22nd week of 2016 patent applcation highlights part 50 |
Patent application number | Title | Published |
20160155632 | Anti-Reflective Layer and Method | 2016-06-02 |
20160155633 | AZIDE-BASED CROSSLINKING AGENTS | 2016-06-02 |
20160155634 | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, Substrate Processing System and Non-Transitory Computer-Readable Recording Medium | 2016-06-02 |
20160155635 | ATOMIC LAYER DEPOSITION OF GeO2 | 2016-06-02 |
20160155636 | DEPOSITION METHOD FOR PLANAR SURFACES | 2016-06-02 |
20160155637 | METHOD FOR PRODUCING STRUCTURED COATINGS, STRUCTURED COATINGS PRODUCED ACCORDING TO SAID METHOD AND USE THEREOF | 2016-06-02 |
20160155638 | CRYSTALLIZATION PROCESSING FOR SEMICONDUCTOR APPLICATIONS | 2016-06-02 |
20160155639 | Mechanisms for Forming Patterns Using Lithography Processes | 2016-06-02 |
20160155640 | MANUFACTURING METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155641 | System and Method for Mitigating Oxide Growth in a Gate Dielectric | 2016-06-02 |
20160155642 | Deposited Material and Method of Formation | 2016-06-02 |
20160155643 | LINE WIDTH ROUGHNESS IMPROVEMENT WITH NOBLE GAS PLASMA | 2016-06-02 |
20160155644 | Removal Of Defects By In-Situ Etching During Chemical-Mechanical Polishing Processing | 2016-06-02 |
20160155645 | ETCH PROCESS WITH PRE-ETCH TRANSIENT CONDITIONING | 2016-06-02 |
20160155646 | HARD MASK REMOVAL SCHEME | 2016-06-02 |
20160155647 | ETCH SYSTEM AND METHOD FOR SINGLE SUBSTRATE PROCESSING | 2016-06-02 |
20160155648 | Systems and Methods for In SITU Maintenance of a Thin Hardmask During an Etch Process | 2016-06-02 |
20160155649 | Method for Planarizing Semiconductor Device | 2016-06-02 |
20160155650 | Via Structure For Packaging And A Method Of Forming | 2016-06-02 |
20160155651 | METHOD OF FORMING WAFERLESS INTERPOSER | 2016-06-02 |
20160155652 | METHOD OF DEGASSING | 2016-06-02 |
20160155653 | System And Method Of Opening A Load Lock Door Valve At A Desired Pressure After Venting | 2016-06-02 |
20160155654 | WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION | 2016-06-02 |
20160155655 | SAMPLE HOLDER | 2016-06-02 |
20160155656 | SEMICONDUCTOR-ELEMENT MANUFACTURING METHOD AND WAFER MOUNTING DEVICE | 2016-06-02 |
20160155657 | SURFACE PROFILE MODIFICATIONS FOR EXTENDED LIFE OF CONSUMABLE PARTS IN SEMICONDUCTOR PROCESSING EQUIPMENT | 2016-06-02 |
20160155658 | SEMICONDUCTOR WAFER HOLDER AND WAFER CARRYING TOOL USING THE SAME | 2016-06-02 |
20160155659 | INTERCONNECTION STRUCTURE INCLUDING AIR GAP, SEMICONDUCTOR DEVICE INCLUDING AIR GAP, AND METHOD OF MANUFACTURING THE SAME | 2016-06-02 |
20160155660 | METHOD FOR PATTERNING SUB-50-NANOMETERS STRUCTURES | 2016-06-02 |
20160155661 | CONTACT MODULE FOR OPTIMIZING EMITTER AND CONTACT RESISTANCE | 2016-06-02 |
20160155662 | METHOD OF FORMING KEY PATTERNS AND METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING THE SAME | 2016-06-02 |
20160155663 | METHOD OF MAKING INTERCONNECT STRUCTURE | 2016-06-02 |
20160155664 | Metallization Method for Semiconductor Structures | 2016-06-02 |
20160155665 | 3D Integrated Circuit and Methods of Forming the Same | 2016-06-02 |
20160155666 | Providing A Chip Die With Electrically Conductive Elements | 2016-06-02 |
20160155667 | ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS | 2016-06-02 |
20160155668 | Germanium FinFETs with Metal Gates and Stressors | 2016-06-02 |
20160155669 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155670 | MULTI-STAGE FIN FORMATION METHODS AND STRUCTURES THEREOF | 2016-06-02 |
20160155671 | Method of Forming a Semiconductor Device | 2016-06-02 |
20160155672 | Simultaneous Formation of Source/Drain Openings with Different Profiles | 2016-06-02 |
20160155673 | SEMICONDUCTOR DEVICE HAVING TUNGSTEN GATE ELECTRODE AND METHOD FOR FABRICATING THE SAME | 2016-06-02 |
20160155674 | Fabricating a Semiconductor Package with Conductive Carrier | 2016-06-02 |
20160155675 | VOID MONITORING DEVICE FOR MEASUREMENT OF WAFER TEMPERATURE VARIATIONS | 2016-06-02 |
20160155676 | METHODS FOR DEPOSITING FILMS ON SENSITIVE SUBSTRATES | 2016-06-02 |
20160155677 | Semiconductor device and method of manufacturing a semiconductor device | 2016-06-02 |
20160155678 | Semiconductor Device and Method for Fabricating Thereof | 2016-06-02 |
20160155679 | ELECTRONIC HARDWARE ASSEMBLY | 2016-06-02 |
20160155680 | Semiconductor Package and Method of Fabrication Thereof | 2016-06-02 |
20160155681 | PACKAGE FOR HIGH-POWER SEMICONDUCTOR DEVICES | 2016-06-02 |
20160155682 | INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE | 2016-06-02 |
20160155683 | SEMICONDUCTOR PACKAGE HAVING HEAT-DISSIPATION MEMBER | 2016-06-02 |
20160155684 | SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD | 2016-06-02 |
20160155685 | THROUGH-SUBSTRATE STRUCTURE AND MEHTOD FOR FABRICATING THE SAME | 2016-06-02 |
20160155686 | SEMICONDUCTOR DEVICES HAVING A TSV, A FRONT-SIDE BUMPING PAD, AND A BACK-SIDE BUMPING PAD | 2016-06-02 |
20160155687 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-06-02 |
20160155688 | METHOD FOR PACKAGING A POWER DEVICE WITH BOTTOM SOURCE ELECTRODE | 2016-06-02 |
20160155689 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD | 2016-06-02 |
20160155690 | SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE | 2016-06-02 |
20160155691 | MULTI-LAYERED CIRCUIT DEVICE | 2016-06-02 |
20160155692 | SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS | 2016-06-02 |
20160155693 | ELECTRONIC PACKAGES AND METHODS OF MAKING AND USING THE SAME | 2016-06-02 |
20160155694 | REDUCED PTH PAD FOR ENABLING CORE ROUTING AND SUBSTRATE LAYER COUNT REDUCTION | 2016-06-02 |
20160155695 | INTERPOSERS WITH CIRCUIT MODULES ENCAPSULATED BY MOLDABLE MATERIAL IN A CAVITY, AND METHODS OF FABRICATION | 2016-06-02 |
20160155696 | ETCH BACK PROCESSES OF BONDING MATERIAL FOR THE MANUFACTURE OF THROUGH-GLASS VIAS | 2016-06-02 |
20160155697 | Protrusion Bump Pads for Bond-on-Trace Processing | 2016-06-02 |
20160155698 | METAL-INSULATOR-METAL ON-DIE CAPACITOR WITH PARTIAL VIAS | 2016-06-02 |
20160155699 | MIMCAP STRUCTURE IN A SEMICONDUCTOR DEVICE PACKAGE | 2016-06-02 |
20160155700 | Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof | 2016-06-02 |
20160155701 | INTERCONNECT STRUCTURE FOR AN INTEGRATED CIRCUIT AND METHOD OF FABRICATING AN INTERCONNECT STRUCTURE | 2016-06-02 |
20160155702 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2016-06-02 |
20160155703 | Opening Fill Process and Structure Formed Thereby | 2016-06-02 |
20160155704 | DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL | 2016-06-02 |
20160155705 | INTEGRATED CIRCUIT PACKAGE WITH EMBEDDED BRIDGE | 2016-06-02 |
20160155706 | SEMICONDUCTOR MODULE AND POWER CONVERTER | 2016-06-02 |
20160155707 | RF SOI SWITCH WITH BACKSIDE CAVITY AND THE METHOD TO FORM IT | 2016-06-02 |
20160155708 | REDUCED-WARPAGE LAMINATE STRUCTURE | 2016-06-02 |
20160155709 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155710 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155711 | X-RAY OBSCURATION FILM AND RELATED TECHNIQUES | 2016-06-02 |
20160155712 | SEMICONDUCTOR CHIP | 2016-06-02 |
20160155713 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2016-06-02 |
20160155714 | SEMICONDUCTOR DEVICE, A POWER SEMICONDUCTOR DEVICE, AND A METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155715 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-06-02 |
20160155716 | PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2016-06-02 |
20160155717 | ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREFOR | 2016-06-02 |
20160155718 | BOND WIRE FEED SYSTEM AND METHOD THEREFOR | 2016-06-02 |
20160155719 | CHIP BONDING APPARATUS AND CHIP BONDING METHOD | 2016-06-02 |
20160155720 | Method and Apparatus for Chip-To-Wafer Integration | 2016-06-02 |
20160155721 | Bonding Method, Storage Medium, Bonding Apparatus and Bonding System | 2016-06-02 |
20160155722 | Vertical system integration | 2016-06-02 |
20160155723 | SEMICONDUCTOR PACKAGE | 2016-06-02 |
20160155724 | SEMICONDUCTOR DEVICES HAVING STACKED STRUCTURES AND METHODS FOR FABRICATING THE SAME | 2016-06-02 |
20160155725 | Stacked Semicondcutor Structure and Method | 2016-06-02 |
20160155726 | SEMICONDUCTOR DEVICE | 2016-06-02 |
20160155727 | LIGHT EMITTING DIODE DEVICE AND LIGHT EMITTING DEVICE USING THE SAME | 2016-06-02 |
20160155728 | STACKED PACKAGING USING RECONSTITUTED WAFERS | 2016-06-02 |
20160155729 | PROXIMITY COUPLING OF INTERCONNECT PACKAGING SYSTEMS AND METHODS | 2016-06-02 |
20160155730 | Semiconductor Devices, Multi-Die Packages, and Methods of Manufacture Thereof | 2016-06-02 |
20160155731 | Method of Multi-Chip Wafer Level Packaging | 2016-06-02 |