38th week of 2010 patent applcation highlights part 16 |
Patent application number | Title | Published |
20100237460 | METHODS AND SYSTEMS INVOLVING ELECTRICALLY PROGRAMMABLE FUSES - An electrically programmable fuse comprising a cathode member, an anode member, and a link member, wherein the cathode member, the anode member, and the link member each comprise one of a plurality of materials operative to localize induced electromigration in the programmable fuse. | 2010-09-23 |
20100237461 | SEMICONDUCTOR PACKAGE SUBSTRATE INCLUDING FUSES, SEMICONDUCTOR DEVICE PACKAGE, SEMICONDUCTOR MODULE AND ELECTRONIC APPARATUS INCLUDING THE SAME - A semiconductor device package, and a semiconductor module and an electronic apparatus including the semiconductor device package are provided. The semiconductor device package includes a package substrate, first pads and second pads disposed on a first surface of the package substrate and fuses corresponding to the second pads, the fuses being disposed on a second surface of the package substrate. First and second semiconductor chips including a plurality of chip pads are disposed on the first surface of the package substrate and the first pads are electrically connected to both one of the chip pads of the first semiconductor chip and one of the chip pads of the second semiconductor chip, wherein the second pads are selectively electrically connected to one of the chip pads of the first semiconductor chip or one of the chip pads of the second semiconductor chip. | 2010-09-23 |
20100237462 | Package Level Tuning Techniques for Propagation Channels of High-Speed Signals - Various semiconductor chip carrier substrate circuit tuning apparatus and methods are disclosed. In one aspect, a method of manufacturing is provided that includes assembling a semiconductor chip carrier substrate with a first input/output site adapted to electrically connect to an external component and a second input/output site adapted to electrically connect to an input/output site of a semiconductor chip. An inductor is placed in the semiconductor chip carrier substrate. The inductor is electrically connected between the first and second input/output sites. The inductor has a preselected inductance to reduce an impedance discontinuity between the first input/output site or the second input/output site due to coupling to a second conductor in the semiconductor chip carrier substrate. | 2010-09-23 |
20100237463 | Selective Fabrication of High-Capacitance Insulator for a Metal-Oxide-Metal Capacitor - Methods and devices of a capacitor in a semiconductor device having an increased capacitance are disclosed. In a particular embodiment, a method of forming a capacitor is disclosed. A section of a first insulating material between a first metal contact element and a second metal contact element is removed to form a channel. A second insulating material is deposited in the channel between the first metal contact element and the second metal contact element. | 2010-09-23 |
20100237464 | Chip Inductor With Frequency Dependent Inductance - A set of metal line structures including a signal transmission metal line and a capacitively-grounded inductively-signal-coupled metal line is embedded in a dielectric material layer. A capacitor is serially connected between the capacitively-grounded inductively-signal-coupled metal line and a local electrical ground, which may be on the input side or on the output side. The set of metal line structures and the capacitor collective provide a frequency dependent inductor. The Q factor of the frequency dependent inductor has multiple peaks that enable the operation of the frequency dependent inductor at multiple frequencies. Multiple capacitively-grounded inductively-signal-coupled metal lines may be provided in the frequency-dependent inductor, each of which is connected to the local electrical ground through a capacitor. By selecting different capacitance values for the capacitors, multiple values of the Q-factor may be obtained in the frequency dependent inductor at different signal frequencies. | 2010-09-23 |
20100237465 | CAPACITOR AND A METHOD OF MANUFACTURING A CAPACITOR - A device comprises a substrate ( | 2010-09-23 |
20100237466 | SEMICONDUCTOR DEVICES - A semiconductor device includes a lower electrode, a supporting member enclosing at least an upper portion of the lower electrode, a dielectric layer on the lower electrode and the supporting member, and an upper electrode disposed on the dielectric layer. The supporting member may have a first portion that extends over an upper part of the sidewall of the lower electrode, and a second portion covering the upper surface of the lower electrode. The first portion of the supporting member protrudes above the lower electrode. | 2010-09-23 |
20100237467 | Interconnect Structures, Methods for Fabricating Interconnect Structures, and Design Structures for a Radiofrequency Integrated Circuit - Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, such as a radiofrequency integrated circuit. A top surface of a dielectric layer is recessed relative to a top surface of a conductive feature in the dielectric layer. The passive element is formed on the recessed top surface of the dielectric layer and includes a layer of a conductive material that is coplanar with, or below, the top surface of the conductive feature. | 2010-09-23 |
20100237468 | ON-CHIP CAPACITORS WITH A VARIABLE CAPACITANCE FOR A RADIOFREQUENCY INTEGRATED CIRCUIT - On-chip capacitors with a variable capacitance, as well as design structures for a radio frequency integrated circuit, and method of fabricating and method of tuning on-chip capacitors. The on-chip capacitor includes first and second ports powered with opposite polarities, first and second electrodes, and first and second voltage-controlled units. Each of the first and second voltage-controlled units is switched between a first state in which the first and second electrodes are electrically isolated from the first and second ports and a second state. When the first voltage-controlled unit is switched to the second state, the first electrode is electrically connected with the first port. When the second voltage-controlled unit is switched to the second state the second electrode is electrically connected with the second port. The on-chip capacitor has a larger capacitance value when the first and second voltage-controlled units are in the second state. | 2010-09-23 |
20100237469 | PHOTOMASK, SEMICONDUCTOR DEVICE, AND CHARGED BEAM WRITING APPARATUS - A photomask has a pattern formed by writing of a charged beam on basis of a charged beam control data. The charged beam control data is produced by: setting a plurality of correction points in a writing area on pattern data; performing a simulation of writing with a charged beam on basis of the pattern data to divide the writing area, at time of writing each of the correction points, into a written area of writing been already completed and an unwritten area of writing yet to be performed; deriving, for each of the correction points, a first charging amount distribution due to a fogging effect around each of the correction points using a subset of the pattern data belonging to the written area; deriving, for each of the correction points, a second charging amount distribution modified from the first charging amount distribution on basis of an effect by which the charging amount due to the fogging effect is reduced at a position irradiated with the charged beam; deriving amount of pattern displacement at each of the correction points on basis of the second charging amount distribution; and deriving correction parameters of pattern position on basis of the amount of pattern displacement. | 2010-09-23 |
20100237470 | EPITAXIAL WAFER - An epitaxial wafer is provided capable of eliminating particles in a device process, particles being generated from scratches in a boundary area between a rear surface and a chamfered surface of a wafer. The number of scratches in the boundary area between the rear surface and the chamfered surface is small, and thus the number of particles generated from the scratches is reduced at a time of immersion in an etching solution in the device process. Thereby, a device yield is increased. | 2010-09-23 |
20100237471 | Semiconductor Die and Method of Forming Through Organic Vias Having Varying Width in Peripheral Region of the Die - A plurality of semiconductor die is mounted to a carrier separated by a peripheral region. An insulating material is deposited in the peripheral region. A first opening is formed in the insulating material of the peripheral region to a first depth. A second opening is formed in the insulating material of the peripheral region centered over the first opening to a second depth less than the first depth. The first and second openings constitute a composite through organic via (TOV) having a first width in a vertical region of the first opening and a second width in a vertical region of the second opening. The second width is different than the first width. A conductive material is deposited in the composite TOV to form a conductive TOV. An organic solderability preservative (OSP) coating is formed over a contact surface of the conductive TOV. | 2010-09-23 |
20100237472 | Chip Guard Ring Including a Through-Substrate Via - At least one through-substrate via is formed around the periphery of a semiconductor chip or a semiconductor chiplet included in a semiconductor chip. The at least one through-substrate via may be a single through-substrate via that laterally surrounds the semiconductor chip or the semiconductor chiplet, or may comprise a plurality of through-substrate vias that surrounds the periphery with at least one gap among the through-substrate vias. A stack of back-end-of-line (BEOL) metal structures that laterally surrounds the semiconductor chip or the semiconductor chiplet are formed directly on the substrate contact vias and electrically connected to the at least one through-substrate via. A metallic layer is formed on the backside of the semiconductor substrate including the at least one through-substrate via. The conductive structure including the metallic layer, the at least one through-substrate via, and the stack of the BEOL metal structures function as an electrical ground built into the semiconductor chip. | 2010-09-23 |
20100237473 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed. | 2010-09-23 |
20100237474 | Unpolished Semiconductor Wafer and Method For Producing An Unpolished Semiconductor Wafer - Unpolished semiconductor wafers are produced by: (a) pulling a single crystal of a semiconductor material, (b) grinding the single crystal round, (c) separating a semiconductor wafer from this crystal, (d) rounding the edge of the semiconductor wafer, (e) surface-grinding at least one side of the semiconductor wafer, (f) treating the semiconductor wafer with an etchant, and (g) cleaning the semiconductor wafer. The unpolished semiconductor wafers have, on at least the front side, a reflectivity of 95% or more, a surface roughness of 3 nm or less, have a thickness of 80-2500 μm, an overall planarity value GBIR of 5 μm or less with an edge exclusion of 3 mm and a photolithographic resolution of at least 0.8 μm, and which furthermore contain a native oxide layer with a thickness of 0.5-3 nm on both sides. | 2010-09-23 |
20100237475 | NEUTRALIZATION OF TRAPPED CHARGE IN A CHARGE ACCUMULATION LAYER OF A SEMICONDUCTOR STRUCTURE - A semiconductor structure. The semiconductor structure includes a semiconductor layer, a charge accumulation layer on top of the semiconductor layer, a doped region in direct physical contact with the semiconductor layer; and a device layer on and in direct physical contact with the charge accumulation layer. The charge accumulation layer includes trapped charges of a first sign. The doped region and the semiconductor layer forms a P-N junction diode. The P-N junction diode includes free charges of a second sign opposite to the first sign. The trapped charge in the charge accumulation layer exceeds a preset limit above which semiconductor structure is configured to malfunction. A first voltage is applied to the doped region. A second voltage is applied to the semiconductor layer. A third voltage is applied to the device layer. The third voltage exceeds the first voltage and the second voltage. | 2010-09-23 |
20100237476 | Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same - While a fine porous diamond particle film has been known as a high heat resistant and low dielectric constant film and also has high mechanical strength and heat conductivity, and is expected as an insulating film for multi-layered wirings in semiconductor integrated circuit devices, it is insufficient in current-voltage characteristic and has not yet been put into practical use. According to the invention, by treating the fine porous diamond particle film with an aqueous solution of a salt of a metal such as barium and calcium, the carbonate or sulfate of which is insoluble or less soluble, and a hydrophobic agent such as hexamethyl disilazane or trimethyl monochlolo silane, as well as a reinforcing agent containing one of dichlorotetramethyl disiloxane or dimethoxytetramethyl disiloxane, thereby capable of putting the dielectric breakdown voltage and the leak current within a specified range of a practical standard. | 2010-09-23 |
20100237477 | Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die - A semiconductor device includes a pre-fabricated shielding frame mounted over a sacrificial substrate and semiconductor die. An encapsulant is deposited through an opening in the shielding frame around the semiconductor die. A first portion of the shielding frame to expose the encapsulant. Removing the first portion also leaves a second portion of the shielding frame over the semiconductor die as shielding from interference. A third portion of the shielding frame around the semiconductor die provides a conductive pillar. A first interconnect structure is formed over a first side of the encapsulant, shielding frame, and semiconductor die. The sacrificial substrate is removed. A second interconnect structure over the semiconductor die and a second side of the encapsulant. The shielding frame can be connected to low-impedance ground point through the interconnect structures or TSV in the semiconductor die to isolate the die from EMI and RFI, and other inter-device interference. | 2010-09-23 |
20100237478 | Lead frame and semiconductor package having the same - Provided is a lead frame that may include a frame, a lead structure, and a dam bar. The frame may include a plurality of openings configured to receive semiconductor chips. The lead structure may be in the openings. The lead structure may also include inner leads and outer leads. The inner leads may be configured to electrically connect to the semiconductor chips and the outer leads may extend from the inner leads. In example embodiments, the lead structure may extend in a first direction. The dam bar may be arranged between the inner leads and the outer leads. In accordance with example embodiments, the dam bar may extend along a second direction which is substantially perpendicular to the first direction. In example embodiments, the dam bar may have a first strength-reinforcing portion extending along the second direction. Also provided is a semiconductor package having the lead frame. | 2010-09-23 |
20100237479 | Lead Frame Based, Over-Molded Semiconductor Package with Integrated Through Hole Technology (THT) Heat Spreader Pin(s) and Associated Method of Manufacturing - A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package ( | 2010-09-23 |
20100237480 | SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD - A semiconductor device has a first layer pressing portion that is formed by crushing a ball neck formed by bonding an initial ball onto a first layer pad of a first layer semiconductor die and pressing the side of a wire folded onto the crushed ball neck, a first wire extended in the direction of a lead from the first layer pressing portion, and a second wire that is looped from a second layer pad of a second layer semiconductor die toward the first layer pressing portion and joined onto the second layer pad side of the first layer pressing portion. Thereby, the connection of wires is performed at a small number of times of bonding, while reducing damages caused on the semiconductor dies. | 2010-09-23 |
20100237481 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: attaching an integrated circuit having a through via over a substrate with the through via coupled to the substrate; attaching a conductive support over the substrate and adjacent to the integrated circuit; forming an encapsulation over the substrate with the conductive support exposed from the encapsulation; and attaching an external interconnect under the substrate. | 2010-09-23 |
20100237482 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LAYERED PACKAGING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a base package having a base interposer; forming an intermediate package having an intermediate interposer and an intermediate package embedded link trace, the intermediate package embedded link trace being encapsulated in an intermediate package mold compound; forming a cap package having a cap interposer; and connecting the intermediate package to the cap package and the base package using the intermediate package embedded link trace. | 2010-09-23 |
20100237483 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: mounting a device over an integrated circuit having a through via; attaching an interposer, having an opening, and the integrated circuit with the device within the opening; and forming an encapsulation at least partially covering the integrated circuit and the interposer facing the integrated circuit. | 2010-09-23 |
20100237484 | Semiconductor package - Provided is a semiconductor package including a first package and a second package. The first package includes a first substrate having a first front side and a first back side opposing the first front side. The first package further includes a first semiconductor chip on the first front side and an external connection member on the first semiconductor chip. The external connection member may be configured to electrically connect the first semiconductor chip to an external device. The second package includes a second substrate having a second back side facing the first back side of the first substrate and a second front surface opposing the second back side. The second package includes a second semiconductor chip on the second front side. The semiconductor package further includes an internal connection member between the first back side and the second back side to electrically connect the first package to the second package. | 2010-09-23 |
20100237485 | STACK TYPE SEMICONDUCTOR PACKAGE APPARATUS - A semiconductor device includes a first semiconductor package having at least one first semiconductor chip and a first sealing member covering the at least one first semiconductor chip, a second semiconductor package stacked on the first semiconductor package, the second semiconductor package having at least one second semiconductor chip, leads electrically connected to the at least one second semiconductor chip, and a second sealing member covering the at least one second semiconductor chip, and at least one signal connection member disposed in the first sealing member of the first semiconductor package, the at least one signal connection member electrically connecting the at least one first semiconductor chip with the leads of the at least one second semiconductor chip. | 2010-09-23 |
20100237486 | SEMICONDUCTOR DEVICE - A semiconductor device including: a base substrate; a frame body mounted on the base substrate and formed with a recessed portion in each of both side faces thereof opposing to each other; a semiconductor chip mounted on the base substrate within an area of the frame body; a dielectric block inserted into the recessed portion in the frame body; a waveguide formed on a surface of the dielectric block and electrically connected with the semiconductor chip; a plurality of protection patterns respectively formed along the waveguide at positions spaced from the waveguide on both sides of the waveguide on the surface of the dielectric block; and a metal layer formed on at least each of the both side faces of the dielectric block opposing to each other by plating. | 2010-09-23 |
20100237487 | METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS - Panel level methods and systems for packaging integrated circuits are described. In a method aspect of the invention, a substrate formed from a sacrificial semiconductor wafer is provided having a plurality of metallized device areas patterned thereon. Each device area includes an array of metallized contacts. Dice are mounted onto each device area and electrically connected to the array of contacts. The surface of the substrate including the dice, contacts and electrical connections is then encapsulated. The semiconductor wafer is then sacrificed leaving portions of the contacts exposed allowing the contacts to be used as external contacts in an IC package. In various embodiments, other structures, including saw street structures, may be incorporated into the device areas as desired. By way of example, structures having thicknesses in the range of 10 to 20 microns are readily attainable. | 2010-09-23 |
20100237488 | INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING - A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts; attaching an integrated circuit to the top surface; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that are over and larger than the electrical contacts. | 2010-09-23 |
20100237489 | Structure and Method for Sealing Cavity of Micro-Electro-Mechanical Device - A cavity package ( | 2010-09-23 |
20100237490 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a manufacturing method thereof are provided. The package structure includes a packaging substrate, a chip, an interposer substrate, a wire and an adhesive layer. The packaging substrate has an upper packaging surface. The chip is disposed on the upper packaging surface. The wire connects the packaging substrate and the interposer substrate. The adhesive layer is disposed between the packaging substrate and the interposer substrate, and covers the entire chip and part of the upper packaging surface. The adhesive layer includes a first adhesive part and a second adhesive part. The first adhesive part adheres the interposer substrate and the chip. The second adhesive part surrounds the first adhesive part, adheres the interposer substrate and the packaging substrate, and supports a periphery of the interposer substrate. | 2010-09-23 |
20100237491 | Semiconductor package with reduced internal stress - A semiconductor package may include a semiconductor chip having a plurality of chip pads arranged apart from each other on a substrate body and an insulation layer having chip pad-exposing portions for exposing chip pads. The insulation layer may be separated by underlying layer-exposing portions between the chip pads, and the semiconductor package may further include a connector in the chip pad-exposing portions and connected to corresponding chip pads. | 2010-09-23 |
20100237492 | SEMICONDUCTOR DEVICE AND METHOD FOR DESIGNING THE SAME - The semiconductor device comprises a semiconductor chip and a printed wiring board having a recess in which the semiconductor chip is housed face-down, wherein the printed wiring board comprises multiple wiring layers below a circuit surface of the semiconductor chip on which connection terminals are formed, and the multiple wiring layers include a first wiring layer for forming signal wires, a second wiring layer for forming a ground plane, and a third wiring layer for forming power wires and power BGA and ground BGA pads in sequence from the circuit surface. | 2010-09-23 |
20100237493 | PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD - A printed circuit board including: a semiconductor package including a main body including a substantially rectangular parallelepiped shape, and a plurality of solder balls on one face of the main body; a board including a first face, a second face, and a hole portion, the first face including a mounting area where the plurality of solder balls are configured to be attached, the second face being opposite to the first face, the hole portion being formed around the mounting area and connected to a conductive pattern, the conductive pattern being configured to be connectable to an electronic component mounted on the board; and a bonding portion configured to bond the semiconductor package to the board, the bonding portion including a portion disposed in the hole portion. | 2010-09-23 |
20100237494 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES - Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed. | 2010-09-23 |
20100237495 | Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core - A semiconductor device is made by providing a sacrificial substrate and depositing an adhesive layer over the sacrificial substrate. A first conductive layer is formed over the adhesive layer. A polymer pillar is formed over the first conductive layer. A second conductive layer is formed over the polymer pillar to create a conductive pillar with inner polymer core. A semiconductor die or component is mounted over the substrate. An encapsulant is deposited over the semiconductor die or component and around the conductive pillar. A first interconnect structure is formed over a first side of the encapsulant. The first interconnect structure is electrically connected to the conductive pillar. The sacrificial substrate and adhesive layers are removed. A second interconnect structure is formed over a second side of the encapsulant opposite the first interconnect structure. The second interconnect structure is electrically connected to the conductive pillar. | 2010-09-23 |
20100237496 | Thermal Interface Material with Support Structure - Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader. | 2010-09-23 |
20100237497 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There are included a semiconductor substrate provided with a desirable element region, an electrode pad formed to come in contact with a surface of the semiconductor substrate or a wiring layer provided on the surface of the semiconductor substrate, a bonding pad formed on a surface of the electrode pad through an intermediate layer, and a resin insulating film for covering a peripheral edge of the bonding pad such that an interface of the bonding pad and the intermediate layer is not exposed to a side wall. | 2010-09-23 |
20100237498 | PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF - A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate. | 2010-09-23 |
20100237499 | SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME - Semiconductor devices, as well as stacked structures, packages, modules, and electronic apparatus including the semiconductor device, and methods of fabricating the same. The semiconductor device includes a circuit layer on a substrate, a metal interconnection layer on the circuit layer, the metal interconnection layer having a copper interconnection and a protection layer, a first and a second through silicon via plugs vertically penetrating the circuit layer, a first via pad on the first through silicon via plug, and a second via pad on the second through silicon via plug, wherein the first via pad is electrically connected to the copper interconnection, and wherein the second via pad is electrically insulated from the copper interconnection. | 2010-09-23 |
20100237500 | Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead Site - A semiconductor substrate includes a first conductive layer formed over the semiconductor substrate. The first conductive layer has first and second portions which are electrically isolated during formation of the first conductive layer. A solder resist layer is formed over the first conductive layer and semiconductor substrate. An opening is formed in the solder resist layer to expose the first conductive layer. A seed layer is formed over the semiconductor substrate and first conductive layer within the opening. A second conductive layer is formed over the seed layer within the opening. The opening may expose the second portion of the first conductive layer due to solder resist registration shifting causing a defect condition. The second conductive layer electrically contacts the first and second portions of the first conductive layer. By testing the first and second portions of the first conductive layer, the defect condition can be identified. | 2010-09-23 |
20100237501 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device includes forming an insulating film including silicon, oxygen, carbon and hydrogen above a semiconductor substrate, forming a wiring trench in the insulating film, forming a metal film to be a metal wiring on the insulating film such that the metal film is provided in the wiring trench, forming the metal wiring by removing the metal film outside the wiring trench, performing a hydrophobic treatment to the surface of the insulating film after the forming the metal wiring, and forming a metal cap selectively on an upper surface of the metal wiring by plating after the performing the hydrophobic treatment. | 2010-09-23 |
20100237502 | Barrier for Through-Silicon Via - A system and a method for protecting through-silicon vias (TSVs) is disclosed. An embodiment comprises forming an opening in a substrate. A liner is formed in the opening and a barrier layer comprising carbon or fluorine is formed along the sidewalls and bottom of the opening. A seed layer is formed over the barrier layer, and the TSV opening is filled with a conductive filler. Another embodiment includes a barrier layer formed using atomic layer deposition. | 2010-09-23 |
20100237503 | ELECTROMIGRATION RESISTANT ALUMINUM-BASED METAL INTERCONNECT STRUCTURE - A vertical metallic stack, from bottom to top, of an elemental metal liner, a metal nitride liner, a Ti liner, an aluminum portion, and a metal nitride cap, is formed on an underlying metal interconnect structure. The vertical metallic stack is annealed at an elevated temperature to induce formation of a TiAl | 2010-09-23 |
20100237504 | Methods of Fabricating Semiconductor Devices Having Conductive Wirings and Related Flash Memory Devices - A conductive wiring for a semiconductor device is provided including a semiconductor substrate and a plurality of lower conductive structures on the semiconductor substrate. An insulating layer is provided that electrically insulates the plurality of lower conductive structures from one another. A first insulation interlayer pattern is provided on the insulation layer. The first insulation interlayer pattern includes a contact plug that contacts the substrate through the insulation layer. An etch-stop layer is provided on the contact plug and the first insulation interlayer pattern. A second insulation interlayer pattern is provided on the etch-stop layer. The second insulation interlayer pattern includes a conductive line that is electrically connected to the contact plug. Related methods and flash memory devices are also provided. | 2010-09-23 |
20100237505 | METAL-METAL BONDING OF COMPLIANT INTERCONNECT - Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate. | 2010-09-23 |
20100237506 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and manufacturing method. One embodiment provides a device including a semiconductor chip. A first conductor line is placed over the semiconductor chip. An external contact pad is placed over the first conductor line. At least a portion of the first conductor line lies within a projection of the external contact pad on the semiconductor chip. | 2010-09-23 |
20100237507 | POWER MODULE - A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship. | 2010-09-23 |
20100237508 | POWER-SUPPLY WIRING STRUCTURE FOR MULTILAYER WIRING AND METHOD OF MANUFACTURING MULTILAYER WIRING - A power-supply wiring structure for a multilayer wiring according to an embodiment of the present invention includes one intermediate wiring layer with a first direction set as a priority wiring direction including a position converting and connecting wire, which has crossing-position forming sections formed in crossing positions of upper-layer power supply wires and lower-layer power supply wires of the same kind and projecting sections projecting from the crossing-position forming sections to sides of upper-layer power supply wires of different kinds, and includes a wire connecting section that connects between the upper layer wires and the crossing-position forming section and connects between the projecting section and the lower layer wires via vias. | 2010-09-23 |
20100237509 | IO CELL WITH MULTIPLE IO PORTS AND RELATED TECHNIQUES FOR LAYOUT AREA SAVING - An IO cell with multiple IO ports and related techniques are provided. The IO cell has a plurality of IO ports for transmitting signal of a same IO pin, and each IO port corresponds to a predetermined region for containing an IO pad, wherein at least one of the plural predetermined regions of the plural IO ports partially overlaps with active circuit layout region of the IO cell. In a chip, if a given IO cell has a predetermined region of an IO port overlapping an IO pad location of another adjacent IO cell, then a predetermined region of another IO port is selected for implementing an IO pad of the given IO cell, such that the IO cells can be arranged more compactly for chip layout area saving. | 2010-09-23 |
20100237510 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES - Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The method further includes cutting the semiconductor workpiece to singulate the dies, and attaching the stand-off on a first singulated die to a second die. | 2010-09-23 |
20100237511 | Structure and Method for Thin Single or Multichip Semiconductor QFN Packages - A semiconductor device has one or more semiconductor chips with active and passive surfaces, wherein the active surfaces include contact pads. The device further has a plurality of metal segments separated from the chip by gaps; the segments have first and second surfaces, wherein the second surfaces are coplanar with the passive chip surface. Conductive connectors span from the chip contact pads to the respective first segment surface. Polymeric encapsulation compound covers the active chip surface, the connectors, and the first segment surfaces, and are filling the gaps so that the compound forms surfaces coplanar with the passive chip surface and the second segment surfaces. In this structure, the device thickness may be only about 250 μm. Reflow metals may be on the passive chip surface and the second segment surfaces. | 2010-09-23 |
20100237512 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a cell array layer including a first and a second wiring, which cross each other; a third wiring formed on a first wiring layer below the cell array layer; a fourth wiring formed on a second wiring layer above the cell array layer; and a contact extending in a stacking direction for connecting the third and the fourth wiring, wherein the device further comprises a redundant wiring layer being formed between the first and the second wiring layer, the redundant wiring layer being formed with a redundant wiring having a portion extending in the same direction as at least one of the third and the fourth wiring, and the third and the redundant wiring, and the fourth and the redundant wiring being connected by a plurality of contacts arranged along the portion extending in the same direction as the third or the fourth wiring. | 2010-09-23 |
20100237513 | APPLICATIONS OF SMART POLYMER COMPOSITES TO INTEGRATED CIRCUIT PACKAGING - Applications of smart polymer composites to integrated circuit packaging. | 2010-09-23 |
20100237514 | INGOT MARKING FOR SOLAR CELL DETERMINATION - The invention relates to a method for marking wafers, in particular wafers for solar cell production: The method comprises the steps of manufacturing a position line ( | 2010-09-23 |
20100237515 | Carburetor assembly - A carburetor assembly ( | 2010-09-23 |
20100237516 | Carburetor assembly - A carburetor assembly includes a carburetor ( | 2010-09-23 |
20100237517 | DEVICE FOR FOAMING LIQUID FOODS IN A CONTAINER - A device for foaming liquid foods in a container, particularly milk, is provided having a vapor generator for generating vapors, particularly steam, and a vapor lance to be at least partially inserted into the container, with the vapor lance being connected to the vapor generator in a fluid-guiding fashion and including at least one vapor outlet opening such that steam can be discharged from the vapor generator via the vapor lance out of the vapor outlet opening. The device further includes at least one motion element which is connected to the vapor lance and/or a holder for the container such that the vapor lance and the container are movable relative to each other via the motion element. | 2010-09-23 |
20100237518 | Liquid distributor - The liquid distributor includes a channel for the reception of a liquid which is divided by a dividing wall into a first chamber and a second chamber. An inlet element for a liquid opens into the first chamber to fill the first chamber with the liquid. Openings are provided in the dividing wall so that the liquid can be distributed from the first chamber via the openings into the second chamber in the form of jets to create turbulent vortices. | 2010-09-23 |
20100237519 | Packing layer for a structured packing - A packing layer for a structured packing which has corrugations forming open channels. Each channel includes first and second corrugation peaks bounding a first corrugation valley with each corrugation peak having an apex and the corrugation valley having a valley bottom. | 2010-09-23 |
20100237520 | PREPARATION OF MICROCAPSULE WITH DOUBLE LAYERED STRUCTURE - The present invention relates to a method of preparing a microcapsule with a double-layered structure which comprises the steps of performing an interfacial polymerization of an amine-aldehyde prepolymer on droplets containing an inorganic metal precursor selected from carboxylate and alkoxide compounds, and hydrolyzing the including inorganic precursors for formation of inorganic inner layer. The method of the present invention can prepare a microcapsule with a double-layered structure of an inorganic inner layer and a polymer outer layer, which is effective for eluting and substituting a core material inside the capsule. | 2010-09-23 |
20100237521 | METHOD AND DEVICE FOR THE PRODUCTION OF POLYAMIDE - The invention relates to a method for the production of pellets of polyamide 6 or copolyamides. The method can include production of a melt of polyamide 6 or copolyamides by means of polymerization, production of pellets from the melt by means of underwater pelletization into a process fluid, removal of the pellets from a site of underwater pelletization in the process fluid, supply of the pellets in the process fluid to an extraction stage, extraction of low-molecular components as extract, and drying of the pellets after extraction, wherein the underwater pelletization stage and the extraction stage take place using the same process fluid. The invention further relates to a device for implementation of such a method. | 2010-09-23 |
20100237522 | METHOD FOR PRODUCING RESIN MICROPARTICLE AQUEOUS DISPERSION, AND RESIN MICROPARTICLE AQUEOUS DISPERSION AND RESIN MICROPARTICLES OBTAINED BY THE SAME - The object of the present invention is to provide a method for producing a resin microparticle aqueous dispersion, which can produce monodisperse resin microparticles, does not cause clogging by a product, does not require a high pressure, and has ahighproductivity. Thus, providedisamethodforproducing a resin microparticle aqueous dispersion, wherein a fluid having at least one kind of resin dissolved in a solvent with which a resin is soluble and compatible and a fluid of an aqueous solvent join together in a thin film fluid formed between processing surfaces arranged opposite so as to be able to approach to and separate from each other, at least one of which rotates relative to the other, whereby resin microparticles are obtained in the thin film fluid by way of separation/emulsification. | 2010-09-23 |
20100237523 | METHODS FOR PREPARING POLYMER MICROPARTICLES - The present invention describes methods and tools for preparing a population of monodisperse polymer microparticles, which are of particular interest in the field of drug delivery. | 2010-09-23 |
20100237524 | METHOD OF MANUFACTURING CERAMIC CAPABLE OF ADSORBING FRAGRANCE AND RELEASING FRAGRANT AROMA - A method of manufacturing a ceramic capable of adsorbing a fragrance and releasing a fragrant aroma primarily mixes over 60% of a metal oxide with a ceramic clay, and then produces a lubricating effect by performing a high-temperature thermal treatment to the ceramic clay in a liquid form between the metal oxide particles in a solid form, such that the metal oxide particles can serve as sliding carriers and provide an enhanced effect for manufacturing a ceramic product with a fine surface and an internal porous property, and provide good adsorption rate and release effect of the fragrance. | 2010-09-23 |
20100237525 | INJECTION FOAM MOLDING MACHINE AND METHOD OF INJECTION FOAM MOLDING - An injection foam molding machine according to the present invention includes: a clamping unit that moves a movable die plate | 2010-09-23 |
20100237526 | Inflatable dog toy - A method for rapidly producing and distributing a new toy comprises the steps of designing a new dog toy by defining the shape and dimension of an inflated pliable exterior cover; and, producing, as soon as the dog toy is designed, and without requiring the design and construction of a mold, at least one thousand units of said new dog toy in a single day by utilizing an expandable foam composition in the cover. | 2010-09-23 |
20100237527 | METHOD FOR PRODUCING A BIO-BASED POLYMERIC SHOE COMPONENT - A method for producing a bio-based polymeric shoe component includes: preparing a blend from a composition including 5˜50 weight parts of a modified starch, 50˜95 weight parts of an ethylene vinyl acetate copolymer, 5˜30 weight parts of a filler, 1˜50 weight parts of a polyolefin, 2.0˜8.0 weight parts of a foaming agent, 0.5˜3.0 weight parts of a foaming aid, 0.5˜2.0 weight parts of a lubricant, and 0.4˜1.2 weight parts of a crosslinking agent, the modified starch being obtained by hydrolyzing and esterifying a predetermined amount of a raw starch to form a hydrolyzed and esterified starch, followed by drying the hydrolyzed and esterified starch; processing the blend into a foamable product; and forming the foamable product into the shoe component. | 2010-09-23 |
20100237528 | METHOD FOR MAKING VESSELS FOR IMPROVING THE MECHANICAL STRENGTH THEREOF - Manufacturing process of a container ( | 2010-09-23 |
20100237529 | FORMATION OF SHEET MATERIAL USING HYDROENTANGLEMENT - A method is described for forming reconstituted leather sheet material from a mixture of base fibres, such as leather fibres, and bi-component synthetic fibres which have outer layers which melt at a lower temperature than their inner cores. The fibres are mixed, formed into a web and then heated so that the synthetic fibres fuse together to form a network within the web. The base fibres are then tangled, whilst constrained by the network, preferably using hydroentanglement. A high quality reconstituted leather sheet material is thus produced. | 2010-09-23 |
20100237530 | COMPRESSED PREPARATION | 2010-09-23 |
20100237531 | Method of Fabricating Three Dimensional Printed Part - A method of fabricating a three-dimensional printed part includes injecting a powder layer with an aqueous solution and curing the powder layer by depositing an acid gas on the powder layer to form a rigid structure. | 2010-09-23 |
20100237532 | AROMATIC POLYAMIDE FILAMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed are wholly aromatic polyamide filament and a method of manufacturing the same, characterized in that, in the process of preparing the wholly aromatic polyamide polymer, the aromatic diamine, aromatic diacid chloride and polymerization solvent put into the reactor | 2010-09-23 |
20100237533 | Process for Producing Oriented Plastic Tube - A start-up sequence for a continuous process for producing oriented plastic tube is disclosed. A variable diameter extruder ( | 2010-09-23 |
20100237534 | METHOD FOR MANUFACTURING FILM FORMATION MEMBER - A method is provided for manufacturing a film formation member having a dividing wall provided on a substrate to form a plurality of partitioned sections with a film being formed within each of the partitioned sections by discharging a predetermined amount of liquid within each of the partitioned sections. The method includes identifying a position of at least one of the partitioned section as a partitioned section with nonuniform liquid affinity among the partitioned sections, and discharging the liquid over a wider discharge range inside the partitioned section with nonuniform liquid affinity than a discharge range inside a partitioned section other than the partitioned section with nonuniform liquid affinity. | 2010-09-23 |
20100237535 | METHOD AND APPARATUS FOR PRETREATMENT OF A SLIDER LAYER FOR EXTRUDED COMPOSITE HANDRAILS - A method and apparatus for pretreatment of slider layer for extruded handrails has a slider layer source, a means of conveying the slider layer to a heating module which subjects the slider layer to an elevated temperature for a residence time, and a means of conveying the slider layer to an extrusion die head. One or more control feeders may be implemented for maintaining portions of the slider layer in a substantially tension-free loop as the slider layer is conveyed from the slider layer source to the extrusion die head. A cooling zone may be included to ensure adequate cooling between the heating module and the extrusion die head. Means for reducing heat transfer between the extrusion die head and the slider layer is also provided. | 2010-09-23 |
20100237536 | MOLD FOR IN-MOLD COATING AND IN-MOLD COATING METHOD - A mold for in-mold coating is provided that can ensure a space through which a coating material for performing in-mold coating flows. The mold for in-mold coating includes an undercut-shaped recess | 2010-09-23 |
20100237537 | COMPRESSION MOULDING METHOD FOR REALISING THERMOPLASTIC PRODUCTS - A method for realising thermoplastic products, comprising: use of a granular material comprising granules of thermoplastic polymers; inserting a dose (M) of the granular material internally of the chamber ( | 2010-09-23 |
20100237538 | INJECTION-MOLDING METHOD AND APPARATUS - An injection-molding method made up of a step of preparing a first die ( | 2010-09-23 |
20100237539 | MANUFACTURING METHOD AND APPARATUS FOR OPTICAL SHEET - The present invention provides a manufacturing method and an apparatus for an optical sheet placed in a backlight assembly. The optical sheet produced by the manufacturing method and apparatus has pluralities of first microstructures on the surface of the optical sheet. The optical sheet is mainly made of cured photo resin, for instance: ultraviolet glue. The optical sheet has higher performance and lower cost. Furthermore, the manufacturing method and the apparatus can produce the optical sheet more efficiently. | 2010-09-23 |
20100237540 | METHOD OF DESIGNING A TEMPLATE PATTERN, METHOD OF MANUFACTURING A TEMPLATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of designing a template pattern used for imprint lithography, includes generating data of a dummy template pattern to be formed in a third area between first and second areas of a template based on data of a design pattern of the template, the data of the dummy template pattern being generated so that a third surface area ratio showing a ratio of a surface area of the third area to an area of the third area is set smaller than a first surface area ratio showing a ratio of a surface area of the first area to an area of the first area and larger than a second surface area ratio showing a ratio of a surface area of the second area to an area of the second area. | 2010-09-23 |
20100237541 | Polyisoprene aqueous emulsion and a method to fabricate gloves and related products - This invention relates to the method for fabrication of polyisoprene aqueous emulsion, gloves and related products thereof, wherein the aqueous emulsion is polyisoprene or polynitrile aqueous emulsion obtained through free-radical emulsion polymerization initiated by initiating agent under normal pressure with isoprene as the monomer, or isoprene monomer, acrylonitrile monomer, and (methyl)acrylic acid as the monomer mixture, and emulsifying agent and dispersing agent as the emulsification system. After the isoprene or the mixture of isoprene monomer, acrylonitrile monomer, and (methyl)acrylic acid is mixed with the initiating agent, the oil phase obtained together with reducing agent is added dropwise in different time quantums. The polymerization conversion rate of polyisoprene aqueous emulsion or polynitrile aqueous emulsion according to this invention is increased from the original 78% to over 97.5%. Fabricated polyisoprene or polynitrile gloves and thin latex products thereof have high strength and good extensibility, provide good hand touch, and do not cause allergies of the human body. They can be used for various purposes. | 2010-09-23 |
20100237542 | Child's fabric toy with heat activated expandable form - A method for producing and distributing a child's toy encloses an expandable foam composition in a pliable fabric skin. The toy is compressed into a deflated configuration to form an inflatable toy and is shipped to a selected destination. The inflatable toy is delivered to a distributor and sold to an end user. The end user activates the foam to inflate the toy. | 2010-09-23 |
20100237543 | THERMOFORMING MOULD WITH THERMAL INSULATION AND ASSOCIATED METHOD - The invention relates to a mould for thermoforming food pots having a decoration, and to an associated method, the mould ( | 2010-09-23 |
20100237544 | METHOD FOR PRODUCING A DEEP-DRAWN FILM PART FROM A THERMOPLASTIC MATERIAL - Process for the production of an at least partly printed, metallized and/or otherwise coated thermoformed film part with at least the following process steps:
| 2010-09-23 |
20100237545 | METHOD OF MANUFACTURING SYRINGES AND OTHER DEVICES - A syringe for use in a pressurized injection of a fluid includes a syringe barrel including a polymeric material having undergone expansion via blow molding. An inner diameter of the syringe barrel can, for example, be sufficiently constant (over at least a portion of the axial length of the syringe) that a plunger slidably positioned within the syringe barrel and in generally sealing contact with an inner wall of the syringe barrel can be used within the syringe barrel to generate a pressure of at least 1 psi within the syringe barrel. In several embodiment, the inner diameter of the syringe barrel is sufficiently constant to generate a pressure of at least 100 psi, at least 300 psi, or even at least 500 psi within the syringe barrel. A method of forming a syringe includes the steps of: injection molding at least one polymeric material to form a preform; placing the preform into an blow mold die; and expanding at least a portion of the preform while heating the preform within the die to form a barrel of the syringe. The syringes can be formed to withstand relatively high pressures as described above. The at least one polymeric material can, for example, be polyethyleneterephthalate, cyclic olefin polymer, polypropylene, polystyrene, polyvinylidene chloride, polyethylene napthalate and/or nylon. | 2010-09-23 |
20100237546 | METHOD FOR PRODUCING A THIN-WALLED CONTAINER AND CONTAINER PRESSURISATION METHOD - The invention relates to a method for producing a thin-walled container, characterised in that a preform is deformed using a weight/wall surface ratio of the order of 150 g/m | 2010-09-23 |
20100237547 | Preparation of bulk superhard B-C-N nanocomposite compact - Bulk, superhard, B—C—N nanocomposite compacts were prepared by ball milling a mixture of graphite and hexagonal boron nitride, encapsulating the ball-milled mixture at a pressure in a range of from about 15 GPa to about 25 GPa, and sintering the pressurized encapsulated ball-milled mixture at a temperature in a range of from about 1800-2500 K. The product bulk, superhard, nanocomposite compacts were well sintered compacts with nanocrystalline grains of at least one high-pressure phase of B—C—N surrounded by amorphous diamond-like carbon grain boundaries. The bulk compacts had a measured Vicker's hardness in a range of from about 41 GPa to about 68 GPa. | 2010-09-23 |
20100237548 | STEEL-SHEET CONTINUOUS ANNEALING EQUIPMENT AND METHOD FOR OPERATING STEEL-SHEET CONTINUOUS ANNEALING EQUIPMENT - Steel-sheet continuous annealing equipment includes, in sequence, a pre-heating zone, a heating zone, a soaking zone, a cooling zone, a reheating zone, an overaging zone, and a final cooling zone, and further includes a rapid heating region and a rapid cooling region that are provided within a range from the reheating zone to the final cooling zone (including the reheating zone and the final cooling zone), the rapid heating region allowing rapid heating of a steel sheet at a heating rate of 15° C./s or more and the rapid cooling region allowing rapid cooling, at a cooling rate of 10° C./s or more, of the steel sheet that has been rapidly heated in the rapid heating region. Various steel-sheet products ranging from mild steel sheets to ultrahigh-tensile steel sheets can be produced by performing a heat treatment with such steel-sheet continuous annealing equipment. | 2010-09-23 |
20100237549 | Air Spring for Vehicle - An air spring has at least one working space which is filled with compressed air and which is delimited at least partially by a rolling bellows which is fastened at its ends to connecting parts. At least one of its ends, the air spring has a wall which is thicker in relation to the rest of the rolling bellows body, wherein the rolling bellows has, at least one of its thickened ends, a continuously vulcanized layer cover which is folded back to such a length that, after the assembly of the air spring, at least one region of the rolling bellows which is highly loaded by chassis forces falls into the region of the layer cover. | 2010-09-23 |
20100237550 | Elastic member, slide device using the elastic member, and electric device using the slide device - An elastic member used for a slide device includes a plurality of spring wires and first and second connecting sections that are locked to one ends and the other ends of the spring wires, respectively. Locking ends are formed at one ends and the other ends of the spring wires, both ends of the spring wires including the locking ends are formed in a symmetrical shape, the connecting sections include retaining engagement portions that make the plurality of spring wires be engaged with the connecting sections, and the first and second connecting sections are separately formed by forming the same assembling members and the same superposed members. If the assembling members are fixed to the superposed members while the ends of the spring wires are fitted to the grooves of the retaining engagement portions and the superposed members are assembled to be superposed on the assembling members, the ends of the plurality of spring wires are disposed at predetermined intervals and retained by the connecting sections. | 2010-09-23 |
20100237551 | CONNECTOR - A connector including a spacing link, and a first engagement member connected directly or indirectly to the spacing link, and a second engagement member mounted on an extension arm characterised in that the extension arm is mounted with respect to the spacing link so that the extension arm can move from one side of the spacing link to another. | 2010-09-23 |
20100237552 | DEVICE FOR POSITIONING WORKPIECE - A positioning device with a positioning face, which comprises a combination of concaves provided on the positioning face. The boundaries of each of concaves intersect to boundaries of other concaves adjacent thereto. A positioning section is provided on the positioning face, and the periphery of the positioning section is defined by the interaction of boundaries of the combination of concaves. | 2010-09-23 |
20100237553 | APPARATUS AND METHOD FOR THE PRODUCTION OF MULTI-PIECE PRINTED PRODUCTS - An apparatus and method for collating printed products. The apparatus includes a collating drum rotatably driven about a horizontal axis of rotation and at least functionally subdivided into axial sections, provided with separate compartments or saddle-shaped supports that are externally open in a radial direction. A first feeding device delivers printed products to the processing drum, and a conveyor conveys the printed products away from the processing drum. Conveying elements are associated with the compartments or the supports, and are used for conveying the printed products in the axial direction when the processing drum rotates. A secondary conveying section is arranged between the first feeding device and the conveyor, and a processing station or at least one additional feeding station is located between the first feeding device and the secondary conveying section in order to process the printed products or feed additional printed products. | 2010-09-23 |
20100237554 | RECORDING APPARATUS - A movable component which can be moved between a protruding position in which the movable component protrudes from the outer chute into a curved path toward an inner chute so as to be able to contact the recording medium and a retracted position in which the degree of protrusion of the movable component from the outer chute into the curved path is smaller than the degree of protrusion in the protruding position, and the movable component is moved from the protruding position to the retracted position at a timing on or after a first timing and before a second timing. | 2010-09-23 |
20100237555 | PAPPER FEEDING MODULE AND MULTI-FUNCTION PERIPHERAL HAVING THE SAME - A multi-function peripheral includes a main body and a paper feeding module. The paper feeding module includes a supporting base, a feeding element and a paper separating elastic element. The supporting base is disposed on the main body. The supporting base is suitable for supporting multiple paper sheets and defines a paper feeding path. The feeding element is disposed above the supporting base for feeding the paper sheets along the paper feeding path. The paper separating elastic element has a fixed end connected to the supporting base and a free end disposed on the paper feeding path. When the feeding element feeds the papers along the paper feeding path, the free end applies a frictional force on the paper sheets such that one paper sheet passes the paper separating element and keeps moving while the rest of the paper sheets are blocked from moving by the paper separating elastic element. | 2010-09-23 |
20100237556 | Sheet stacker and image forming apparatus - A sheet processing apparatus includes a fixed tray and a movable tray. The fixed tray is fixed at its downstream portion in a sheet transport direction and includes a sheet loading surface. A downstream portion of the sheet loading surface of the fixed tray is positioned at a higher level than an upstream portion thereof. The movable tray is pivotally supported, at its upstream portion, by a pivot support provided on the fixed tray. An angle between a sheet loading surface of the movable tray and a horizontal direction is more gentle than an angle between the sheet loading surface of the fixed tray and the horizontal direction. | 2010-09-23 |
20100237557 | Printing machine and feeding method for printing machines - Configuration with paired register rollers cooperative with a downstream head unit on a circulation route to register a print sheet, a feed route extending up to the register rollers, and feeder elements controllable for a downstream feed of print sheet along part of the feed route to the register rollers, the feeder elements being controllable for a change of feed speed or acceleration in accordance with information on a back tension of a print sheet on the circulation route. | 2010-09-23 |
20100237558 | CARRIAGE RESET FOR UPCOMING SHEET - A method and system feeds sheets through a media path in a process direction and moves a laterally movable sheet registration carriage (positioned within the media path) in a lateral direction perpendicular to the process direction. It determines the lateral error of the sheets within the media path before the sheets enter the sheet registration carriage, using first sensors positioned within the media path. This allows the sheet registration carriage to be moved to a variable lateral starting position (as opposed to a consistent reset position or centered reset position) before the sheets enter the sheet registration carriage based on the error of the sheets as determined by the first sensors. The error can be the amount of lateral error, or simply can be a classification of lateral error (right error, left error, etc.). | 2010-09-23 |
20100237559 | APPARATUSES USEFUL FOR PRINTING AND CORRESPONDING METHODS - Apparatuses useful for printing and methods of cleaning debris from a surface in an apparatus useful for printing are provided. An exemplary embodiment of an apparatus useful for printing includes a first roll, a belt including an inner surface and an outer surface, the first roll and the outer surface of the belt forming a nip, a stripping member located between the inner surface of the belt and the first roll for facilitating stripping of media from the outer surface of the belt after the media is fed through the nip with the belt moving in a first direction, wherein debris builds up on the inner surface of the belt adjacent to the stripping member during stripping of the media, and a cleaning device for cleaning the debris from the inner surface of the belt upon movement of the belt in a second direction opposite to the first direction. | 2010-09-23 |