Top Inventors for class "Active solid-state devices (e.g., transistors, solid-state diodes)" |
Rank | Inventor's name | Country | City/State | Last publication | # of patent apps in this class |
1 | Shunpei Yamazaki | JP | Tokyo | Sep 15, 2022 / 20220293795 - SEMICONDUCTOR DEVICE | 660 |
2 | Shunpei Yamazaki | JP | Setagaya | Sep 15, 2022 / 20220293798 - SEMICONDUCTOR DEVICE | 617 |
3 | Kangguo Cheng | US | Schenectady, NY | Sep 08, 2022 / 20220285614 - INTEGRATED SWITCH USING STACKED PHASE CHANGE MATERIALS | 338 |
4 | Huilong Zhu | US | Poughkeepsie, NY | Sep 08, 2022 / 20220285559 - VERTICAL STORAGE DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING STORAGE DEVICE | 279 |
5 | Chen-Hua Yu | TW | Hsin-Chu | Sep 14, 2017 / 20170263518 - Integrated Fan-Out Package Including Voltage Regulators and Methods Forming Same | 255 |
6 | Ali Khakifirooz | US | Mountain View, CA | Jul 13, 2017 / 20170200832 - NANOWIRE TRANSISTOR STRUCTURES WITH MERGED SOURCE/DRAIN REGIONS USING AUXILIARY PILLARS | 204 |
7 | Yaojian Lin | SG | Singapore | Mar 19, 2020 / 20200090954 - Semiconductor Device with Encapsulant Deposited Along Sides and Surface Edge of Semiconductor Die in Embedded WLCSP | 204 |
8 | Belgacem Haba | US | Saratoga, CA | Sep 15, 2022 / 20220293567 - DIRECT BONDED STACK STRUCTURES FOR INCREASED RELIABILITY AND IMPROVED YIELD IN MICROELECTRONICS | 191 |
9 | Hans-Joachim Schulze | DE | Taufkirchen | Aug 04, 2022 / 20220246745 - Silicon Carbide Devices, Semiconductor Devices and Methods for Forming Silicon Carbide Devices and Semiconductor Devices | 186 |
10 | Byung Tai Do | SG | Singapore | Oct 13, 2016 / 20160300817 - Semiconductor Device and Method of Forming a Package In-Fan Out Package | 177 |
11 | Edward J. Nowak | US | Essex Junction, VT | Dec 27, 2018 / 20180374758 - VERTICAL FIELD EFFECT TRANSISTORS | 176 |
12 | Franz Hirler | DE | Isen | Aug 18, 2022 / 20220262946 - SEMICONDUCTOR POWER DEVICE AND METHOD OF MANUFACTURING THE SAME | 172 |
13 | Satoshi Seo | JP | Sagamihara | Sep 15, 2022 / 20220293879 - LIGHT-EMITTING ELEMENT | 170 |
14 | Satoshi Seo | JP | Kawasaki | Jan 06, 2022 / 20220006034 - Light-Emitting Element, Light-Emitting Device, and Electronic Appliance | 160 |
15 | Kengo Akimoto | JP | Atsugi | Jul 21, 2022 / 20220231056 - DISPLAY DEVICE | 157 |
16 | Taiwan Semiconductor Manufacturing Company, Ltd. | US | | Dec 10, 2015 / 20150353342 - MEMS and Method for Forming the Same | 155 |
17 | Alexander Reznicek | US | Troy, NY | Sep 01, 2022 / 20220278195 - NANOSHEET METAL-OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR WITH ASYMMETRIC THRESHOLD VOLTAGE | 154 |
18 | Anup Bhalla | US | Santa Clara, CA | Apr 16, 2020 / 20200119185 - MOS DEVICE WITH ISLAND REGION | 151 |
19 | Jeffrey P. Gambino | US | Westford, VT | Dec 29, 2016 / 20160379948 - CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE | 149 |
20 | Junichiro Sakata | JP | Atsugi | Dec 09, 2021 / 20210384356 - TRANSISTOR AND DISPLAY DEVICE | 149 |
21 | Bruce B. Doris | US | Brewster, NY | Jan 28, 2016 / 20160027789 - DUMMY GATE STRUCTURE FOR ELECTRICAL ISOLATION OF A FIN DRAM | 146 |
22 | Haizhou Yin | US | Poughkeepsie, NY | Jun 09, 2016 / 20160163832 - FINFET AND METHOD OF MANUFACTURING SAME | 145 |
23 | Kangguo Cheng | US | Guilderland, NY | Oct 01, 2015 / 20150279936 - STRAINED CHANNEL FOR DEPLETED CHANNEL SEMICONDUCTOR DEVICES | 142 |
24 | Chih-Chao Yang | US | Glenmont, NY | Jan 13, 2022 / 20220013723 - PLANAR RESISTIVE RANDOM-ACCESS MEMORY (RRAM) DEVICE WITH A SHARED TOP ELECTRODE | 141 |
25 | Seng Guan Chow | SG | Singapore | Apr 21, 2016 / 20160111410 - Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect | 136 |
26 | Jeffrey W. Sleight | US | Ridgefield, CT | Sep 14, 2017 / 20170263707 - EXPITAXIALLY REGROWN HETEROSTRUCTURE NANOWIRE LATERAL TUNNEL FIELD EFFECT TRANSISTOR | 135 |
27 | Semiconductor Energy Laboratory Co., Ltd. | JP | Atsugi-Shi | Aug 08, 2013 / 20130203214 - METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 133 |
28 | Gurtej S. Sandhu | US | Boise, ID | Aug 18, 2022 / 20220262623 - METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC ACIDS | 132 |
29 | Jong-Hyuk Lee | KR | Yongin-City | Sep 10, 2015 / 20150255744 - ORGANIC LIGHT EMITTING DIODE | 131 |
30 | Brent A. Anderson | US | Jericho, VT | Apr 16, 2020 / 20200118890 - SELF-ALIGNED TOP SPACERS FOR VERTICAL FETS WITH IN SITU SOLID STATE DOPING | 131 |
31 | Jun Koyama | JP | Sagamihara | Jul 07, 2022 / 20220216242 - SHIFT REGISTER AND DISPLAY DEVICE AND DRIVING METHOD THEREOF | 130 |
32 | Fujio Masuoka | JP | Tokyo | Aug 11, 2022 / 20220254790 - PILLAR-SHAPED SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | 126 |
33 | Zigmund Ramirez Camacho | SG | Singapore | Apr 07, 2016 / 20160099222 - INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION AND METHOD OF MANUFACTURE THEREOF | 126 |
34 | Chen-Shien Chen | TW | Zhubei City | Sep 01, 2022 / 20220278031 - Package Structures and Methods for Forming the Same | 123 |
35 | Ravi Pillarisetty | US | Portland, OR | Aug 18, 2022 / 20220262860 - SELECTOR DEVICES | 120 |
36 | Heap Hoe Kuan | SG | Singapore | Nov 13, 2014 / 20140335655 - INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOUNTING STRUCTURE | 117 |
37 | Jan Hoentschel | DE | Dresden | Jan 26, 2017 / 20170025398 - DIE-DIE STACKING | 116 |
38 | Shinya Nunoue | JP | Chiba-Ken | Jun 09, 2016 / 20160163803 - NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR WAFER | 115 |
39 | Joachim Mahler | DE | Regensburg | Jan 06, 2022 / 20220005778 - SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD FOR FABRICATING THE SAME | 114 |
40 | Steven P. Denbaars | US | Goleta, CA | Jul 28, 2022 / 20220239068 - III-NITRIDE-BASED VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) CONFIGURATIONS | 114 |
41 | Dun-Nian Yaung | TW | Taipei City | Sep 15, 2022 / 20220293644 - MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATION STRUCTURE | 113 |
42 | Chun-Chen Yeh | US | Clifton Park, NY | Jan 03, 2019 / 20190006377 - HIGHLY COMPACT FLOATING GATE ANALOG MEMORY | 111 |
43 | Shuji Nakamura | US | Santa Barbara, CA | Jul 28, 2022 / 20220239068 - III-NITRIDE-BASED VERTICAL CAVITY SURFACE EMITTING LASER (VCSEL) CONFIGURATIONS | 111 |
44 | Reza A. Pagaila | SG | Singapore | Sep 11, 2014 / 20140252631 - Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die | 109 |
45 | Zhijiong Luo | US | Poughkeepsie, NY | Feb 18, 2016 / 20160049507 - DUAL CHANNEL MEMORY | 108 |
46 | Robert S. Chau | US | Beaverton, OR | Mar 31, 2022 / 20220102344 - GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY | 108 |
47 | Ralf Otremba | DE | Kaufbeuren | Jul 21, 2022 / 20220230941 - METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE | 107 |
48 | International Business Machines Corporation | US | Armonk, NY | Sep 18, 2014 / 20140282563 - DEPLOYING PARALLEL DATA INTEGRATION APPLICATIONS TO DISTRIBUTED COMPUTING ENVIRONMENTS | 104 |
49 | Anthony K. Stamper | US | Williston, VT | Dec 02, 2021 / 20210376159 - FIELD-EFFECT TRANSISTORS WITH A POLYCRYSTALLINE BODY IN A SHALLOW TRENCH ISOLATION REGION | 103 |
50 | Josephine B. Chang | US | Mahopac, NY | Oct 13, 2016 / 20160300762 - SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED GATE CONTACTS | 103 |
51 | Chuanjun Xia | US | Lawrenceville, NJ | Sep 15, 2022 / 20220293869 - ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES | 103 |
52 | Nobuharu Ohsawa | JP | Zama | Sep 01, 2022 / 20220278292 - LIGHT-EMITTING DEVICE, DISPLAY DEVICE, LIGHT-EMITTING APPARATUS, ELECTRONIC DEVICE, AND LIGHTING DEVICE | 102 |
53 | Hamza Yilmaz | US | Saratoga, CA | Feb 16, 2017 / 20170047431 - INTEGRATING ENHANCEMENT MODE DEPLETED ACCUMULATION/INVERSION CHANNEL DEVICES WITH MOSFETS | 101 |
54 | Anton Mauder | DE | Kolbermoor | Aug 18, 2022 / 20220262935 - VOLTAGE-CONTROLLED SWITCHING DEVICE WITH CHANNEL REGION | 101 |
55 | Jack T. Kavalieros | US | Portland, OR | Jun 30, 2022 / 20220208991 - STACKED THIN FILM TRANSISTORS WITH NANOWIRES | 101 |
56 | Chia-Shiung Tsai | TW | Hsin-Chu | Jul 28, 2022 / 20220238662 - METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES | 101 |
57 | Linda Pei Ee Chua | SG | Singapore | Apr 21, 2016 / 20160111410 - Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect | 100 |
58 | Shou-Shan Fan | CN | Beijing | Aug 18, 2022 / 20220260829 - METHOD FOR DESIGNING NONSYMMETRIC FREEFORM SURFACE OPTICAL SYSTEM | 100 |
59 | Lionel Chien Hui Tay | SG | Singapore | Apr 14, 2016 / 20160104681 - Semiconductor Device and Method of Forming Prefabricated Heat Spreader Frame with Embedded Semiconductor Die | 99 |
60 | Jing-Cheng Lin | TW | Hsin-Chu | Jun 22, 2017 / 20170179054 - Semiconductor Device Structure Comprising a Plurality of Metal Oxide Fibers and Method for Forming the Same | 97 |
61 | Leonard Forbes | US | Corvallis, OR | Sep 14, 2017 / 20170263671 - PROCESS MODULE FOR INCREASING THE RESPONSE OF BACKSIDE ILLUMINATED PHOTOSENSITIVE IMAGERS AND ASSOCIATED METHODS | 97 |
62 | Vijay Narayanan | US | New York, NY | Sep 17, 2020 / 20200295147 - GATE FIRST TECHNIQUE IN VERTICAL TRANSPORT FET USING DOPED SILICON GATES WITH SILICIDE | 95 |
63 | Seok-Hwan Hwang | KR | Yongin-City | Dec 17, 2015 / 20150364705 - AMINE-BASED COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME | 94 |
64 | Young-Kook Kim | KR | Yongin-City | Dec 17, 2015 / 20150364705 - AMINE-BASED COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME | 94 |
65 | Tenko Yamashita | US | Schenectady, NY | Jul 21, 2022 / 20220231021 - FIN TOP HARD MASK FORMATION AFTER WAFER FLIPPING PROCESS | 94 |
66 | Devendra K. Sadana | US | Pleasantville, NY | Jul 28, 2022 / 20220238663 - ION IMPLANT DEFINED NANOROD IN A SUSPENDED MAJORANA FERMION DEVICE | 94 |
67 | Henry Descalzo Bathan | SG | Singapore | Nov 13, 2014 / 20140332955 - Integrated Circuit Package System with Removable Backing Element Having Plated Terminal Leads and Method of Manufacture Thereof | 94 |
68 | Keith Kwong Hon Wong | US | Wappingers Falls, NY | Dec 27, 2018 / 20180374749 - MECHANICALLY STABLE COBALT CONTACTS | 93 |
69 | Ghavam G. Shahidi | US | Pound Ridge, NY | Oct 21, 2021 / 20210328679 - CHIP CARRIER INTEGRATING POWER HARVESTING AND REGULATION DIODES AND FABRICATION THEREOF | 91 |
70 | Ilyas Mohammed | US | Santa Clara, CA | Jan 06, 2022 / 20220005784 - LAYER STRUCTURES FOR MAKING DIRECT METAL-TO-METAL BONDS AT LOW TEMPERATURES IN MICROELECTRONICS | 91 |
71 | Hiroki Nakamura | JP | Tokyo | May 18, 2017 / 20170138234 - HOLDING MATERIAL, METHOD FOR PRODUCING SAME AND GAS TREATMENT DEVICE USING SAME | 90 |
72 | Panasonic Corporation | JP | Osaka | Aug 08, 2013 / 20130205057 - EXCLUSIVE CONTROL METHOD OF RESOURCE AND EXCLUSIVE CONTROLLER OF RESOURCE | 89 |
73 | Scott T. Becker | US | Scotts Valley, CA | Sep 17, 2020 / 20200295044 - Semiconductor Chip Including Integrated Circuit Having Cross-Coupled Transistor Configuration and Method for Manufacturing the Same | 89 |
74 | Willy Rachmady | US | Beaverton, OR | Sep 01, 2022 / 20220278227 - VERTICAL TUNNELING FIELD-EFFECT TRANSISTORS | 87 |
75 | Hye-Jin Jung | KR | Yongin-City | Dec 03, 2015 / 20150349265 - AMINE-BASED COMPOUND AND ORGANIC LIGHT- EMITTING DEVICE INCLUDING THE SAME | 87 |
76 | Jin-O Lim | KR | Yongin-City | Sep 10, 2015 / 20150255723 - COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME | 87 |
77 | Hajime Kimura | JP | Atsugi | Sep 15, 2022 / 20220293159 - SEMICONDUCTOR DEVICE | 86 |
78 | Kang Chen | SG | Singapore | Sep 15, 2022 / 20220289560 - Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package | 85 |
79 | David V. Horak | US | Essex Junction, VT | Jun 15, 2017 / 20170170266 - GATE CONTACT WITH VERTICAL ISOLATION FROM SOURCE-DRAIN | 85 |
80 | Gilbert Dewey | US | Hillsboro, OR | Jul 14, 2022 / 20220223519 - TOP GATE RECESSED CHANNEL CMOS THIN FILM TRANSISTOR IN THE BACK END OF LINE AND METHODS OF FABRICATION | 84 |
81 | Ming-Da Cheng | TW | Jhubei City | Nov 11, 2021 / 20210351139 - Semiconductor Device and Method of Forming Same | 84 |
82 | Marko Radosavljevic | US | Beaverton, OR | Jan 03, 2019 / 20190006171 - METHODS AND DEVICES INTEGRATING III-N TRANSISTOR CIRCUITRY WITH SI TRANSISTOR CIRCUITRY | 84 |
83 | Clement Hsingjen Wann | US | Carmel, NY | Aug 18, 2022 / 20220262924 - SEMICONDUCTOR DEVICE WITH REDUCED TRAP DEFECT AND METHOD OF FORMING THE SAME | 83 |
84 | Brian S. Doyle | US | Portland, OR | Aug 18, 2022 / 20220262860 - SELECTOR DEVICES | 82 |
85 | Michael Shur | US | Latham, NY | Jan 13, 2022 / 20220011363 - Terahertz Plasmonics for Testing Very Large-Scale Integrated Circuits under Bias | 81 |
86 | Masashi Tsubuku | JP | Atsugi | Nov 25, 2021 / 20210366944 - TRANSISTOR AND DISPLAY DEVICE | 81 |
87 | Stefan Flachowsky | DE | Dresden | Jul 13, 2017 / 20170200743 - SEMICONDUCTOR STRUCTURE INCLUDING A FIRST TRANSISTOR AND A SECOND TRANSISTOR | 80 |
88 | Michael A. Guillorn | US | Yorktown Heights, NY | Dec 29, 2016 / 20160379837 - DIRECTED SELF-ASSEMBLY | 80 |
89 | Wen-Chih Chiou | TW | Miaoli | Aug 13, 2015 / 20150228541 - METHODS OF MAKING INTEGRATED CIRCUITS INCLUDING CONDUCTIVE STRUCTURES THROUGH SUBSTRATES | 80 |
90 | Il Kwon Shim | SG | Singapore | Aug 25, 2022 / 20220270942 - FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE MECHANICAL STABILITY AND HEAT DISSIPATION | 80 |
91 | Thomas N. Adam | US | Slingerlands, NY | Jun 09, 2016 / 20160163879 - SEMICONDUCTOR DEVICE INCLUDING EMBEDDED CRYSTALLINE BACK-GATE BIAS PLANES, RELATED DESIGN STRUCTURE AND METHOD OF FABRICATION | 79 |
92 | Shom Ponoth | US | Clifton Park, NY | Nov 26, 2015 / 20150340288 - FINFET WITH DIELECTRIC ISOLATION BY SILICON-ON-NOTHING AND METHOD OF FABRICATION | 78 |
93 | Jun Liu | US | Boise, ID | Aug 25, 2022 / 20220271224 - RESISTIVE MEMORY ARCHITECTURES WITH MULTIPLE MEMORY CELLS PER ACCESS DEVICE | 78 |
94 | Samsung Electronics Co., Ltd. | KR | Suwon-Si | Sep 08, 2022 / 20220283968 - METHOD OF SYNCHRONIZING TIME BETWEEN HOST DEVICE AND STORAGE DEVICE AND SYSTEM PERFORMING THE SAME | 78 |
95 | Remigijus Gaska | US | Columbia, SC | Apr 19, 2018 / 20180108806 - Patterned Layer Design for Group III Nitride Layer Growth | 78 |
96 | Daesik Choi | KR | Seoul | Dec 10, 2015 / 20150357274 - Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV | 78 |
97 | Takeyoshi Masuda | JP | Osaka-Shi | Jun 15, 2017 / 20170170281 - METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE AND SILICON CARBIDE SEMICONDUCTOR DEVICE | 77 |
98 | Ali Khakifirooz | US | Los Altos, CA | Jan 03, 2019 / 20190006016 - METHOD, SYSTEM, AND APPARATUS FOR DETECTING FAILURE OF PROGRAMMING OF A MEMORY DEVICE | 77 |
99 | Chung-Shi Liu | TW | Hsin-Chu | Jun 01, 2017 / 20170154862 - Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof | 77 |
100 | Rui Huang | SG | Singapore | Apr 14, 2016 / 20160104731 - Semiconductor Device and Method of Forming EWLB Semiconductor Package with Vertical Interconnect Structure and Cavity Region | 76 |