Top Inventors for class "Abrading" |
Rank | Inventor's name | Country | City/State | Last publication | # of patent apps in this class |
1 | Boguslaw A. Swedek | US | Cupertino, CA | Jan 13, 2022 / 20220009053 - MULTI-TOOTHED, MAGNETICALLY CONTROLLED RETAINING RING | 50 |
2 | Hung Chih Chen | US | Sunnyvale, CA | Mar 24, 2016 / 20160082571 - INNER RETAINING RING AND OUTER RETAINING RING FOR CARRIER HEAD | 44 |
3 | Jeffrey Drue David | US | San Jose, CA | Mar 10, 2022 / 20220077006 - ENDPOINT DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY | 42 |
4 | Dominic J. Benvegnu | US | La Honda, CA | Sep 08, 2022 / 20220285227 - PIXEL CLASSIFICATION OF FILM NON-UNIFORMITY BASED ON PROCESSING OF SUBSTRATE IMAGES | 38 |
5 | Chien-Min Sung | TW | Tansui | Oct 07, 2021 / 20210308827 - CMP PAD DRESSERS WITH HYBRIDIZED ABRASIVE SURFACE AND RELATED METHODS | 36 |
6 | Harry Q. Lee | US | Los Altos, CA | Dec 09, 2021 / 20210379724 - SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING LAYER DURING POLISHING | 34 |
7 | Tetsuji Togawa | JP | Tokyo | Jan 06, 2022 / 20220005716 - SUBSTRATE TRANSPORTER AND SUBSTRATE PROCESSING APPARATUS INCLUDING SUBSTRATE TRANSPORTER | 29 |
8 | Rajeev Bajaj | US | Fremont, CA | Aug 11, 2022 / 20220250203 - STRUCTURES FORMED USING AN ADDITIVE MANUFACTURING PROCESS FOR REGENERATING SURFACE TEXTURE IN SITU | 24 |
9 | Makoto Fukushima | JP | Tokyo | Oct 28, 2021 / 20210335650 - ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS | 24 |
10 | Osamu Nabeya | JP | Tokyo | Oct 28, 2021 / 20210335650 - ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS | 24 |
11 | Masaya Seki | JP | Tokyo | Aug 25, 2022 / 20220267921 - PLATING APPARATUS AND PLATING METHOD | 24 |
12 | Thomas H. Osterheld | US | Mountain View, CA | Sep 08, 2022 / 20220283554 - CONTROL OF PROCESSING PARAMETERS FOR SUBSTRATE POLISHING WITH SUBSTRATE PRECESSION | 23 |
13 | Diane Scott | US | Portland, OR | May 26, 2016 / 20160144477 - COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING | 22 |
14 | Wayne O. Duescher | US | Roseville, MN | May 12, 2016 / 20160129547 - VACUUM-GROOVED MEMBRANE WAFER POLISHING WORKHOLDER | 22 |
15 | Cornelius Boeck | DE | Kirchheim | Dec 29, 2016 / 20160375570 - Machine Tool Device | 22 |
16 | Hozumi Yasuda | JP | Tokyo | Sep 14, 2017 / 20170259395 - POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE | 22 |
17 | Jimin Zhang | US | San Jose, CA | Jul 28, 2022 / 20220234163 - CHEMICAL MECHANICAL POLISHING USING TIME SHARE CONTROL | 22 |
18 | Kenya Ito | JP | Tokyo | Feb 25, 2016 / 20160052107 - POLISHING METHOD | 21 |
19 | Srinivasan Ramanath | US | Holden, MA | May 12, 2016 / 20160129553 - BONDED ABRASIVE ARTICLE AND METHOD OF FORMING | 19 |
20 | Juergen Schwandner | DE | Garching | Dec 18, 2014 / 20140370786 - METHOD FOR THE DOUBLE-SIDE POLISHING OF A SEMICONDUCTOR WAFER | 19 |
21 | Wen-Chiang Tu | US | Mountain View, CA | Jun 01, 2017 / 20170151647 - ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS IN CHEMICAL MECHANICAL POLISHING | 19 |
22 | Paul D. Butterfield | US | San Jose, CA | Sep 08, 2022 / 20220282807 - INSULATED FLUID LINES IN CHEMICAL MECHANICAL POLISHING | 18 |
23 | Shou-Sung Chang | US | Stanford, CA | Oct 25, 2012 / 20120270477 - MEASUREMENT OF PAD THICKNESS AND CONTROL OF CONDITIONING | 18 |
24 | Steven M. Zuniga | US | Soquel, CA | Sep 22, 2022 / 20220297258 - SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS | 18 |
25 | Masayuki Nakanishi | JP | Tokyo | Feb 25, 2016 / 20160052107 - POLISHING METHOD | 18 |
26 | William C. Allison | US | Beaverton, OR | Jan 28, 2016 / 20160023322 - POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN | 17 |
27 | Gregory E. Menk | US | Pleasanton, CA | Apr 28, 2016 / 20160114458 - POLISHING PADS PRODUCED BY AN ADDITIVE MANUFACTURING PROCESS | 17 |
28 | Zine-Eddine Boutaghou | US | North Oaks, MN | Nov 07, 2013 / 20130295821 - ABRASIVE ARTICLE WITH REPLICATED MICROSTRUCTURED BACKING AND METHOD OF USING SAME | 17 |
29 | Sen-Hou Ko | US | Sunnyvale, CA | Dec 11, 2014 / 20140360976 - APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING | 17 |
30 | Gunter Schneider | DE | Marburg | Oct 14, 2021 / 20210316414 - APPARATUS AND METHOD FOR LENS PROCESSING AND PROCESSING DEVICE AND MEASURING DEVICE FOR LENSES | 16 |
31 | Keiji Mase | JP | Tokyo | Jan 28, 2016 / 20160023325 - SCRIBING METHOD AND BLASTING MACHINE FOR SCRIBING | 16 |
32 | Doyle E. Bennett | US | Santa Clara, CA | Dec 09, 2021 / 20210379723 - COMPENSATION FOR SUBSTRATE DOPING IN EDGE RECONSTRUCTION FOR IN-SITU ELECTROMAGNETIC INDUCTIVE MONITORING | 16 |
33 | Yoichi Kobayashi | JP | Tokyo | Nov 19, 2015 / 20150332943 - POLISHING APPARATUS | 16 |
34 | Tamami Takahashi | JP | Tokyo | Feb 25, 2016 / 20160051933 - SEAWATER DESALINATION SYSTEM AND ENERGY RECOVERY APPARATUS | 15 |
35 | I-Peng Yao | TW | Kaohsiung | Apr 19, 2012 / 20120094584 - SHEET FOR MOUNTING A WORKPIECE AND METHOD FOR MAKING THE SAME | 15 |
36 | Chung-Chih Feng | TW | Kaohsiung | Apr 19, 2012 / 20120094584 - SHEET FOR MOUNTING A WORKPIECE AND METHOD FOR MAKING THE SAME | 15 |
37 | Joachim Schadow | DE | Stuttgart | Jul 01, 2021 / 20210201705 - Sealing Device for Sealing at least one Storage and/or Packaging Device for Durable Goods, particularly Machine Tools, and/or for Sealing at least one Piece of Information | 15 |
38 | Gary C. Ettinger | US | Cupertino, CA | Dec 05, 2013 / 20130325032 - SURGICAL INSTRUMENT MANIPULATOR ASPECTS | 15 |
39 | Hiroyuki Shinozaki | JP | Tokyo | Aug 18, 2022 / 20220258248 - AM APPARATUS | 15 |
40 | Jun Qian | US | Sunnyvale, CA | Aug 25, 2022 / 20220270889 - IMAGING FOR MONITORING THICKNESS IN A SUBSTRATE CLEANING SYSTEM | 15 |
41 | Lakshmanan Karuppiah | US | San Jose, CA | Dec 11, 2014 / 20140360976 - APPARATUS AND METHODS FOR BRUSH AND PAD CONDITIONING | 14 |
42 | Yung-Chang Hung | TW | Kaohsiung | Sep 15, 2011 / 20110223844 - POLISHING PAD AND METHOD FOR MAKING THE SAME | 13 |
43 | Florian Esenwein | DE | Leinfelden-Echterdingen | Sep 22, 2022 / 20220297252 - Machine Tool Device | 13 |
44 | Sivakumar Dhandapani | US | San Jose, CA | Sep 08, 2022 / 20220281056 - CONTROL OF PROCESSING PARAMETERS DURING SUBSTRATE POLISHING USING EXPECTED FUTURE PARAMETER CHANGES | 12 |
45 | Georg Pietsch | DE | Burghausen | Jul 28, 2022 / 20220234250 - METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING A NUMBER OF SEPARATING PROCESSES BY MEANS OF A WIRE SAW, AND SEMICONDUCTOR WAFER MADE OF MONOCRYSTALLINE SILICON | 12 |
46 | Shao-Kai Pei | TW | Tu-Cheng | Jan 02, 2014 / 20140002429 - SYSTEM AND METHOD FOR SETTING BACKGROUND IMAGE OF DISPLAY MODULE | 12 |
47 | Joerg Maute | DE | Sindelfingen | Dec 29, 2016 / 20160375570 - Machine Tool Device | 12 |
48 | John G. Petersen | US | Center City, MN | Feb 16, 2017 / 20170043450 - FLEXIBLE ABRASIVE ARTICLE AND METHOD OF USING THE SAME | 11 |
49 | Alpay Yilmaz | US | San Jose, CA | Aug 18, 2022 / 20220262653 - MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROCESS MODULES OR CHAMBERS | 11 |
50 | Robert Kerprich | US | Portland, OR | Jan 28, 2016 / 20160023321 - GROOVED CMP PADS | 11 |
51 | Hakan Thysell | SE | Soderkoping | Aug 25, 2011 / 20110207383 - METHODS AND TOOL FOR MAINTENANCE OF HARD SURFACES, AND A METHOD FOR MANUFACTURING SUCH A TOOL | 11 |
52 | Tadakazu Sone | JP | Tokyo | Dec 17, 2015 / 20150364391 - POLISHING APPARATUS AND WEAR DETECTION METHOD | 11 |
53 | Michael Kerstan | DE | Burghausen | Jun 19, 2014 / 20140170942 - METHOD AND APPARATUS FOR TRIMMING THE WORKING LAYERS OF A DOUBLE-SIDE GRINDING APPARATUS | 11 |
54 | Sinisa Andrasic | DE | Schoenaich | Apr 16, 2020 / 20200114490 - Protective Device for a Hand-Held Power Tool | 11 |
55 | Zhihong Wang | US | Santa Clara, CA | Jun 01, 2017 / 20170151647 - ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS IN CHEMICAL MECHANICAL POLISHING | 11 |
56 | David B. James | US | Newark, DE | Oct 01, 2015 / 20150273652 - CHEMICAL MECHANICAL POLISHING PAD WITH POLISHING LAYER AND WINDOW | 11 |
57 | Ingemar Carlsson | US | Milpitas, CA | Jun 01, 2017 / 20170151647 - ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS IN CHEMICAL MECHANICAL POLISHING | 11 |
58 | Samuel Chu-Chiang Hsu | US | Palo Alto, CA | Apr 16, 2020 / 20200114489 - Retaining Ring Having Inner Surfaces with Features | 10 |
59 | Hiroaki Kusa | JP | Tokyo | Dec 10, 2015 / 20150352682 - POLISHING APPARATUS | 10 |
60 | Ryuichi Kosuge | JP | Tokyo | May 26, 2016 / 20160144478 - APPARATUS FOR CLEANING A POLISHING SURFACE, POLISHING APPARATUS, AND METHOD OF MANUFACTURING AN APPARATUS FOR CLEANING A POLISHING SURFACE | 10 |
61 | Antoine P. Manens | US | Sunnyvale, CA | Oct 20, 2011 / 20110253685 - LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE | 10 |
62 | Ara Philipossian | US | Tucson, AZ | Jan 09, 2014 / 20140011432 - METHOD AND DEVICE FOR THE INJECTION OF CMP SLURRY | 10 |
63 | Richard S. Smith | US | Hot Springs, AR | Nov 12, 2015 / 20150321320 - Two Step Abrasive Sharpener | 10 |
64 | Stan D. Tsai | US | Fremont, CA | May 16, 2013 / 20130122783 - PAD CONDITIONING FORCE MODELING TO ACHIEVE CONSTANT REMOVAL RATE | 10 |
65 | Manfred Lutz | DE | Filderstadt | Aug 04, 2022 / 20220243769 - Hand-Held Power Tool | 10 |
66 | Wei-Yung Hsu | US | Santa Clara, CA | May 17, 2012 / 20120118225 - EPITAXIAL GROWTH TEMPERATURE CONTROL IN LED MANUFACTURE | 10 |
67 | Benjamin Cherian | US | San Jose, CA | Sep 08, 2022 / 20220284561 - DETECTING AN EXCURSION OF A CMP COMPONENT USING TIME-BASED SEQUENCE OF IMAGES AND MACHINE LEARNING | 10 |
68 | Manoocher Birang | US | Los Gatos, CA | Dec 02, 2021 / 20210369217 - Imaging Systems and Methods for Image-Guided Radiosurgery | 10 |
69 | Taro Takahashi | JP | Tokyo | Aug 25, 2022 / 20220266418 - SUBSTRATE PROCESSING APPARATUS | 10 |
70 | Masaki Takeuchi | JP | Joetsu-Shi | Dec 09, 2021 / 20210382386 - Mask Blank Glass Substrate | 10 |
71 | Daniel Barth | DE | Leinfelden-Echterdingen | Dec 29, 2016 / 20160375570 - Machine Tool Device | 10 |
72 | Oscar K. Hsu | US | Chelmsford, MA | Feb 26, 2015 / 20150056894 - POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE | 9 |
73 | Daniel T. Dovel | US | Shady Cove, OR | Dec 03, 2015 / 20150343591 - Tool Sharpener with Adjustable Support Guide | 9 |
74 | Stephen Jew | US | San Jose, CA | Oct 28, 2021 / 20210331288 - SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING | 9 |
75 | Gautam Shashank Dandavate | US | Sunnyvale, CA | Apr 16, 2020 / 20200114489 - Retaining Ring Having Inner Surfaces with Features | 9 |
76 | Allen L. D'Ambra | US | Burlingame, CA | Dec 30, 2021 / 20210402565 - CLEANING SYSTEM FOR POLISHING LIQUID DELIVERY ARM | 9 |
77 | Florian Esenwein | DE | Uhingen-Holzhausen | Aug 15, 2013 / 20130205604 - Shaft Bearing Device for a Hand-Held Power Tool | 9 |
78 | Katsuhide Watanabe | JP | Tokyo | Aug 25, 2022 / 20220266418 - SUBSTRATE PROCESSING APPARATUS | 9 |
79 | Zhenhua Zhang | US | San Jose, CA | Nov 27, 2008 / 20080293344 - METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD | 9 |
80 | Toshifumi Kimba | JP | Tokyo | Nov 18, 2021 / 20210354262 - FILM THICKNESS MEASUREMENT APPARATUS, POLISHING APPARATUS, AND FILM THICKNESS MEASUREMENT METHOD | 9 |
81 | Stacy Meyer | US | San Jose, CA | May 19, 2016 / 20160136780 - Using A Carrier Head With Shims | 9 |
82 | Hisanori Matsuo | JP | Tokyo | Nov 11, 2021 / 20210347010 - APPARATUS FOR POLISHING AND METHOD OF POLISHING | 9 |
83 | Heiko Roehm | DE | Stuttgart | Dec 16, 2021 / 20210390842 - Hand-Held Power Tool | 9 |
84 | Charles C. Garretson | US | Sunnyvale, CA | May 05, 2016 / 20160121453 - METHODS AND APPARATUS FOR PROFILE AND SURFACE PREPARATION OF RETAINING RINGS UTILIZED IN CHEMICAL MECHANICAL POLISHING PROCESSES | 9 |
85 | Marty W. Degroot | US | Middletown, DE | Aug 25, 2022 / 20220266416 - CHEMICAL MECHANICAL POLISHING PAD | 9 |
86 | Bach Pangho Chen | US | Claremont, CA | Mar 10, 2022 / 20220072676 - ELECTRIC GRINDING MACHINE TOOL | 9 |
87 | David Adam Wells | US | Hudson, NH | Feb 26, 2015 / 20150056894 - POLISHING PAD HAVING MICRO-GROOVES ON THE PAD SURFACE | 9 |
88 | Yoshikoto Yanase | JP | Minato-Ku | Jul 17, 2014 / 20140199921 - METHOD FOR MANUFACTURING SCREW-SHAPED TOOL | 9 |
89 | Gregory P. Muldowney | US | Earleville, MD | Jun 24, 2010 / 20100159811 - High-rate groove pattern | 9 |
90 | Satoru Yamaki | JP | Tokyo | Oct 28, 2021 / 20210335650 - ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS | 8 |
91 | Young J. Paik | US | Campbell, CA | May 19, 2016 / 20160136780 - Using A Carrier Head With Shims | 8 |
92 | Allen J. Rivard | US | White Bear Lake, MN | Feb 09, 2012 / 20120034853 - METHOD, SYSTEM, AND APPARATUS FOR MODIFYING SURFACES | 8 |
93 | Alexander William Simpson | US | Hillsboro, OR | Jan 28, 2016 / 20160023322 - POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN | 8 |
94 | Arup K. Khaund | US | Northborough, MA | Dec 29, 2016 / 20160375514 - ABRASIVE ARTICLE AND METHOD OF FORMING | 8 |
95 | Sudhanshu Misra | US | San Jose, CA | Jan 28, 2016 / 20160023321 - GROOVED CMP PADS | 8 |
96 | Jagan Rangarajan | US | Fremont, CA | Dec 30, 2021 / 20210405665 - ETHERCAT LIQUID FLOW CONTROLLER COMMUNICATION FOR SUBSTRATE PROCESSING SYSTEMS | 8 |
97 | Toru Maruyama | JP | Tokyo | Jul 07, 2022 / 20220212312 - TEMPERATURE REGULATING APPARATUS AND POLISHING APPARATUS | 8 |
98 | Jeonghoon Oh | US | San Jose, CA | Apr 16, 2020 / 20200114487 - POLISHING SYSTEM WITH SUPPORT POST AND ANNULAR PLATEN OR POLISHING PAD | 8 |
99 | Richard Frentzel | US | Murrieta, CA | Dec 03, 2015 / 20150343595 - SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | 8 |
100 | Mary Jo Kulp | US | Newark, DE | Mar 05, 2015 / 20150059254 - POLYURETHANE POLISHING PAD | 8 |