule requires the winning player to form a line of tiles of precisely the number required to win, i.e., a longer line does not win. Another rule prohibits players from forming multiple branched lines having a single common point, if those lines are within two tiles of the number required to win. Thus, a player may not form two joined lines having four potential playing orientations to win, with the opponent having only three turns remaining to block such play. Players may select the number of tiles required for a win, and/or the size of the game board. The game may also be adapted to computer or electronic play. | 2011-04-28 |
20110095480 | Gaming Activity Awarding Subsequent Plays Using Results of Previous Plays - A first hand of a card game is played from a first deck of playing cards to determine a first payout. Based on a qualifying card combination being present in the first hand, a second hand from is dealt from a second deck of playing cards. The second hand includes the qualifying card combination from the second deck and at least one randomly selected card from the second deck. The second hand of the card game is played to determine a second payout. | 2011-04-28 |
20110095483 | Methods and devices for a game of chance based on occurrences and for gambling on a live sporting event - A game for enhancing viewer interest and enjoyment of a sporting event and providing a promotional vehicle for enhancing revenue for organized athletic teams, television and radio broadcasters, and advertisers and a gambling system for use in conjunction with a live professional baseball game includes wagering cards corresponding to a particular baseball game. The wagering cards have printed thereon opportunities for the card holder to win payouts upon the occurrence of certain events in the sporting event. | 2011-04-28 |
20110095484 | Game Apparatus For Playing Toss Off - An apparatus for playing a game of Toss Off is provided which includes a pole having a generally tubular construction with a reduced diameter portion at one end and a platform secured to the pole opposite the reduced diameter portion. The reduced diameter portion of the pole can be engaged directly with the surface on which the pole is used, or can be releasably engaged with a stand having an aperture therein formed to be complementary to the reduced diameter portion. | 2011-04-28 |
20110095485 | METAL-TO-METAL SEAL WITH RETENTION DEVICE - A downhole tool includes a first portion having a first metal protrusion configured to seal against a first metal surface and a second portion having a second metal protrusion configured to seal against a second metal surface. A ratcheting device includes a first element having a plurality of grooves, and a second element having at least two sets of teeth, wherein one of the at least two sets of teeth engages the plurality of grooves. Additionally, a method of forming a downhole seal includes disposing in a wellbore a downhole tool including an inner tubular, a lock ring, a lower ring, an upper ring, an insert ring, and a deformable element. The method further includes moving a wedge sleeve axially downward with respect to the downhole tool such that the wedge sleeve engages the deformable ring and forces a first metal protrusion on the deformable element into contact with an outer tubular. | 2011-04-28 |
20110095486 | OIL SEAL - Ridge and groove sections ( | 2011-04-28 |
20110095487 | CENTERED FLOATING SEAL - A self-centering floating seal comprising a ring having first and second diameters, wherein the ring is arranged to be installed between first and second gland components, a plurality of tabs protruding from the first diameter, wherein the tabs are operatively arranged to exert a force on the first gland component to create a radial gap between the first diameter and the first gland component, while the second diameter is arranged to engage against the second gland component for forming a sealed interface, a plurality of seats corresponding to the plurality of tabs, wherein each seat forms a recess in the first diameter of the ring for receiving one of the tabs when each tab is flexed toward the ring, and wherein the tabs are substantially equally spaced about the first diameter of the ring, and each of the tabs spans an axial thickness of the ring. | 2011-04-28 |
20110095488 | Multi-layered gasket - A gasket is described having a middle layer, two metal layers and an uppermost and a lowermost layer. The middle layer may have an upper surface and a lower surface defining a first planar portion, a wave portion and a second planar portion. The metal layers sandwich the middle layer and are substantially planar. An uppermost active layer is located above the first intermediate layer. The uppermost active layer comprises a first planar portion, a first bead portion, and a second planar portion. The lowermost active layer is located below the second intermediate layer. The lowermost active layer also comprises a first planar portion, a first bead portion, and a second planar portion. | 2011-04-28 |
20110095489 | Gasket with engine liner accomodation - A gasket has a first active layer with a bead. A first spacer layer is located below the first active layer. An intermediate layer is provided with a wave portion. The intermediate layer is located below the first spacer layer. A bottom spacer layer is located beneath the intermediate layer. The bottom spacer may have a bead. | 2011-04-28 |
20110095490 | COATED SEAL FOR SEALING PARTS IN A VEHICLE ENGINE - A coated seal for sealing parts in a vehicle engine is disclosed herein. The seal includes a seal body portion including glass fiber-filled polytetrafluoroethylene, carbon-filled polytetrafluoroethylene, molybdenum disulfide-filled polytetrafluoroethylene, bronze-filled polytetrafluoroethylene or combinations thereof; and a coating portion including either expanded polytetrafluoroethylene, carbon-filled polytetrafluoroethylene, or combinations thereof. A method of using a coated seal in a vehicle engine is also disclosed herein. A system to achieve decreased friction, decreased noise, and improved wear in injector seals in a vehicle engine is also disclosed herein. | 2011-04-28 |
20110095491 | Single-Layer Seal or Sealing Layer of a Multiple-Layer Seal and Method for its Production - A single-layer seal or a sealing layer of a multi-layer seal made of metal includes supporting regions and sealing regions. At least one supporting region and at least one sealing region are embodied by a stamped sliding surface with a thickness that is greater than an original sheet-metal thickness. A step is stamped onto the upper side and/or the underside of the at least one sliding surface such that the sliding surface bends elastically in an installed state. | 2011-04-28 |
20110095492 | CYLINDER HEAD GASKET - A cylinder head gasket | 2011-04-28 |
20110095493 | PIEZOELECTRIC CLAMPING DEVICE - A clamping apparatus has been developed for coupling a tool member to the output shaft of a power tool without the use of auxiliary hands tools or a shaft-lock lever. The clamping apparatus includes a clamp member and a piezoelectric element. The clamp member is coupled to an output shaft of a motor. The piezoelectric element opposes the first clamp member and is configured to change from a first state to a second state in response to being coupled to a source of electrical energy. | 2011-04-28 |
20110095494 | Hydraulic stabilizer - A control system to stabilize horizontal motion of a vehicle under varying steering conditions. A turn to the right or left will cause the oil from one shock to be redirected, through tubing, to the opposite side shock, causing a matched suspension spring compression to occur on both sides of the vehicle. In a straight ahead course, the hydraulic cross-vehicle flow is aborted. | 2011-04-28 |
20110095495 | RACK WITH WHEELS - A rack includes a chassis, and a plurality of wheel assemblies secured to the chassis. Each wheel assembly includes a bracket, a wheel, and a handle. The bracket is rotatable relative to the chassis between a first position and a second position. Each wheel is capable of rotating about an axis. A distance between the axis and the chassis when each bracket is in the first position is less than a distance between the axis and the chassis when the bracket is in the second position. The handle is secured to the bracket and configured to rotate the corresponding bracket, and extends inside the chassis. | 2011-04-28 |
20110095496 | WHEELABLE PUSH/PULL HANDLE LAUNDRY BASKET - A wheeled basket having a body and a wheeled support incorporated into a bottom proximate extending edge of said body. Either of an extensible or pivotal handle is secured to a rear or inside rear portion of the body. A rear extending pad support can be secured to the body and is adapted to establish a sliding surface for vertically traversing said along edge surfaces associated with each succeeding stair riser interface. A strap is secured over an open top of the body. Additional variants can include a redesigned body including a main frame, an upper pivotal support secured to a first location of the main frame, with a second lower pivotal support secured to a second location. | 2011-04-28 |
20110095497 | SUPPORTING DEVICE WITH WHEELS - A supporting device includes a tray, a plurality of wheel assemblies, a handle, and a handgrip. The tray is configured for supporting a payload. The wheel assemblies are secured to the tray, and each wheel assembly includes a wheel. Each wheel is capable of rotating about a first axis. The wheel assemblies are rotatable between a first position and a second position, and a distance between each wheel and the tray in the first position is smaller than a distance between each wheel and the tray in the second position. The handle is attached to the tray and configured to urge the wheel assemblies to rotate from the first position to the second position. The handgrip is attached to the tray and configured to urge the wheel assemblies to rotate from the second position to the first position. | 2011-04-28 |
20110095498 | ADJUSTABLE DOOR AND PANEL CARRIER - An adjustable door and panel carrier has an adjustable gripping cradle mounted on two large pneumatic wheels. A single control lever positioned on an outside face of one of the outside walls moves both gripping panels simultaneously and smoothly to secure large planar objects on a cushioned, non-slip platform. | 2011-04-28 |
20110095499 | Driving device for adjusting an orientation of a vehicle wheel - A driving device for adjusting an orientation of a wheel attached to a vehicle body includes: a driving unit; a lifting shaft extending along a first axis and capable of moving axially when driven by the driving unit; a suspension arm extending along a transverse direction intersecting the first axis, and having one end adapted for connection with the wheel and another end disposed in proximity to the lifting shaft; and a cam unit including at least one roller connected to one of the lifting shaft and the suspension arm, and an inclined cam face provided on the other one of the lifting shaft and the suspension arm. The roller and the inclined cam face interact with each other such that the suspension arm moves along the transverse direction. | 2011-04-28 |
20110095500 | SKATEBOARD TRUCK - A skateboard truck includes a hanger and a truck plate. The hanger includes a yoke with a first yoke portion and a second yoke portion. The truck plate includes a first connection portion slideably connected to the first yoke portion through a shock absorber. The truck plate also includes a second connection portion connected to the second yoke portion through a connecting bar. The connecting bar is rotatably connected to the truck plate. | 2011-04-28 |